aip74hc02sa14-tr: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
aip74hc02sa14-tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
aip74hc02sa14-tr: laser-etched CAD + chip hero (factory 2.0.0 backfill)
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
aip74hc02sa14-tr: hero re-rendered with iso-front (part number upright)
aip74hc02sa14-tr: manufacturer 'Wuxi I core Elec' (was 'Wuxi I core Elec AiP74HC02SA14 TR': the MPN had been folded in)
aip74hc02sa14-tr: laser-etched CAD + chip hero (factory 2.0.0 backfill)
aip74hc02sa14-tr: stamp component.logic (74HC02) from component-ocean
aip74hc02sa14-tr: backfill missing artifacts (etch)
fix ordering variants: suffix was duplicated into the MPN
aip74hc02sa14-tr: factory component page (tier=lcsc)
aip74hc02sa14-tr: viewers
aip74hc02sa14-tr: factory component page (tier=lcsc)
Initial commit: component/aip74hc02sa14-tr