6-axis MotionTracking device combining a 3-axis MEMS gyroscope, a 3-axis MEMS accelerometer, and an on-chip Digital Motion Processor (DMP), in a 4x4x0.9 mm QFN-24 package. The primary I2C interface (up to 400 kHz) reads motion data, and an auxiliary I2C master port can chain an external magnetometer or pressure sensor for a 9- or 10-axis solution. VDD is 2.375-3.46 V with a separate VLOGIC rail for 1.8 V or 3.3 V I/O. The default cheap IMU for drones, gimbals, and gesture sensing.

Pinout

Pin	Name	Type	Function
1	CLKIN	input	Optional external reference clock input. Connect to GND if unused.
2	NC	unconnected	Not internally connected. May be used for PCB trace routing.
3	NC	unconnected	Not internally connected. May be used for PCB trace routing.
4	NC	unconnected	Not internally connected. May be used for PCB trace routing.
5	NC	unconnected	Not internally connected. May be used for PCB trace routing.
6	AUX_DA	bidirectional	Auxiliary I2C master serial data line, used to connect external sensors (e.g., magnetometer) to the auxiliary I2C bus mastered by the MPU-6050. Requires an external pull-up resistor.
7	AUX_CL	output	Auxiliary I2C master serial clock, used to connect external sensors (e.g., magnetometer) to the auxiliary I2C bus mastered by the MPU-6050. Requires an external pull-up resistor.
8	VLOGIC	power_in	Digital I/O supply voltage. 1.71 V to VDD; sets the logic level of the primary I2C bus and other digital I/Os. Bypass with a 10 nF ceramic capacitor (C4) to GND.
9	AD0	input	I2C Slave Address LSB. Selects between two possible 7-bit slave addresses (0x68 when tied low, 0x69 when tied high) so two MPU-6050 devices can share the same I2C bus.
10	REGOUT	passive	Regulator filter capacitor connection for the internal LDO. Bypass with a 0.1 µF ceramic capacitor (C1) to GND. Do not use as a supply rail for other circuits.
11	FSYNC	input	Frame synchronization digital input. Used to sync image or video captures to sensor sampling. Connect to GND if unused.
12	INT	output	Interrupt digital output, configurable as totem-pole or open-drain, active-high or active-low. Asserts on programmable events (data ready, motion, FIFO overflow, etc.).
13	VDD	power_in	Main power supply voltage, 2.375 V to 3.46 V (VDD nominal 2.5 V or 3.3 V). Also serves as the digital I/O supply for legacy uses. Bypass with a 0.1 µF ceramic capacitor (C2) to GND.
14	NC	unconnected	Not internally connected. May be used for PCB trace routing.
15	NC	unconnected	Not internally connected. May be used for PCB trace routing.
16	NC	unconnected	Not internally connected. May be used for PCB trace routing.
17	NC	unconnected	Not internally connected. May be used for PCB trace routing.
18	GND	power_in	Power supply ground reference.
19	RESV	unconnected	Reserved. Do not connect.
20	CPOUT	passive	Charge pump capacitor connection. Connect a 2.2 nF X7R ceramic capacitor (C3, 50 V) to GND for the internal charge pump used by the gyroscope drive circuitry.
21	RESV	unconnected	Reserved. Do not connect.
22	RESV	unconnected	Reserved. Do not connect.
23	SCL	input	Primary I2C serial clock. Open-drain, requires an external pull-up resistor to VLOGIC. Supports Standard (100 kHz) and Fast (400 kHz) modes.
24	SDA	bidirectional	Primary I2C serial data. Open-drain, requires an external pull-up resistor to VLOGIC. Supports Standard (100 kHz) and Fast (400 kHz) modes.

Key specifications

Parameter	Value
Type	6-axis IMU (gyro + accelerometer)
Gyroscope	3-axis, ±250/500/1000/2000 °/s
Accelerometer	3-axis, ±2/4/8/16 g
On-chip	Digital Motion Processor (DMP), temp sensor
Interface	I2C up to 400 kHz + auxiliary I2C master
Supply (VDD)	2.375-3.46 V (VLOGIC 1.71 V-VDD)
Package	QFN-24 (4 x 4 x 0.9 mm)
Body (L×W×H)	4.0 × 4.0 × 0.9 mm

Ordering variants

Same part, different packaging or reel option.

MPU-6050 (QFN-24, tray)

CAD (KiCad official)

Symbol: Sensor_Motion:MPU-6050
Footprint: Sensor_Motion:InvenSense_QFN-24_4x4mm_P0.5mm
3D model: QFN-24 4x4mm (generic; KiCad has no InvenSense-specific 3D)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: [InvenSense (TDK) datasheet](https://www.cdiweb.com/datasheets/invensense/mpu-6050_datasheet_v3 4.pdf) (52 pp, sha256 9d3b698699d6d907, retrieved 2026-08-17, tier: cse)
Extractor: ds2sf (Claude) — every pin and dimension is cited to a datasheet page; refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF