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MPU-6050

InvenSense (TDK) · 6-axis IMU (accel + gyro) · QFN-24 (4x4 mm)

6-axis MotionTracking device combining a 3-axis MEMS gyroscope, a 3-axis MEMS accelerometer, and an on-chip Digital Motion Processor (DMP), in a 4x4x0.9 mm QFN-24 package. The primary I2C interface (up to 400 kHz) reads motion data, and an auxiliary I2C master port can chain an external magnetometer or pressure sensor for a 9- or 10-axis solution. VDD is 2.375-3.46 V with a separate VLOGIC rail for 1.8 V or 3.3 V I/O. The default cheap IMU for drones, gimbals, and gesture sensing.

Pinout

Pin Name Type Function
1 CLKIN input Optional external reference clock input. Connect to GND if unused.
2 NC unconnected Not internally connected. May be used for PCB trace routing.
3 NC unconnected Not internally connected. May be used for PCB trace routing.
4 NC unconnected Not internally connected. May be used for PCB trace routing.
5 NC unconnected Not internally connected. May be used for PCB trace routing.
6 AUX_DA bidirectional Auxiliary I2C master serial data line, used to connect external sensors (e.g., magnetometer) to the auxiliary I2C bus mastered by the MPU-6050. Requires an external pull-up resistor.
7 AUX_CL output Auxiliary I2C master serial clock, used to connect external sensors (e.g., magnetometer) to the auxiliary I2C bus mastered by the MPU-6050. Requires an external pull-up resistor.
8 VLOGIC power_in Digital I/O supply voltage. 1.71 V to VDD; sets the logic level of the primary I2C bus and other digital I/Os. Bypass with a 10 nF ceramic capacitor (C4) to GND.
9 AD0 input I2C Slave Address LSB. Selects between two possible 7-bit slave addresses (0x68 when tied low, 0x69 when tied high) so two MPU-6050 devices can share the same I2C bus.
10 REGOUT passive Regulator filter capacitor connection for the internal LDO. Bypass with a 0.1 µF ceramic capacitor (C1) to GND. Do not use as a supply rail for other circuits.
11 FSYNC input Frame synchronization digital input. Used to sync image or video captures to sensor sampling. Connect to GND if unused.
12 INT output Interrupt digital output, configurable as totem-pole or open-drain, active-high or active-low. Asserts on programmable events (data ready, motion, FIFO overflow, etc.).
13 VDD power_in Main power supply voltage, 2.375 V to 3.46 V (VDD nominal 2.5 V or 3.3 V). Also serves as the digital I/O supply for legacy uses. Bypass with a 0.1 µF ceramic capacitor (C2) to GND.
14 NC unconnected Not internally connected. May be used for PCB trace routing.
15 NC unconnected Not internally connected. May be used for PCB trace routing.
16 NC unconnected Not internally connected. May be used for PCB trace routing.
17 NC unconnected Not internally connected. May be used for PCB trace routing.
18 GND power_in Power supply ground reference.
19 RESV unconnected Reserved. Do not connect.
20 CPOUT passive Charge pump capacitor connection. Connect a 2.2 nF X7R ceramic capacitor (C3, 50 V) to GND for the internal charge pump used by the gyroscope drive circuitry.
21 RESV unconnected Reserved. Do not connect.
22 RESV unconnected Reserved. Do not connect.
23 SCL input Primary I2C serial clock. Open-drain, requires an external pull-up resistor to VLOGIC. Supports Standard (100 kHz) and Fast (400 kHz) modes.
24 SDA bidirectional Primary I2C serial data. Open-drain, requires an external pull-up resistor to VLOGIC. Supports Standard (100 kHz) and Fast (400 kHz) modes.

Key specifications

Parameter Value
Type 6-axis IMU (gyro + accelerometer)
Gyroscope 3-axis, ±250/500/1000/2000 °/s
Accelerometer 3-axis, ±2/4/8/16 g
On-chip Digital Motion Processor (DMP), temp sensor
Interface I2C up to 400 kHz + auxiliary I2C master
Supply (VDD) 2.375-3.46 V (VLOGIC 1.71 V-VDD)
Package QFN-24 (4 x 4 x 0.9 mm)
Body (L×W×H) 4.0 × 4.0 × 0.9 mm

Ordering variants

Same part, different packaging or reel option.

  • MPU-6050 (QFN-24, tray)

CAD (KiCad official)

  • Symbol: Sensor_Motion:MPU-6050
  • Footprint: Sensor_Motion:InvenSense_QFN-24_4x4mm_P0.5mm
  • 3D model: QFN-24 4x4mm (generic; KiCad has no InvenSense-specific 3D)
  • 3D model files: mpu-6050-etched.step / mpu-6050-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mpu-6050.step / mpu-6050.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: [InvenSense (TDK) datasheet](https://www.cdiweb.com/datasheets/invensense/mpu-6050_datasheet_v3 4.pdf) (52 pp, sha256 9d3b698699d6d907, retrieved 2026-08-17, tier: cse)
  • Extractor: ds2sf (Claude) — every pin and dimension is cited to a datasheet page; refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF