Loads on click. Unloads when scrolled away or the tab is hidden.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads when scrolled away or the tab is hidden.

PCB Footprint

Open full view ↗
Loads on click. Unloads when scrolled away or the tab is hidden.
Loads on click. Unloads when scrolled away or the tab is hidden.
Download PDF
Contents

README

markdown

TPA6211A1DGNR

Texas Instruments · Audio Power OpAmps · MSOP-8-EP

TPA6211A1DGNR from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SHUTDOWN input Shutdown terminal, active low logic. Drive below 0.5 V to place the device in low-power shutdown (0.01 µA typ); drive above 1.55 V for normal operation. Internally pulled to GND via ~100 kΩ.
2 BYPASS passive Mid-supply voltage reference output. Adding an external bypass capacitor (typ 0.1 µF) to GND improves PSRR and sets start-up time (~27 ms with 0.1 µF).
3 IN+ input Positive differential audio input. Input impedance is 40 kΩ typ (38-44 kΩ). Common-mode input range is 0.5 V to VDD-0.8 V.
4 IN- input Negative differential audio input. Input impedance is 40 kΩ typ (38-44 kΩ). Gain is set by external series resistor Ri as 2 × (40 kΩ / Ri).
5 VO+ output Positive BTL (bridge-tied-load) speaker output. Delivers up to 3.1 W into 3 Ω from a 5-V supply. Connect directly to one side of the speaker (no output coupling capacitor required).
6 VDD power_in Analog supply voltage, 2.5 V to 5.5 V operating range (6 V absolute max). Typical quiescent current is 4 mA. Decouple with a bulk capacitor to GND.
7 GND power_in High-current ground return for the Class-AB output stage. Route with a low-impedance connection to the system ground plane; also tie the PowerPAD to this net.
8 VO- output Negative BTL (bridge-tied-load) speaker output. Complements VO+ to drive the speaker differentially with no dc bias. No output coupling capacitor is required.
9 PAD power_in Exposed PowerPAD on package underside. Must be soldered to a ground copper pour for thermal dissipation and mechanical retention; electrically connect to GND.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package MSOP-8-EP
Category Op-amp/Cmp
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • TPA6211A1DGNR
  • TPA6211A1DGNRDRB
  • TPA6211A1DGNRDRBR

CAD (KiCad official)

  • Symbol: TPA6211A1DGNR
  • Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
  • 3D model: MSOP-8-EP (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 ed894d996164f5ca, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF