component
FDD6676AS
Public Made by Adomby adom
UMW MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownFDD6676AS
UMW · MOSFETs · TO-252
FDD6676AS from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | GATE terminal of the 30V N-channel MOSFET; the datasheet gives a gate-source voltage rating of ±20V (VGSS). |
| 2 | D | passive | DRAIN terminal; the datasheet notes that the thermal case reference is the solder mounting surface of the drain pins, and gives a maximum drain-source voltage of 30V (VDSS). |
| 3 | S | passive | SOURCE terminal of the MOSFET, carrying the source side of the drain current rated at 90A continuous (ID) in the datasheet. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 30 | V | 1 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 1 | ||
| Drain Current - Continuous | ID | 90 | A | Note 3 | 1 | ||
| Drain Current - Pulsed | 100 | A | Note 1a | 1 | |||
| Power Dissipation for Single Operation | PD | 70 | W | Note 1 | 1 | ||
| Power Dissipation for Single Operation | PD | 3.1 | W | Note 1a | 1 | ||
| Power Dissipation for Single Operation | PD | 1.3 | W | Note 1b | 1 | ||
| Operating and Storage Junction Temperature Range | TJ, TSTG | -55 | 150 | °C | 1 | ||
| Drain-Source Breakdown Voltage | BVDSS | 30 | V | VGS=0V, ID=1mA | 3 | ||
| Gate-Body Leakage | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 3 | |
| Gate Threshold Voltage | VGS(th) | 1.5 | 3 | V | VDS=VGS, ID=1mA | 3 | |
| Static Drain-Source On-Resistance | RDS(ON) | 4.7 | 5.7 | mΩ | VGS=10V, ID=16A | 3 | |
| Static Drain-Source On-Resistance | RDS(ON) | 5.8 | 7.1 | mΩ | VGS=4.5V, ID=15A | 3 | |
| Breakdown Voltage Temperature Coefficient | ΔBVDSS/ΔTJ | 31 | mV/°C | ID=10mA, Referenced to 25°C | 3 | ||
| Gate Threshold Voltage Temperature Coefficient | ΔVGS(th)/ΔTJ | -3.6 | mV/°C | ID=10mA, Referenced to 25°C | 3 | ||
| Drain-Source Avalanche Energy | WDSS | 250 | mJ | Single Pulse, VDD=15V, ID=16A | 3 | ||
| Drain-Source Avalanche Current | IAR | 16 | A | 3 | |||
| Forward Transconductance | gFS | 21 | S | VDS=5V, ID=16A | 3 | ||
| Input Capacitance | Ciss | 2500 | pF | VDS=15V, VGS=0V, f=1MHz | 3 | ||
| Output Capacitance | Coss | 710 | pF | VDS=15V, VGS=0V, f=1MHz | 3 | ||
| Reverse Transfer Capacitance | Crss | 270 | pF | VDS=15V, VGS=0V, f=1MHz | 3 | ||
| Gate Resistance | Rg | 1.6 | Ω | VGS=0V, f=1MHz | 3 | ||
| Turn-On Delay Time | tD(on) | 12 | ns | VDD=15V, ID=1A, VGS=10V, RGEN=6Ω | 3 | ||
| Turn-On Rise Time | tr | 12 | ns | VDD=15V, ID=1A, VGS=10V, RGEN=6Ω | 3 | ||
| Turn-Off Delay Time | tD(off) | 46 | ns | VDD=15V, ID=1A, VGS=10V, RGEN=6Ω | 3 | ||
| Turn-Off Fall Time | tf | 28 | ns | VDD=15V, ID=1A, VGS=10V, RGEN=6Ω | 3 | ||
| Turn-On Delay Time | tD(on) | 20 | ns | VDD=15V, ID=1A, VGS=4.5V, RGEN=6Ω | 3 | ||
| Turn-On Rise Time | tr | 24 | ns | VDD=15V, ID=1A, VGS=4.5V, RGEN=6Ω | 3 | ||
| Turn-Off Delay Time | tD(off) | 35 | ns | VDD=15V, ID=1A, VGS=4.5V, RGEN=6Ω | 3 | ||
| Turn-Off Fall Time | tf | 27 | ns | VDD=15V, ID=1A, VGS=4.5V, RGEN=6Ω | 3 | ||
| Total Gate Charge, VGS=10V | Qg(TOT) | 46 | nC | VDS=15V, ID=16A | 4 | ||
| Maximum Continuous Drain-Source Diode Forward Current | IS | 3.5 | A | 4 | |||
| Thermal Resistance, Junction-to-Case | RθJC | 1.8 | °C/W | Note 1 | 2 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 40 | °C/W | Note 1a (1 in² pad of 2oz copper) | 2 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 96 | °C/W | Note 1b (minimum pad) | 2 |
CAD (KiCad official)
- Symbol:
FDD6676AS - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
fdd6676as-etched.step/fdd6676as-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fdd6676as.step/fdd6676as.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: UMW datasheet (9 pp, sha256
df2f7d73a4bfc4f2, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).