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Made with kicad-footprint-generator 10.0 · KiCad file format 20260206
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README.md Publish 0.1.0 · Ray 23d ago
tlc-msmd300-etched.glb Publish 0.1.0 · Ray 23d ago
tlc-msmd300-etched.step tlc-msmd300: factory component page (tier=lcsc) · Ray 23d ago
tlc-msmd300-hero.glb tlc-msmd300: hero GLB from the etched model (keeps the MPN mark) · Ray 23d ago
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tlc-msmd300.glb Publish 0.1.0 · Ray 23d ago
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tlc-msmd300.kicad_sym tlc-msmd300: KiCad Device:Fuse symbol instead of a box (two-terminal passive) · Ray 11d ago
tlc-msmd300.lbr tlc-msmd300: KiCad Device:Fuse symbol instead of a box (two-terminal passive) · Ray 11d ago
tlc-msmd300.step Publish 0.1.0 · Ray 23d ago

TLC-MSMD300

TLC Electronic · Resettable Fuses · 1812

TLC-MSMD300 from TLC Electronic, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer TLC Electronic
Package 1812
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Holding current (IH) IH 3 A 25℃ still air 1
Tripping current (IT) IT 6 A 25℃ still air 1
Maximum voltage (Vmax) Vmax 16 V at rated current 1
Maximum fault current (I max) I max 100 A at rated voltage 1
Minimum resistance prior to trip (R min) R min 0.012 Ω prior to trip at 25℃ 1
Maximum resistance one hour post reflow (R1max) R1max 0.06 Ω measured one hour post reflow at 25℃ 1
Maximum time to trip (Ttrip) Ttrip 5 s at 8.0 A 1
Rated working power (Pd) Pd 1.2 W 1
Maximum ambient operating temperature range -40 85 ℃ ambient operating temperature range shown in hold/trip current derating table 1
Average ramp-up rate (reflow) 3 ℃/second solder reflow recommendation, average ramp-up rate 1
Ramp-down rate (reflow) 6 ℃/second solder reflow recommendation, ramp-down rate 1
Peak reflow temperature 260 ℃ solder reflow recommendation profile peak 1

CAD (KiCad official)

  • Symbol: TLC-MSMD300
  • Footprint: Fuse:Fuse_1812_4532Metric
  • 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tlc-msmd300-etched.step / tlc-msmd300-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlc-msmd300.step / tlc-msmd300.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TLC Electronic datasheet (1 pp, sha256 9dbde45032dd8737, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF