component
TPA6211A1DGNR
Public Made by Adomby adom
Texas Instruments Audio Power OpAmps, MSOP-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPA6211A1DGNR
Texas Instruments · Audio Power OpAmps · MSOP-8-EP
TPA6211A1DGNR from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | Shutdown terminal, active low logic. Drive below 0.5 V to place the device in low-power shutdown (0.01 µA typ); drive above 1.55 V for normal operation. Internally pulled to GND via ~100 kΩ. |
| 2 | BYPASS | passive | Mid-supply voltage reference output. Adding an external bypass capacitor (typ 0.1 µF) to GND improves PSRR and sets start-up time (~27 ms with 0.1 µF). |
| 3 | IN+ | input | Positive differential audio input. Input impedance is 40 kΩ typ (38-44 kΩ). Common-mode input range is 0.5 V to VDD-0.8 V. |
| 4 | IN- | input | Negative differential audio input. Input impedance is 40 kΩ typ (38-44 kΩ). Gain is set by external series resistor Ri as 2 × (40 kΩ / Ri). |
| 5 | VO+ | output | Positive BTL (bridge-tied-load) speaker output. Delivers up to 3.1 W into 3 Ω from a 5-V supply. Connect directly to one side of the speaker (no output coupling capacitor required). |
| 6 | VDD | power_in | Analog supply voltage, 2.5 V to 5.5 V operating range (6 V absolute max). Typical quiescent current is 4 mA. Decouple with a bulk capacitor to GND. |
| 7 | GND | power_in | High-current ground return for the Class-AB output stage. Route with a low-impedance connection to the system ground plane; also tie the PowerPAD to this net. |
| 8 | VO- | output | Negative BTL (bridge-tied-load) speaker output. Complements VO+ to drive the speaker differentially with no dc bias. No output coupling capacitor is required. |
| 9 | PAD | power_in | Exposed PowerPAD on package underside. Must be soldered to a ground copper pour for thermal dissipation and mechanical retention; electrically connect to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | MSOP-8-EP |
| Category | Op-amp/Cmp |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
TPA6211A1DGNRTPA6211A1DGNRDRBTPA6211A1DGNRDRBR
CAD (KiCad official)
- Symbol:
TPA6211A1DGNR - Footprint:
Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm - 3D model: MSOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
tpa6211a1dgnr-etched.step/tpa6211a1dgnr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpa6211a1dgnr.step/tpa6211a1dgnr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (32 pp, sha256
ed894d996164f5ca, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).