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SMAJ6.0CAE3

Microsemi · TVS · DO-214AC(SMA)

SMAJ6.0CAE3 from Microsemi, in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Terminal 1 passive First C-bend lead of the bidirectional (CA) TVS, interchangeable with the other terminal, with no polarity marking on bidirectional devices; 6.0 V standoff (VWM) and 500 W peak pulse power at 10/1000 µs.
2 Terminal 2 passive Second C-bend lead of the bidirectional (CA) TVS, interchangeable with the other terminal, with no cathode band on bidirectional devices; 6.0 V standoff (VWM) and 500 W peak pulse power at 10/1000 µs.

Key specifications

Parameter Value
Manufacturer Microsemi
Package DO-214AC(SMA)
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power dissipation PPP 500 W 10/1000 µs 1
Operating and storage temperature -65 150 ºC Operating and storage temperature 1
Steady-state power dissipation 5 W TL = 75 ºC 1
Steady-state power dissipation 1.56 W TA = 25 ºC, mounted on FR4 PC board with recommended footprint 1
Impulse repetition rate (duty factor) 0.01 % Impulse repetition rate (duty factor) 1
Clamping time (0 V to V(BR) min.), bidirectional 5 ns 0 V to V(BR) min., bidirectional 1
Solder temperature 260 ºC 10 s maximum 1
Thermal resistance, junction to lead 15 ºC/W Junction to lead 1
Thermal resistance, junction to ambient 80 ºC/W Junction to ambient when mounted on FR4 PC board (1oz Cu) with recommended footprint 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • TERMINALS: C-bend (modified J-bend) leads Tin￾Lead or RoHS compliant annealed matte-Tin plating solderable per MIL-STD-750, method 2026 1

CAD (KiCad official)

  • Symbol: SMAJ6.0CAE3
  • Footprint: Diode_SMD:D_SMA
  • 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microsemi datasheet (5 pp, sha256 b271a9ec62e26f59, retrieved 2026-11-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF