# SMAJ6.0CAE3

**Microsemi** · TVS · DO-214AC(SMA)

SMAJ6.0CAE3 from Microsemi, in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Terminal 1 | passive | First C-bend lead of the bidirectional (CA) TVS, interchangeable with the other terminal, with no polarity marking on bidirectional devices; 6.0 V standoff (VWM) and 500 W peak pulse power at 10/1000 µs. |
| 2 | Terminal 2 | passive | Second C-bend lead of the bidirectional (CA) TVS, interchangeable with the other terminal, with no cathode band on bidirectional devices; 6.0 V standoff (VWM) and 500 W peak pulse power at 10/1000 µs. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Microsemi |
| Package | DO-214AC(SMA) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPP |  |  | 500 | W | 10/1000 µs | 1 |
| Operating and storage temperature |  | -65 |  | 150 | ºC | Operating and storage temperature | 1 |
| Steady-state power dissipation |  |  |  | 5 | W | TL = 75 ºC | 1 |
| Steady-state power dissipation |  |  |  | 1.56 | W | TA = 25 ºC, mounted on FR4 PC board with recommended footprint | 1 |
| Impulse repetition rate (duty factor) |  |  |  | 0.01 | % | Impulse repetition rate (duty factor) | 1 |
| Clamping time (0 V to V(BR) min.), bidirectional |  |  |  | 5 | ns | 0 V to V(BR) min., bidirectional | 1 |
| Solder temperature |  |  |  | 260 | ºC | 10 s maximum | 1 |
| Thermal resistance, junction to lead |  |  | 15 |  | ºC/W | Junction to lead | 1 |
| Thermal resistance, junction to ambient |  |  | 80 |  | ºC/W | Junction to ambient when mounted on FR4 PC board (1oz Cu) with recommended footprint | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | • TERMINALS: C-bend (modified J-bend) leads Tin￾Lead or RoHS compliant annealed matte-Tin plating solderable per MIL-STD-750, method 2026 | 1 |

## CAD (KiCad official)

- Symbol: `SMAJ6.0CAE3`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Microsemi datasheet](docs/smaj6-0cae3-datasheet.pdf) (5 pp, sha256 `b271a9ec62e26f59`, retrieved 2026-11-08, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smaj6-0cae3-datasheet.pdf)