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BD62210AEFV-E2
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ROHM Semicon Motor Driver ICs, HTSSOP-28-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BD62210AEFV-E2
ROHM Semicon · Motor Driver ICs · HTSSOP-28-EP
BD62210AEFV-E2 from ROHM Semicon, in a HTSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground terminal; no pin may be at a voltage below this ground pin at any time, even during transient conditions. |
| 2 | OUT1B | output | H-bridge output terminal for channel 1 (OUT1B); it carries motor drive current, so the trace should be thick, short and low impedance. |
| 3 | RNF1 | passive | Connection terminal of the output current detection resistor for channel 1; use a 0.1Ω to 0.3Ω resistor to GND and keep RNF below the 0.7 V maximum. |
| 4 | RNF1S | input | Input terminal of the channel 1 current limit comparator; connect it to RNF1 when using PWM constant current control. |
| 5 | OUT1A | output | H-bridge output terminal for channel 1 (OUT1A); it carries motor drive current, so the trace should be thick, short and low impedance. |
| 6 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 7 | VCC1 | power_in | Power supply terminal; VCC1 and VCC2 must be shorted externally, with a recommended supply of 8 to 28 V and an absolute maximum of 36 V. |
| 8 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 9 | GND | power_in | Ground terminal; connect with low impedance so that it stays at the lowest potential in all operating states. |
| 10 | CR | passive | Connection terminal of the CR network that sets the switching frequency; connect an external C of 330pF to 680pF and R of 10kΩ to 150kΩ between CR and GND. |
| 11 | VREF1 | input | Current limit value setting terminal for channel 1; the VREF input range is 0 to 2.0 V and it must not be left open. |
| 12 | VREF2 | input | Current limit value setting terminal for channel 2; the VREF input range is 0 to 2.0 V and it must not be left open. |
| 13 | PS | input | Power save terminal; L puts the IC in standby with the motor outputs open, H is active, and there is a delay of 40 µs max when returning from OFF to normal. |
| 14 | TEST1 | passive | Test terminal used at distribution test; it must be connected to GND. |
| 15 | FAILA | output | Open-drain fault output that goes low on over-current protection or thermal shutdown; use a 5kΩ to 100kΩ pull-up to a supply below 7 V, or connect to GND if unused. |
| 16 | IN1A | input | H-bridge control input for channel 1 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max. |
| 17 | IN1B | input | H-bridge control input for channel 1 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max. |
| 18 | TEST2 | passive | Test terminal used at distribution test; it must be connected to GND. |
| 19 | IN2A | input | H-bridge control input for channel 2 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max. |
| 20 | IN2B | input | H-bridge control input for channel 2 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max. |
| 21 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 22 | VCC2 | power_in | Power supply terminal; VCC1 and VCC2 must be shorted externally, with a recommended supply of 8 to 28 V and an absolute maximum of 36 V. |
| 23 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 24 | OUT2A | output | H-bridge output terminal for channel 2 (OUT2A); it carries motor drive current, so the trace should be thick, short and low impedance. |
| 25 | RNF2S | input | Input terminal of the channel 2 current limit comparator; connect it to RNF2 when using PWM constant current control. |
| 26 | RNF2 | passive | Connection terminal of the output current detection resistor for channel 2; use a 0.1Ω to 0.3Ω resistor to GND and keep RNF below the 0.7 V maximum. |
| 27 | OUT2B | output | H-bridge output terminal for channel 2 (OUT2B); it carries motor drive current, so the trace should be thick, short and low impedance. |
| 28 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 29 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | HTSSOP-28-EP |
| Category | Power Management ICs |
| Pins | 29 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC1,2 | 8 | 28 | V | 3 | ||
| Maximum Output Current (Continuous) | IOUT | 0.7 | A/ch | Note 5: do not exceed Pd, ASO and Tjmax=150°C | 3 | ||
| Supply Voltage | VCC1,2 | -0.2 | 36 | V | 3 | ||
| Input Voltage for Control Pin | VIN | -0.2 | 5.5 | V | 3 | ||
| RNF Maximum Voltage | VRNF | 0.7 | V | 3 | |||
| Output Current | IOUT | 1 | A/ch | Note 3: do not exceed Pd, ASO and Tjmax=150°C | 3 | ||
| Output Current (peak) | IOUTPEAK | 1.5 | A/ch | Note 4: pulse width tw ≤1ms, duty 20ms | 3 | ||
| Power Dissipation | Pd | 1.45 | W | Note 1: 70mm×70mm×1.6mm glass epoxy board; derate 11.6mW/°C above Ta=25°C | 3 | ||
| Power Dissipation | Pd | 4.7 | W | Note 2: 4-layer recommended board; derate 37.6mW/°C above Ta=25°C | 3 | ||
| Operating Temperature Range | Topr | -25 | 85 | °C | 3 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 3 | ||
| Circuit Current at Standby | ICCST | 10 | µA | PS=L | 4 | ||
| Circuit Current | ICC | 2.5 | 5 | mA | PS=H, VREFx=2V | 4 | |
| H Level Input Voltage | VIN2H | 2 | V | 4 | |||
| L Level Input Voltage | VIN2L | 0.8 | V | 4 | |||
| H Level Input Current | IIN2H | 35 | 50 | 100 | µA | VIN2=5V | 4 |
| L Level Input Current | IIN2L | -10 | 0 | µA | VIN2=0V | 4 | |
| Output ON-Resistance | RON | 1.9 | 2.5 | Ω | IOUT =±1.0A (Sum of upper and lower) | 4 | |
| Output Leak Current | ILEAK | 10 | µA | 4 | |||
| RNFX Input Current | IRNF | -80 | -40 | µA | RNFx=0V | 4 | |
| VREFx Input Current | IVREF | -2 | -0.1 | µA | VREFx=0V | 4 | |
| VREFx Input Voltage Range | VVREF | 0 | 2 | V | 4 | ||
| Minimum on Time (Blank Time) | tONMIN | 0.7 | 1.5 | 3 | µs | 4 | |
| Current Limit Comparator Threshold | VCTH | 0.23 | 0.25 | 0.27 | V | VREFx=2V | 4 |
| Thermal Resistance Junction-to-Ambient (Board 1) | θja | 86.2 | °C/W | Board ①: 1-layer board (copper foil on back 0mm) | 18 | ||
| Thermal Resistance Junction-to-Ambient (Board 2) | θja | 67.6 | °C/W | Board ②: 2-layer board (copper foil on back 15mm*15mm) | 18 | ||
| Thermal Resistance Junction-to-Ambient (Board 3) | θja | 37.9 | °C/W | Board ③: 2-layer board (copper foil on back 70mm*70mm) | 18 | ||
| Thermal Resistance Junction-to-Ambient (Board 4) | θja | 26.6 | °C/W | Board ④: 4-layer board (copper foil on back 70mm*70mm) | 18 |
CAD (KiCad official)
- Symbol:
BD62210AEFV-E2 - Footprint:
Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm - 3D model: HTSSOP-28-EP (KiCad packages3D, STEP)
- 3D model files:
bd62210aefv-e2-etched.step/bd62210aefv-e2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bd62210aefv-e2.step/bd62210aefv-e2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (24 pp, sha256
d5a279f9242e4c6a, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BD62210AEFV-E2
**ROHM Semicon** · Motor Driver ICs · HTSSOP-28-EP
BD62210AEFV-E2 from ROHM Semicon, in a HTSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground terminal; no pin may be at a voltage below this ground pin at any time, even during transient conditions. |
| 2 | OUT1B | output | H-bridge output terminal for channel 1 (OUT1B); it carries motor drive current, so the trace should be thick, short and low impedance. |
| 3 | RNF1 | passive | Connection terminal of the output current detection resistor for channel 1; use a 0.1Ω to 0.3Ω resistor to GND and keep RNF below the 0.7 V maximum. |
| 4 | RNF1S | input | Input terminal of the channel 1 current limit comparator; connect it to RNF1 when using PWM constant current control. |
| 5 | OUT1A | output | H-bridge output terminal for channel 1 (OUT1A); it carries motor drive current, so the trace should be thick, short and low impedance. |
| 6 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 7 | VCC1 | power_in | Power supply terminal; VCC1 and VCC2 must be shorted externally, with a recommended supply of 8 to 28 V and an absolute maximum of 36 V. |
| 8 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 9 | GND | power_in | Ground terminal; connect with low impedance so that it stays at the lowest potential in all operating states. |
| 10 | CR | passive | Connection terminal of the CR network that sets the switching frequency; connect an external C of 330pF to 680pF and R of 10kΩ to 150kΩ between CR and GND. |
| 11 | VREF1 | input | Current limit value setting terminal for channel 1; the VREF input range is 0 to 2.0 V and it must not be left open. |
| 12 | VREF2 | input | Current limit value setting terminal for channel 2; the VREF input range is 0 to 2.0 V and it must not be left open. |
| 13 | PS | input | Power save terminal; L puts the IC in standby with the motor outputs open, H is active, and there is a delay of 40 µs max when returning from OFF to normal. |
| 14 | TEST1 | passive | Test terminal used at distribution test; it must be connected to GND. |
| 15 | FAILA | output | Open-drain fault output that goes low on over-current protection or thermal shutdown; use a 5kΩ to 100kΩ pull-up to a supply below 7 V, or connect to GND if unused. |
| 16 | IN1A | input | H-bridge control input for channel 1 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max. |
| 17 | IN1B | input | H-bridge control input for channel 1 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max. |
| 18 | TEST2 | passive | Test terminal used at distribution test; it must be connected to GND. |
| 19 | IN2A | input | H-bridge control input for channel 2 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max. |
| 20 | IN2B | input | H-bridge control input for channel 2 that sets the output logic; the H level input is 2.0 V min and the L level input is 0.8 V max. |
| 21 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 22 | VCC2 | power_in | Power supply terminal; VCC1 and VCC2 must be shorted externally, with a recommended supply of 8 to 28 V and an absolute maximum of 36 V. |
| 23 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 24 | OUT2A | output | H-bridge output terminal for channel 2 (OUT2A); it carries motor drive current, so the trace should be thick, short and low impedance. |
| 25 | RNF2S | input | Input terminal of the channel 2 current limit comparator; connect it to RNF2 when using PWM constant current control. |
| 26 | RNF2 | passive | Connection terminal of the output current detection resistor for channel 2; use a 0.1Ω to 0.3Ω resistor to GND and keep RNF below the 0.7 V maximum. |
| 27 | OUT2B | output | H-bridge output terminal for channel 2 (OUT2B); it carries motor drive current, so the trace should be thick, short and low impedance. |
| 28 | NC | unconnected | No connection; electrically unconnected to the internal circuit. |
| 29 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | HTSSOP-28-EP |
| Category | Power Management ICs |
| Pins | 29 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC1,2 | 8 | | 28 | V | | 3 |
| Maximum Output Current (Continuous) | IOUT | | | 0.7 | A/ch | Note 5: do not exceed Pd, ASO and Tjmax=150°C | 3 |
| Supply Voltage | VCC1,2 | -0.2 | | 36 | V | | 3 |
| Input Voltage for Control Pin | VIN | -0.2 | | 5.5 | V | | 3 |
| RNF Maximum Voltage | VRNF | | | 0.7 | V | | 3 |
| Output Current | IOUT | | | 1 | A/ch | Note 3: do not exceed Pd, ASO and Tjmax=150°C | 3 |
| Output Current (peak) | IOUTPEAK | | | 1.5 | A/ch | Note 4: pulse width tw ≤1ms, duty 20ms | 3 |
| Power Dissipation | Pd | | | 1.45 | W | Note 1: 70mm×70mm×1.6mm glass epoxy board; derate 11.6mW/°C above Ta=25°C | 3 |
| Power Dissipation | Pd | | | 4.7 | W | Note 2: 4-layer recommended board; derate 37.6mW/°C above Ta=25°C | 3 |
| Operating Temperature Range | Topr | -25 | | 85 | °C | | 3 |
| Storage Temperature Range | Tstg | -55 | | 150 | °C | | 3 |
| Circuit Current at Standby | ICCST | | | 10 | µA | PS=L | 4 |
| Circuit Current | ICC | | 2.5 | 5 | mA | PS=H, VREFx=2V | 4 |
| H Level Input Voltage | VIN2H | 2 | | | V | | 4 |
| L Level Input Voltage | VIN2L | | | 0.8 | V | | 4 |
| H Level Input Current | IIN2H | 35 | 50 | 100 | µA | VIN2=5V | 4 |
| L Level Input Current | IIN2L | -10 | 0 | | µA | VIN2=0V | 4 |
| Output ON-Resistance | RON | | 1.9 | 2.5 | Ω | IOUT =±1.0A (Sum of upper and lower) | 4 |
| Output Leak Current | ILEAK | | | 10 | µA | | 4 |
| RNFX Input Current | IRNF | -80 | -40 | | µA | RNFx=0V | 4 |
| VREFx Input Current | IVREF | -2 | -0.1 | | µA | VREFx=0V | 4 |
| VREFx Input Voltage Range | VVREF | 0 | | 2 | V | | 4 |
| Minimum on Time (Blank Time) | tONMIN | 0.7 | 1.5 | 3 | µs | | 4 |
| Current Limit Comparator Threshold | VCTH | 0.23 | 0.25 | 0.27 | V | VREFx=2V | 4 |
| Thermal Resistance Junction-to-Ambient (Board 1) | θja | | 86.2 | | °C/W | Board ①: 1-layer board (copper foil on back 0mm) | 18 |
| Thermal Resistance Junction-to-Ambient (Board 2) | θja | | 67.6 | | °C/W | Board ②: 2-layer board (copper foil on back 15mm*15mm) | 18 |
| Thermal Resistance Junction-to-Ambient (Board 3) | θja | | 37.9 | | °C/W | Board ③: 2-layer board (copper foil on back 70mm*70mm) | 18 |
| Thermal Resistance Junction-to-Ambient (Board 4) | θja | | 26.6 | | °C/W | Board ④: 4-layer board (copper foil on back 70mm*70mm) | 18 |
## CAD (KiCad official)
- Symbol: `BD62210AEFV-E2`
- Footprint: `Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm`
- 3D model: HTSSOP-28-EP (KiCad packages3D, STEP)
- 3D model files: `bd62210aefv-e2-etched.step` / `bd62210aefv-e2-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bd62210aefv-e2.step` / `bd62210aefv-e2.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [ROHM Semicon datasheet](docs/bd62210aefv-e2-datasheet.pdf) (24 pp, sha256 `d5a279f9242e4c6a`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bd62210aefv-e2-datasheet.pdf)