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MAX3485ECMM
Public Made by Adomby adom
HGSEMI RS-485 / RS-422 ICs, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMAX3485ECMM
HGSEMI · RS-485 / RS-422 ICs · MSOP-8
MAX3485ECMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: with RE low, RO is high when A-B ≥ 200 mV and low when A-B ≤ -200 mV, and is high-Z when RE is high. |
| 2 | RE | input | Receiver output enable, active low: RO is enabled when RE is low and goes high-Z when RE is high, and RE high with DE low puts the device into low-power shutdown. |
| 3 | DE | input | Driver output enable, active high: the driver outputs are enabled when DE is high and high-Z when DE is low, and DE low with RE high puts the device into low-power shutdown. |
| 4 | DI | input | Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low. |
| 5 | GND | power_in | Ground pin; all voltages are referenced to this pin. |
| 6 | A | bidirectional | Receiver non-inverting input and driver non-inverting output; bus-side input range is -7 V to +13 V. |
| 7 | B | bidirectional | Receiver inverting input and driver inverting output; bus-side input range is -7 V to +13 V. |
| 8 | VCC | power_in | Supply pin: operating range is 3.0 to 3.6 V (3.3 V ±10%), with an absolute maximum of +7 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 7 | V | 3 | |||
| Control port voltage (RE, DE, DI) | RE, DE, DI | -0.3 | 7 | V | 3 | ||
| Bus-side input voltage (A, B) | A, B | -7 | 13 | V | 3 | ||
| Receiver output voltage (RO) | RO | -0.3 | 7 | V | 3 | ||
| Operating temperature range | 0 | 70 | ℃ | MAX3485EC | 3 | ||
| Storage temperature range | -60 | 150 | ℃ | 3 | |||
| Soldering temperature, 10 s | TLEAD | 260 | ℃ | 10 s | 3 | ||
| Supply voltage operating range | 3 | 3.6 | V | 2 | |||
| Differential output voltage, RL=54 ohm | VOD2 | 1.5 | V | Fig 2, RL = 54 Ω; max printed as VCC | 4 | ||
| Differential output voltage, RL=100 ohm | VOD2 | 2 | V | Fig 2, RL = 100 Ω; max printed as VCC | 4 | ||
| Change in differential output voltage magnitude | ΔVOD | 0.2 | V | Fig 2, RL = 54 Ω | 4 | ||
| Common-mode output voltage | VOC | 3 | V | Fig 2, RL = 54 Ω | 4 | ||
| Change in common-mode output voltage magnitude | ΔVOC | 0.2 | V | Fig 2, RL = 54 Ω | 4 | ||
| High-level input voltage | VIH | 2 | V | DE, DI, RE | 4 | ||
| Low-level input voltage | VIL | 0.8 | V | DE, DI, RE | 4 | ||
| Logic input current | IIN1 | -2 | 2 | uA | DE, DI, RE | 4 | |
| Output short-circuit current, short to high | IOSD1 | 250 | mA | Short to 0V~12V | 4 | ||
| Output short-circuit current, short to low | IOSD2 | -250 | mA | Short to -7V~0V | 4 | ||
| Input current (A, B) at VIN=12 V | IIN2 | 1 | mA | DE = 0 V, VCC=0 or 3.3V, VIN = 12 V | 5 | ||
| Input current (A, B) at VIN=-7 V | IIN2 | -0.8 | mA | DE = 0 V, VCC=0 or 3.3V, VIN = -7 V | 5 | ||
| Positive input threshold voltage | VIT+ | 200 | mV | -7V≦VCM≦12V | 5 | ||
| Negative input threshold voltage | VIT- | -200 | mV | -7V≦VCM≦12V | 5 | ||
| Input hysteresis voltage | Vhys | 10 | 30 | mV | -7V≦VCM≦12V | 5 | |
| Low-level output voltage | VOL | 0.4 | V | IOUT = +2.5mA, VID = -200 mV | 5 | ||
| Three-state input leakage current | IOZR | -1 | 1 | uA | 0.4 V < VO < 2.4 V | 5 | |
| Receiver input resistance | RIN | 12 | kΩ | -7V≦VCM≦12V | 5 | ||
| Receiver short-circuit current | IOSR | -8 | 60 | mA | 0 V≤VO≤VCC; printed ±8 (min) and ±60 (max) | 5 | |
| Supply current, driver and receiver enabled | ICC1 | 520 | 800 | uA | RE =0V, DE = 0 V | 5 | |
| Supply current, driver and receiver disabled | ICC2 | 540 | 700 | uA | RE =VCC, DE=VCC | 5 | |
| Shutdown current | ISHDN | 0.5 | 30 | uA | RE =VCC, DE=0V | 5 | |
| Driver differential output delay | tDD | 10 | 35 | ns | RDIFF = 60 Ω, CL1=CL2=100pF | 6 | |
| Driver differential transition time | tTD | 12 | 25 | ns | 6 | ||
| Driver propagation delay, low to high | tPLH | 8 | 35 | ns | RDIFF = 27 Ω, (见图 3 与图 4) | 6 | |
| Driver propagation delay, high to low | tPHL | 8 | 35 | ns | 6 | ||
| Driver propagation delay skew /tPLH-tPHL/ | tPDS | 1 | 8 | ns | 6 | ||
| Driver enable to output high | tPZH | 20 | 90 | ns | RL = 110Ω, (见图 5、6) | 6 | |
| Driver enable to output low | tPZL | 20 | 90 | ns | 6 | ||
| Driver input low to disable | tPLZ | 20 | 80 | ns | RL = 110Ω, (见图 5、6) | 6 | |
| Driver input high to disable | tPHZ | 20 | 80 | ns | 6 | ||
| Driver enable to output high in shutdown | tDSH | 500 | 900 | ns | RL = 110Ω, (见图 5、6) | 6 | |
| Driver enable to output low in shutdown | tDSL | 500 | 900 | ns | 6 | ||
| Receiver propagation delay, low to high | tRPLH | 80 | 150 | ns | CL=15pF, 见图 7 与图 8 | 7 | |
| Receiver propagation delay, high to low | tRPHL | 80 | 150 | ns | 7 | ||
| Receiver propagation delay skew /tRPLH - tRPHL/ | tRPDS | 7 | 10 | ns | 7 | ||
| Receiver enable to output low | tRPZL | 20 | 50 | ns | CL=15pF, 见图 7 与图 8 | 7 | |
| Receiver enable to output high | tRPZH | 20 | 50 | ns | 7 | ||
| Receiver output low to disable | tPRLZ | 20 | 45 | ns | CL=15pF, 见图 7 与图 8 | 7 | |
| Receiver output high to disable | tPRHZ | 20 | 45 | ns | 7 | ||
| Receiver enable to output high in shutdown | tRPSH | 200 | 1400 | ns | CL=15pF, 见图 7 与图 8 | 7 | |
| Receiver enable to output low in shutdown | tRPSL | 200 | 1400 | ns | 7 | ||
| Time to enter shutdown | tSHDN | 80 | 300 | ns | NOTE2 | 7 |
CAD (KiCad official)
- Symbol:
MAX3485ECMM - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
max3485ecmm-etched.step/max3485ecmm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max3485ecmm.step/max3485ecmm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (17 pp, sha256
2c206ef20fa97d7e, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).