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BD62210AEFV-E2

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ROHM Semicon Motor Driver ICs, HTSSOP-28-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management icsbd62210aefv-e2factory-2.0.0extractor-text

Verified BD62210AEFV-E2

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 29 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: BD62210AEFV-E2 · HTSSOP-28-EP · 29 pins
  • ✓copper: 29 copper pads, none touching another net
  • ✓datasheet: all 29 pin names found in the 24-page datasheet
  • ✓distributor: lcsc C2150502, digikey BD62210AEFV-E2TR-ND, mouser 755-BD62210AEFV-E2
  • ✓family: TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-r2nbzuqt/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 29 pins = 29 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 29 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ bd62210aefv-e2.kicad_sym✓ bd62210aefv-e2.kicad_mod✓ bd62210aefv-e2.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 8d ago
viewers bd62210aefv-e2: viewers · Ray 8d ago
bd62210aefv-e2-etched.glb Publish 0.1.0 · Ray 8d ago
bd62210aefv-e2-etched.step bd62210aefv-e2: factory component page (tier=mfr) · Ray 8d ago
bd62210aefv-e2-hero.glb bd62210aefv-e2: hero GLB from the etched model (keeps the MPN mark) · Ray 8d ago
bd62210aefv-e2-hero.overlay.json Publish 0.1.0 · Ray 8d ago
bd62210aefv-e2.glb Publish 0.1.0 · Ray 8d ago
bd62210aefv-e2.kicad_mod Publish 0.1.0 · Ray 8d ago
bd62210aefv-e2.kicad_sym Publish 0.1.0 · Ray 8d ago
bd62210aefv-e2.lbr Publish 0.1.0 · Ray 8d ago
bd62210aefv-e2.step Publish 0.1.0 · Ray 8d ago
package.json Publish 0.1.0 · Ray 8d ago
page.json Set visibility: public · Ray 8d ago
README.md Publish 0.1.0 · Ray 8d ago
verification.json Verified: Published by the parts factory: tier mfr, 29 pins · Ray 8d ago

BD62210AEFV-E2

ROHM Semicon · Motor Driver ICs · HTSSOP-28-EP

BD62210AEFV-E2 from ROHM Semicon, in a HTSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground terminal; no pin may be at a voltage below this ground pin at any time, even during transient conditions.
2 OUT1B output H-bridge output terminal for channel 1 (OUT1B); it carries motor drive current, so the trace should be thick, short and low impedance.
3 RNF1 passive Connection terminal of the output current detection resistor for channel 1; use a 0.1Ω to 0.3Ω resistor to GND and keep RNF below the 0.7 V maximum.
4 RNF1S input Input terminal of the channel 1 current limit comparator; connect it to RNF1 when using PWM constant current control.
5 OUT1A output H-bridge output terminal for channel 1 (OUT1A); it carries motor drive current, so the trace should be thick, short and low impedance.
6 NC unconnected No connection; electrically unconnected to the internal circuit.
7 VCC1 power_in Power supply terminal; VCC1 and VCC2 must be shorted externally, with a recommended supply of 8 to 28 V and an absolute maximum of 36 V.
8 NC unconnected No connection; electrically unconnected to the internal circuit.
9 GND power_in Ground terminal; connect with low impedance so that it stays at the lowest potential in all operating states.
10 CR passive Connection terminal of the CR network that sets the switching frequency; connect an external C of 330pF to 680pF and R of 10kΩ to 150kΩ between CR and GND.
11 VREF1 input Current limit value setting terminal for channel 1; the VREF input range is 0 to 2.0 V and it must not be left open.
12 VREF2 input Current limit value setting terminal for channel 2; the VREF input range is 0 to 2.0 V and it must not be left open.
13 PS input Power save terminal; L puts the IC in standby with the motor outputs open, H is active, and there is a delay of 40 µs max when returning from OFF to normal.
14 TEST1 passive Test terminal used at distribution test; it must be connected to GND.
15 FAILA output Open-drain fault output that goes low on over-current protection or thermal shutdown; use a 5kΩ to 100kΩ pull-up to a supply below 7 V, or connect to GND if unused.
16 IN1A input H-bridge control input for channel 1 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max.
17 IN1B input H-bridge control input for channel 1 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max.
18 TEST2 passive Test terminal used at distribution test; it must be connected to GND.
19 IN2A input H-bridge control input for channel 2 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max.
20 IN2B input H-bridge control input for channel 2 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max.
21 NC unconnected No connection; electrically unconnected to the internal circuit.
22 VCC2 power_in Power supply terminal; VCC1 and VCC2 must be shorted externally, with a recommended supply of 8 to 28 V and an absolute maximum of 36 V.
23 NC unconnected No connection; electrically unconnected to the internal circuit.
24 OUT2A output H-bridge output terminal for channel 2 (OUT2A); it carries motor drive current, so the trace should be thick, short and low impedance.
25 RNF2S input Input terminal of the channel 2 current limit comparator; connect it to RNF2 when using PWM constant current control.
26 RNF2 passive Connection terminal of the output current detection resistor for channel 2; use a 0.1Ω to 0.3Ω resistor to GND and keep RNF below the 0.7 V maximum.
27 OUT2B output H-bridge output terminal for channel 2 (OUT2B); it carries motor drive current, so the trace should be thick, short and low impedance.
28 NC unconnected No connection; electrically unconnected to the internal circuit.
29 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package HTSSOP-28-EP
Category Power Management ICs
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC1,2 8 28 V 3
Maximum Output Current (Continuous) IOUT 0.7 A/ch Note 5: do not exceed Pd, ASO and Tjmax=150°C 3
Supply Voltage VCC1,2 -0.2 36 V 3
Input Voltage for Control Pin VIN -0.2 5.5 V 3
RNF Maximum Voltage VRNF 0.7 V 3
Output Current IOUT 1 A/ch Note 3: do not exceed Pd, ASO and Tjmax=150°C 3
Output Current (peak) IOUTPEAK 1.5 A/ch Note 4: pulse width tw ≤1ms, duty 20ms 3
Power Dissipation Pd 1.45 W Note 1: 70mm×70mm×1.6mm glass epoxy board; derate 11.6mW/°C above Ta=25°C 3
Power Dissipation Pd 4.7 W Note 2: 4-layer recommended board; derate 37.6mW/°C above Ta=25°C 3
Operating Temperature Range Topr -25 85 °C 3
Storage Temperature Range Tstg -55 150 °C 3
Circuit Current at Standby ICCST 10 µA PS=L 4
Circuit Current ICC 2.5 5 mA PS=H, VREFx=2V 4
H Level Input Voltage VIN2H 2 V 4
L Level Input Voltage VIN2L 0.8 V 4
H Level Input Current IIN2H 35 50 100 µA VIN2=5V 4
L Level Input Current IIN2L -10 0 µA VIN2=0V 4
Output ON-Resistance RON 1.9 2.5 Ω IOUT =±1.0A (Sum of upper and lower) 4
Output Leak Current ILEAK 10 µA 4
RNFX Input Current IRNF -80 -40 µA RNFx=0V 4
VREFx Input Current IVREF -2 -0.1 µA VREFx=0V 4
VREFx Input Voltage Range VVREF 0 2 V 4
Minimum on Time (Blank Time) tONMIN 0.7 1.5 3 µs 4
Current Limit Comparator Threshold VCTH 0.23 0.25 0.27 V VREFx=2V 4
Thermal Resistance Junction-to-Ambient (Board 1) θja 86.2 °C/W Board ①: 1-layer board (copper foil on back 0mm) 18
Thermal Resistance Junction-to-Ambient (Board 2) θja 67.6 °C/W Board ②: 2-layer board (copper foil on back 15mm*15mm) 18
Thermal Resistance Junction-to-Ambient (Board 3) θja 37.9 °C/W Board ③: 2-layer board (copper foil on back 70mm*70mm) 18
Thermal Resistance Junction-to-Ambient (Board 4) θja 26.6 °C/W Board ④: 4-layer board (copper foil on back 70mm*70mm) 18

CAD (KiCad official)

  • Symbol: BD62210AEFV-E2
  • Footprint: Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
  • 3D model: HTSSOP-28-EP (KiCad packages3D, STEP)
  • 3D model files: bd62210aefv-e2-etched.step / bd62210aefv-e2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bd62210aefv-e2.step / bd62210aefv-e2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (24 pp, sha256 d5a279f9242e4c6a, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF