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GC4D20120D
Public Made by Adomby adom
SUPSiC SiC Diodes, TO-247-3. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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PCB Footprint
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Datasheet
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README
markdownGC4D20120D
SUPSiC · SiC Diodes · TO-247-3
GC4D20120D from SUPSiC, in a TO-247-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GATE | passive | Per package outline designation; function is not explained in datasheet; GATE terminology is non-standard for Schottky rectifier diodes. |
| 2 | DRAIN (COLLECTOR) | passive | One terminal of the silicon carbide Schottky diode per TO-247-3 package pinout; datasheet does not explicitly designate anode vs. cathode polarity. |
| 3 | SOURCE (EMITTER) | passive | Other terminal of the silicon carbide Schottky diode per TO-247-3 package pinout; datasheet does not explicitly designate anode vs. cathode polarity. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SUPSiC |
| Package | TO-247-3 |
| Category | Silicon Carbide (SiC) Devices |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Junction operating temperature range (TJ) | TJ | -55 | 175 | °C | 1 | ||
| Storage temperature range (Tstg) | Tstg | -55 | 135 | °C | 1 | ||
| Repetitive Peak Reverse Voltage | VRRM | 1200 | V | 1 | |||
| Surge Peak Reverse Voltage | VRSM | 1300 | V | 1 | |||
| DC Blocking Voltage | VDC | 1200 | V | 1 | |||
| Continuous Forward Current (per leg) | IF | 34 | A | TC=25˚C, per leg | 1 | ||
| Continuous Forward Current (per device) | IF | 68 | A | TC=25˚C, per device | 1 | ||
| Continuous Forward Current (per leg) | IF | 16.5 | A | TC=135˚C, per leg | 1 | ||
| Continuous Forward Current (per device) | IF | 34 | A | TC=135˚C, per device | 1 | ||
| Continuous Forward Current (per leg) | IF | 10 | A | TC=157˚C, per leg | 1 | ||
| Continuous Forward Current (per device) | IF | 20 | A | TC=157˚C, per device | 1 | ||
| Repetitive Peak Forward Surge Current | IFRM | 48 | A | TC=25˚C, tP=10 ms, Half Sine Pulse | 1 | ||
| Repetitive Peak Forward Surge Current | IFRM | 31.5 | A | TC=110˚C, tP=10 ms, Half Sine Pulse | 1 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 72 | A | TC=25˚C, tP=10 ms, Half Sine Pulse | 1 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 59.5 | A | TC=110˚C, tP=10 ms, Half Sine Pulse | 1 | ||
| Non-Repetitive Peak Forward Current | IF,Max | 750 | A | TC=25˚C, tP=10 ms, Pulse | 1 | ||
| Non-Repetitive Peak Forward Current | IF,Max | 620 | A | TC=110˚C, tP=10 ms, Pulse | 1 | ||
| Power Dissipation (per leg) | Ptot | 176 | W | TC=25˚C, per leg | 1 | ||
| Power Dissipation (per device) | Ptot | 352 | W | TC=25˚C, per device | 1 | ||
| Power Dissipation (per leg) | Ptot | 76 | W | TC=110˚C, per leg | 1 | ||
| Power Dissipation (per device) | Ptot | 152 | W | TC=110˚C, per device | 1 | ||
| Diode dV/dt ruggedness | dV/dt | 200 | V/ns | VR=0-960V | 1 | ||
| i2t value | ∫i2dt | 25 | A2s | TC=25˚C, tP=10 ms | 1 | ||
| i2t value | ∫i2dt | 17.6 | A2s | TC=110˚C, tP=10 ms | 1 | ||
| Mounting torque (M3 screw) | 1 | Nm | M3 Screw | 1 | |||
| Mounting torque (6-32 screw) | 8.8 | lbf-in | 6-32 Screw | 1 | |||
| Forward Voltage (25°C) | VF | 1.5 | 2.2 | V | IF = 10 A TJ=25°C | 2 | |
| Forward Voltage (175°C) | VF | 1.8 | 3 | V | IF = 10 A TJ=175°C | 2 | |
| Reverse Current (25°C) | IR | 30 | 250 | μA | VR = 1200 V TJ=25°C | 2 | |
| Reverse Current (175°C) | IR | 55 | 350 | μA | VR = 1200 V TJ=175°C | 2 | |
| Thermal Resistance Junction to Case | RθJC | 0.85 | °C/W | footnote * | 2 | ||
| Thermal Resistance Junction to Case | RθJC | 0.43 | °C/W | footnote ** | 2 |
CAD (KiCad official)
- Symbol:
GC4D20120D - Footprint:
Package_TO_SOT_THT:TO-247-3_Vertical - 3D model: TO-247-3 (KiCad packages3D, STEP)
- 3D model files:
gc4d20120d-etched.step/gc4d20120d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);gc4d20120d.step/gc4d20120d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SUPSiC datasheet (3 pp, sha256
0e1c577997bb3902, retrieved 2026-10-21, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).