component
EFM32TG11B520F128GQ80-B
Public Made by Adomby adom
SILICON LABS SILICON LABS, TQFP-80(12x12). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownEFM32TG11B520F128GQ80-B
SILICON LABS · SILICON LABS · TQFP-80(12x12)
EFM32TG11B520F128GQ80-B from SILICON LABS, in a TQFP-80(12x12). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PA0 | bidirectional | GPIO with LCD_SEG13, TIM0_CC0, I2C0_SDA, GPIO_EM4WU0 and other alternate functions. |
| 2 | PA1 | bidirectional | GPIO with LCD_SEG14, TIM0_CC1, I2C0_SCL, CMU_CLK1 and other alternate functions. |
| 3 | PA2 | bidirectional | GPIO with LCD_SEG15, TIM0_CC2, US3_CLK, CMU_CLK0 and other alternate functions. |
| 4 | PA3 | bidirectional | GPIO with LCD_SEG16, TIM0_CDTI0, US3_CS, LES_ALTEX2 and other alternate functions. |
| 5 | PA4 | bidirectional | GPIO with LCD_SEG17, TIM0_CDTI1, US3_CTS, LES_ALTEX3 and other alternate functions. |
| 6 | PA5 | bidirectional | GPIO with LCD_SEG18, TIM0_CDTI2, US3_RTS, LES_ALTEX4 and other alternate functions. |
| 7 | PA6 | bidirectional | GPIO with LCD_SEG19, WTIM0_CC0, PRS_CH6, GPIO_EM4WU1 and other alternate functions. |
| 8 | IOVDD0 | power_in | Digital IO power supply 0. |
| 9 | VSS | power_in | Ground. |
| 10 | PB3 | bidirectional | GPIO with LCD_SEG20/LCD_COM4, TIM1_CC3, US2_TX and other alternate functions. |
| 11 | PB4 | bidirectional | GPIO with LCD_SEG21/LCD_COM5, WTIM0_CC1, US2_RX and other alternate functions. |
| 12 | PB5 | bidirectional | GPIO with LCD_SEG22/LCD_COM6, WTIM0_CC2, US2_CLK and other alternate functions. |
| 13 | PB6 | bidirectional | GPIO with LCD_SEG23/LCD_COM7, TIM0_CC0, US2_CS and other alternate functions. |
| 14 | PC1 | bidirectional | GPIO, 5V tolerant, with CAN0_TX, LES_CH1, OPA0_OUTALT and other alternate functions. |
| 15 | PC2 | bidirectional | GPIO, 5V tolerant, with LES_CH2, OPA0_OUTALT, US2_TX and other alternate functions. |
| 16 | PC3 | bidirectional | GPIO, 5V tolerant, with LES_CH3, OPA0_OUTALT, US2_RX and other alternate functions. |
| 17 | PC4 | bidirectional | GPIO with OPA0_P, LCD_SEG24, LES_CH4, GPIO_EM4WU6 and other alternate functions. |
| 18 | PC5 | bidirectional | GPIO with OPA0_N, LCD_SEG25, LES_CH5 and other alternate functions. |
| 19 | PB7 | bidirectional | GPIO with LFXTAL_P (low frequency crystal positive pin) and other alternate functions. |
| 20 | PB8 | bidirectional | GPIO with LFXTAL_N (low frequency crystal negative pin or external clock input) and other alternate functions. |
| 21 | PA8 | bidirectional | GPIO with BU_STAT (backup power domain status), TIM0_CC0, US2_RX and other alternate functions. |
| 22 | PA9 | bidirectional | GPIO with LCD_SEG26, TIM0_CC1, US2_CLK and other alternate functions. |
| 23 | PA10 | bidirectional | GPIO with LCD_SEG27, TIM0_CC2, US2_CS and other alternate functions. |
| 24 | VSS | power_in | Ground. |
| 25 | PA12 | bidirectional | GPIO with BU_VOUT (backup domain power output), WTIM0_CDTI0, US0_CLK and other alternate functions. |
| 26 | PA14 | bidirectional | GPIO with LCD_BEXT, WTIM0_CDTI2, US1_TX and other alternate functions. |
| 27 | RESETn | input | Reset input, active low; drive low only during reset and let the internal pull-up release reset. |
| 28 | PB11 | bidirectional | GPIO with VDAC0_OUT0/OPA0_OUT, LCD_SEG28, GPIO_EM4WU7 and other alternate functions. |
| 29 | PB12 | bidirectional | GPIO with VDAC0_OUT1/OPA1_OUT, LCD_SEG29, I2C1_SCL and other alternate functions. |
| 30 | AVDD | power_in | Analog power supply. |
| 31 | PB13 | bidirectional | GPIO with HFXTAL_P (high frequency crystal positive pin), WTIM1_CC0 and other alternate functions. |
| 32 | PB14 | bidirectional | GPIO with HFXTAL_N (high frequency crystal negative pin or external clock input), WTIM1_CC1 and other alternate functions. |
| 33 | IOVDD0 | power_in | Digital IO power supply 0. |
| 34 | AVDD | power_in | Analog power supply. |
| 35 | PD0 | bidirectional | GPIO, 5V tolerant, with OPA2_OUTALT, VDAC0_OUT0ALT/OPA0_OUTALT, CAN0_RX and other alternate functions. |
| 36 | PD1 | bidirectional | GPIO with OPA3_OUT, VDAC0_OUT1ALT/OPA1_OUTALT, CAN0_TX and other alternate functions. |
| 37 | PD3 | bidirectional | GPIO with OPA2_N, LCD_SEG30, TIM0_CC2 and other alternate functions. |
| 38 | PD4 | bidirectional | GPIO with OPA2_P, LCD_SEG31, LEU0_TX and other alternate functions. |
| 39 | PD5 | bidirectional | GPIO with OPA2_OUT, LEU0_RX, I2C1_SCL and other alternate functions. |
| 40 | PD6 | bidirectional | GPIO with ADC0_EXTP, VDAC0_EXT, OPA1_P, I2C0_SDA and other alternate functions. |
| 41 | PD7 | bidirectional | GPIO with ADC0_EXTN, OPA1_N, I2C0_SCL and other alternate functions. |
| 42 | PD8 | bidirectional | GPIO with BU_VIN (battery input for backup power domain), WTIM1_CC2 and other alternate functions. |
| 43 | PC6 | bidirectional | GPIO with OPA3_P, LCD_SEG32, LES_CH6 and other alternate functions. |
| 44 | PC7 | bidirectional | GPIO with OPA3_N, LCD_SEG33, LES_CH7 and other alternate functions. |
| 45 | VREGVSS | power_in | Voltage regulator VSS. |
| 46 | VREGSW | passive | DCDC regulator switching node. |
| 47 | VREGVDD | power_in | Voltage regulator VDD input. |
| 48 | DVDD | power_in | Digital power supply. |
| 49 | DECOUPLE | passive | Decouple output for on-chip voltage regulator; an external decoupling capacitor is required at this pin. |
| 50 | IOVDD0 | power_in | Digital IO power supply 0. |
| 51 | VSS | power_in | Ground. |
| 52 | PE4 | bidirectional | GPIO with LCD_COM0, WTIM0_CC0, US0_CS and other alternate functions. |
| 53 | PE5 | bidirectional | GPIO with LCD_COM1, WTIM0_CC1, US0_CLK and other alternate functions. |
| 54 | PE6 | bidirectional | GPIO with LCD_COM2, WTIM0_CC2, US0_RX and other alternate functions. |
| 55 | PE7 | bidirectional | GPIO with LCD_COM3, WTIM1_CC0, US0_TX and other alternate functions. |
| 56 | PC8 | bidirectional | GPIO with LCD_SEG34, LES_CH8, US0_CS and other alternate functions. |
| 57 | PC9 | bidirectional | GPIO with LCD_SEG35, LES_CH9, GPIO_EM4WU2 and other alternate functions. |
| 58 | PC10 | bidirectional | GPIO, 5V tolerant, with LES_CH10, US0_RX and other alternate functions. |
| 59 | PC11 | bidirectional | GPIO, 5V tolerant, with LES_CH11, US0_TX, I2C1_SDA and other alternate functions. |
| 60 | PC13 | bidirectional | GPIO, 5V tolerant, with LES_CH13, TIM1_CC0, PCNT0_S0IN and other alternate functions. |
| 61 | PC14 | bidirectional | GPIO, 5V tolerant, with LES_CH14, TIM1_CC1, PCNT0_S1IN and other alternate functions. |
| 62 | PC15 | bidirectional | GPIO, 5V tolerant, with LES_CH15, TIM1_CC2, LEU0_RX and other alternate functions. |
| 63 | PF0 | bidirectional | GPIO, 5V tolerant, with DBG_SWCLKTCK (debug clock, built-in pull down out of reset), BOOT_TX and other alternate functions. |
| 64 | PF1 | bidirectional | GPIO, 5V tolerant, with DBG_SWDIOTMS (debug data, built-in pull up out of reset), BOOT_RX, GPIO_EM4WU3 and other alternate functions. |
| 65 | PF2 | bidirectional | GPIO with LCD_SEG0, DBG_TDO, GPIO_EM4WU4 and other alternate functions. |
| 66 | PF3 | bidirectional | GPIO with LCD_SEG1, TIM0_CDTI0, TIM1_CC1 and other alternate functions. |
| 67 | PF4 | bidirectional | GPIO with LCD_SEG2, TIM0_CDTI1, TIM1_CC2 and other alternate functions. |
| 68 | PF5 | bidirectional | GPIO with LCD_SEG3, DBG_TDI, TIM0_CDTI2 and other alternate functions. |
| 69 | IOVDD0 | power_in | Digital IO power supply 0. |
| 70 | VSS | power_in | Ground. |
| 71 | PE8 | bidirectional | GPIO with LCD_SEG4, PRS_CH3 and other alternate functions. |
| 72 | PE9 | bidirectional | GPIO with LCD_SEG5 and other alternate functions. |
| 73 | PE10 | bidirectional | GPIO with LCD_SEG6, TIM1_CC0, US0_TX, GPIO_EM4WU9 and other alternate functions. |
| 74 | PE11 | bidirectional | GPIO with LCD_SEG7, TIM1_CC1, US0_RX, LES_ALTEX5 and other alternate functions. |
| 75 | BODEN | input | Brown-Out Detector Enable; may be left disconnected or tied to AVDD. |
| 76 | PE12 | bidirectional | GPIO with LCD_SEG8, TIM1_CC2, US0_CLK, I2C0_SDA and other alternate functions. |
| 77 | PE13 | bidirectional | GPIO with LCD_SEG9, TIM1_CC3, US0_CS, GPIO_EM4WU5 and other alternate functions. |
| 78 | PE14 | bidirectional | GPIO with LCD_SEG10, US0_CTS, LEU0_TX and other alternate functions. |
| 79 | PE15 | bidirectional | GPIO with LCD_SEG11, US0_RTS, LEU0_RX and other alternate functions. |
| 80 | PA15 | bidirectional | GPIO with LCD_SEG12, US2_CLK and other alternate functions. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SILICON LABS |
| Package | TQFP-80(12x12) |
| Category | Embedded Processors & Controllers |
| Pins | 80 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage temperature range | TSTG | -50 | 150 | °C | 19 | ||
| Voltage on any supply pin | VDDMAX | -0.3 | 3.8 | V | 19 | ||
| Voltage ramp rate on any supply pin | VDDRAMPMAX | 1 | V / µs | 19 | |||
| Total current into VDD power lines | IVDDMAX | 200 | mA | Source | 19 | ||
| Total current into VSS ground lines | IVSSMAX | 200 | mA | Sink | 19 | ||
| Current per I/O pin | IIOMAX | 50 | mA | Sink | 19 | ||
| Current for all I/O pins | IIOALLMAX | 200 | mA | Sink | 19 | ||
| Junction temperature | TJ | -40 | 105 | °C | -G grade devices | 19 | |
| Operating ambient temperature range | TA | -40 | 25 | 85 | °C | -G temperature grade | 21 |
| AVDD supply voltage | VAVDD | 1.8 | 3.3 | 3.8 | V | 21 | |
| VREGVDD operating supply voltage | VVREGVDD | 2.4 | 3.3 | 3.8 | V | DCDC in regulation | 21 |
| VREGVDD operating supply voltage | VVREGVDD | 1.8 | 3.3 | 3.8 | V | DCDC in bypass, 50mA load | 21 |
| VREGVDD current | IVREGVDD | 200 | mA | DCDC in bypass, T ≤ 85 °C | 21 | ||
| VREGVDD current | IVREGVDD | 100 | mA | DCDC in bypass, T > 85 °C | 21 | ||
| DVDD operating supply voltage | VDVDD | 1.62 | V | 21 | |||
| IOVDD operating supply voltage | VIOVDD | 1.62 | V | All IOVDD pins | 21 | ||
| DECOUPLE output capacitor | CDECOUPLE | 0.75 | 1 | 2.75 | µF | 21 | |
| HFCORECLK frequency | fCORE | 48 | MHz | VSCALE2, MODE = WS1 | 21 | ||
| HFCORECLK frequency | fCORE | 25 | MHz | VSCALE2, MODE = WS0 | 21 | ||
| HFCORECLK frequency | fCORE | 20 | MHz | VSCALE0, MODE = WS1 | 21 | ||
| HFCORECLK frequency | fCORE | 10 | MHz | VSCALE0, MODE = WS0 | 21 | ||
| HFCLK frequency | fHFCLK | 48 | MHz | VSCALE2 | 21 | ||
| HFCLK frequency | fHFCLK | 20 | MHz | VSCALE0 | 21 | ||
| Thermal resistance, TQFP80 Package | THETAJA_TQFP80 | 49.3 | °C/W | 4-Layer PCB, Air velocity = 0 m/s | 22 | ||
| Thermal resistance, TQFP80 Package | THETAJA_TQFP80 | 44.5 | °C/W | 4-Layer PCB, Air velocity = 1 m/s | 22 | ||
| Thermal resistance, TQFP80 Package | THETAJA_TQFP80 | 42.6 | °C/W | 4-Layer PCB, Air velocity = 2 m/s | 22 | ||
| DC-DC input voltage range | VDCDC_I | 1.8 | V | Bypass mode, IDCDC_LOAD = 50 mA | 23 | ||
| DC-DC input voltage range | VDCDC_I | 2.4 | V | Low noise (LN) mode, 1.8 V output, IDCDC_LOAD = 100 mA, or Low power (LP) mode, 1.8 V output, IDCDC_LOAD = 10 mA | 23 | ||
| DC-DC input voltage range | VDCDC_I | 2.6 | V | Low noise (LN) mode, 1.8 V output, IDCDC_LOAD = 200 mA | 23 | ||
| Regulation DC accuracy | ACCDC | 1.7 | 1.9 | V | Low Noise (LN) mode, 1.8 V target output | 23 | |
| Regulation window | WINREG | 1.63 | 2.2 | V | Low Power (LP) mode, LPCMPBIASEMxx = 0, 1.8 V target output, IDCDC_LOAD ≤ 75 µA | 23 | |
| Regulation window | WINREG | 1.63 | 2.1 | V | Low Power (LP) mode, LPCMPBIASEMxx = 3, 1.8 V target output, IDCDC_LOAD ≤ 10 mA | 23 | |
| Output voltage under/overshoot | VOV | 25 | 60 | mV | CCM Mode (LNFORCECCM = 1), Load changes between 0 mA and 100 mA | 23 | |
| Output voltage under/overshoot | VOV | 45 | 90 | mV | DCM Mode (LNFORCECCM = 0), Load changes between 0 mA and 10 mA | 23 | |
| Max load current | ILOAD_MAX | 200 | mA | Low noise (LN) mode, Heavy Drive, T ≤ 85 °C | 24 | ||
| Max load current | ILOAD_MAX | 100 | mA | Low noise (LN) mode, Heavy Drive, T > 85 °C | 24 | ||
| Max load current | ILOAD_MAX | 75 | µA | Low power (LP) mode, LPCMPBIASEMxx = 0 | 24 | ||
| Max load current | ILOAD_MAX | 10 | mA | Low power (LP) mode, LPCMPBIASEMxx = 3 | 24 | ||
| DCDC nominal output capacitor | CDCDC | 1 | 4.7 | 4.7 | µF | 25% tolerance | 24 |
| DCDC nominal output inductor | LDCDC | 4.7 | 4.7 | 4.7 | µH | 20% tolerance | 24 |
| Resistance in Bypass mode | RBYP | 1.2 | 2.5 | Ω | 24 | ||
| Backup supply voltage range | VBU_VIN | 1.8 | 3.8 | V | 25 | ||
| AUXHFRCO frequency accuracy | fAUXHFRCO_ACC | -3 | 3 | % | At production calibrated frequencies, across supply voltage and temperature | 40 | |
| ULFRCO oscillation frequency | fULFRCO | 0.88 | 1 | 1.12 | kHz | 40 | |
| Flash erase cycles before failure | ECFLASH | 10000 | cycles | 41 | |||
| Word (32-bit) programming time | tW_PROG | 20 | 26 | 32 | µs | Burst write, 128 words, average time per word | 41 |
| Word (32-bit) programming time | tW_PROG | 59 | 68 | 83 | µs | Single word | 41 |
| Page erase time | tPERASE | 20 | 27 | 35 | ms | 41 | |
| Mass erase time | tMERASE | 20 | 27 | 35 | ms | 41 | |
| Supply voltage during flash erase and write | VFLASH | 1.62 | 3.6 | V | 41 | ||
| Input leakage current | IIOLEAK | 0.1 | 40 | nA | All GPIO except LFXO pins, GPIO ≤ IOVDD, T ≤ 85 °C | 42 | |
| Input leakage current | IIOLEAK | 0.1 | 60 | nA | LFXO Pins, GPIO ≤ IOVDD, T ≤ 85 °C | 42 | |
| Input leakage current | IIOLEAK | 150 | nA | All GPIO except LFXO pins, GPIO ≤ IOVDD, T > 85 °C | 42 | ||
| Input leakage current | IIOLEAK | 300 | nA | LFXO Pins, GPIO ≤ IOVDD, T > 85 °C | 42 | ||
| Input leakage current on 5VTOL pads above IOVDD | I5VTOLLEAK | 3.3 | 15 | µA | IOVDD < GPIO ≤ IOVDD + 2 V | 42 | |
| I/O pin pull-up/pull-down resistor | RPUD | 30 | 40 | 65 | kΩ | 42 | |
| Pulse width of pulses removed by the glitch suppression filter | tIOGLITCH | 15 | 25 | 45 | ns | 42 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components. | 126 |
CAD (KiCad official)
- Symbol:
EFM32TG11B520F128GQ80-B - Footprint:
Package_QFP:TQFP-80_12x12mm_P0.5mm - 3D model: TQFP-80(12x12) (KiCad packages3D, STEP)
- 3D model files:
efm32tg11b520f128gq80-b-etched.step/efm32tg11b520f128gq80-b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);efm32tg11b520f128gq80-b.step/efm32tg11b520f128gq80-b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SILICON LABS datasheet (153 pp, sha256
24bd24b451bb61c6, retrieved 2026-10-26, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).