component
SMAJ6.0CAE3
Public Made by Adomby adom
Microsemi TVS, DO-214AC(SMA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSMAJ6.0CAE3
Microsemi · TVS · DO-214AC(SMA)
SMAJ6.0CAE3 from Microsemi, in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Terminal 1 | passive | First C-bend lead of the bidirectional (CA) TVS, interchangeable with the other terminal, with no polarity marking on bidirectional devices; 6.0 V standoff (VWM) and 500 W peak pulse power at 10/1000 µs. |
| 2 | Terminal 2 | passive | Second C-bend lead of the bidirectional (CA) TVS, interchangeable with the other terminal, with no cathode band on bidirectional devices; 6.0 V standoff (VWM) and 500 W peak pulse power at 10/1000 µs. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microsemi |
| Package | DO-214AC(SMA) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPP | 500 | W | 10/1000 µs | 1 | ||
| Operating and storage temperature | -65 | 150 | ºC | Operating and storage temperature | 1 | ||
| Steady-state power dissipation | 5 | W | TL = 75 ºC | 1 | |||
| Steady-state power dissipation | 1.56 | W | TA = 25 ºC, mounted on FR4 PC board with recommended footprint | 1 | |||
| Impulse repetition rate (duty factor) | 0.01 | % | Impulse repetition rate (duty factor) | 1 | |||
| Clamping time (0 V to V(BR) min.), bidirectional | 5 | ns | 0 V to V(BR) min., bidirectional | 1 | |||
| Solder temperature | 260 | ºC | 10 s maximum | 1 | |||
| Thermal resistance, junction to lead | 15 | ºC/W | Junction to lead | 1 | |||
| Thermal resistance, junction to ambient | 80 | ºC/W | Junction to ambient when mounted on FR4 PC board (1oz Cu) with recommended footprint | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • TERMINALS: C-bend (modified J-bend) leads TinLead or RoHS compliant annealed matte-Tin plating solderable per MIL-STD-750, method 2026 | 1 |
CAD (KiCad official)
- Symbol:
SMAJ6.0CAE3 - Footprint:
Diode_SMD:D_SMA - 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microsemi datasheet (5 pp, sha256
b271a9ec62e26f59, retrieved 2026-11-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).