component
TLC-MSMD300
Public Made by Adomby adom
TLC Electronic Resettable Fuses, 1812. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTLC-MSMD300
TLC Electronic · Resettable Fuses · 1812
TLC-MSMD300 from TLC Electronic, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TLC Electronic |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Holding current (IH) | IH | 3 | A | 25℃ still air | 1 | ||
| Tripping current (IT) | IT | 6 | A | 25℃ still air | 1 | ||
| Maximum voltage (Vmax) | Vmax | 16 | V | at rated current | 1 | ||
| Maximum fault current (I max) | I max | 100 | A | at rated voltage | 1 | ||
| Minimum resistance prior to trip (R min) | R min | 0.012 | Ω | prior to trip at 25℃ | 1 | ||
| Maximum resistance one hour post reflow (R1max) | R1max | 0.06 | Ω | measured one hour post reflow at 25℃ | 1 | ||
| Maximum time to trip (Ttrip) | Ttrip | 5 | s | at 8.0 A | 1 | ||
| Rated working power (Pd) | Pd | 1.2 | W | 1 | |||
| Maximum ambient operating temperature range | -40 | 85 | ℃ | ambient operating temperature range shown in hold/trip current derating table | 1 | ||
| Average ramp-up rate (reflow) | 3 | ℃/second | solder reflow recommendation, average ramp-up rate | 1 | |||
| Ramp-down rate (reflow) | 6 | ℃/second | solder reflow recommendation, ramp-down rate | 1 | |||
| Peak reflow temperature | 260 | ℃ | solder reflow recommendation profile peak | 1 |
CAD (KiCad official)
- Symbol:
TLC-MSMD300 - Footprint:
Fuse:Fuse_1812_4532Metric - 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
tlc-msmd300-etched.step/tlc-msmd300-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlc-msmd300.step/tlc-msmd300.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TLC Electronic datasheet (1 pp, sha256
9dbde45032dd8737, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).