Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

ADR4550BRZ

Analog Devices · Voltage Reference · SOIC-8

ADR4550BRZ from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NIC unconnected Internal no-connect pin; it is not internally connected and is not a functional pin.
2 VIN power_in Input voltage connection; the datasheet specifies an operating supply range of 3 V to 15 V (5.1 V minimum for the ADR4550) and an absolute maximum of 16 V.
3 NIC unconnected Internal no-connect pin; it is not internally connected and is not a functional pin.
4 GND power_in Ground reference pin for the reference.
5 NIC unconnected Internal no-connect pin; it is not internally connected and is not a functional pin.
6 VOUT power_out Reference voltage output, 5.000 V nominal for the ADR4550, rated for +10 mA source and −10 mA sink current.
7 NIC unconnected Internal no-connect pin; it is not internally connected and is not a functional pin.
8 DNC unconnected Do not connect; this pin must be left unconnected.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Initial output voltage error (B grade), max VOUT_ERR -0.02 0.02 % B级 9
Initial output voltage error (B grade), equivalent value VOUT_ERR 1 mV B级 9
Solder heat shift (3 x reflow) -0.02 0.02 % 9
Temperature coefficient, black box method (B grade) TCVOUT 2 ppm/°C −40°C ≤ TA ≤ +125°C(黑盒法) 9
Temperature coefficient, bow-tie method (B grade) TCVOUT 4 ppm/°C −40°C ≤ TA ≤ +125°C(领结法) 9
Line regulation ΔVOUT/ΔVIN 1 10 ppm/V −40°C ≤ TA ≤ +125°C 9
Load regulation, source ΔVOUT/ΔIL 25 80 ppm/mA IL = 0 mA至+10 mA拉电流,−40°C ≤ TA ≤ +125°C 9
Load regulation, sink ΔVOUT/ΔIL 35 120 ppm/mA IL = 0 mA至−10 mA灌电流,−40°C ≤ TA ≤ +125°C 9
Quiescent current IQ 700 950 μA −40°C ≤ TA ≤ +125°C,空载 9
Dropout voltage, no load VDO 100 mV −40°C ≤ TA ≤ +125°C,空载 9
Dropout voltage, IL = 2 mA VDO 300 mV −40°C ≤ TA ≤ +125°C,IL = 2 mA 9
Ripple rejection ratio RRR 90 dB fIN = 1 kHz 9
Output current capability, sink IL -10 mA 灌电流 9
Output current capability, source IL 10 mA 拉电流 9
Output voltage VOUT 5 V 9
Output voltage noise eNp-p 2.8 μV p-p 0.1 Hz至10.0 Hz 9
Output voltage noise density eN 95.3 nV/√Hz 1 kHz 9
Thermal hysteresis, full cycle (+25°C to +125°C to −40°C to +25°C) ΔVOUT_HYS -13 ppm +25°C至+125°C至−40°C至+25°C(全循环) 9
Thermal hysteresis, half cycle (25°C to 125°C to 25°C) ΔVOUT_HYS -97 ppm 25°C至125°C至25°C(半循环) 9
Thermal hysteresis, full cycle (25°C to 70°C to 0°C to 25°C) ΔVOUT_HYS -8 ppm 25°C至70°C至0°C至25°C(全循环) 9
Thermal hysteresis, half cycle (25°C to 70°C to 25°C) ΔVOUT_HYS -17 ppm 25°C至70°C至25°C(半循环) 9
Long-term drift, early (250 hours) ΔVOUT_LTD 19 ppm TA = 25°C 9
Long-term drift, 1000 hours ΔVOUT_LTD 25 ppm TA = 25°C 9
Long-term drift, 4500 hours ΔVOUT_LTD 51 ppm TA = 25°C 9
Turn-on settling time tR 160 µs COUT = 0.1 µF,CIN = 0.1 µF,RLOAD = 1 kΩ 9
Load capacitance 0.1 100 µF 9
Input voltage (electrical table condition for ADR4550) VIN 5.1 15 V 除非另有说明,电源电压VIN = 5.1 V至15 V,IL = 0 mA,TA = 25°C 9
Power supply voltage, absolute maximum 16 V TA = 25°C 10
Operating temperature range -40 125 °C 10
Storage temperature range -65 150 °C 10
Junction temperature range -65 150 °C 10
ESD, human body model (HBM) 6 kV 10
Thermal resistance, junction-to-ambient, 1-layer JEDEC board θJA 63 °C/W 1层JEDEC板 10
Thermal resistance, junction-to-ambient, 2-layer JEDEC board θJA 120 °C/W 2层JEDEC板 10

CAD (KiCad official)

  • Symbol: ADR4550BRZ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: adr4550brz-etched.step / adr4550brz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adr4550brz.step / adr4550brz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (37 pp, sha256 512ab2dfe214da56, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF