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MAX3485ECMM

HGSEMI · RS-485 / RS-422 ICs · MSOP-8

MAX3485ECMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A-B ≥ 200 mV and low when A-B ≤ -200 mV, and is high-Z when RE is high.
2 RE input Receiver output enable, active low: RO is enabled when RE is low and goes high-Z when RE is high, and RE high with DE low puts the device into low-power shutdown.
3 DE input Driver output enable, active high: the driver outputs are enabled when DE is high and high-Z when DE is low, and DE low with RE high puts the device into low-power shutdown.
4 DI input Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground pin; all voltages are referenced to this pin.
6 A bidirectional Receiver non-inverting input and driver non-inverting output; bus-side input range is -7 V to +13 V.
7 B bidirectional Receiver inverting input and driver inverting output; bus-side input range is -7 V to +13 V.
8 VCC power_in Supply pin: operating range is 3.0 to 3.6 V (3.3 V ±10%), with an absolute maximum of +7 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 7 V 3
Control port voltage (RE, DE, DI) RE, DE, DI -0.3 7 V 3
Bus-side input voltage (A, B) A, B -7 13 V 3
Receiver output voltage (RO) RO -0.3 7 V 3
Operating temperature range 0 70 ℃ MAX3485EC 3
Storage temperature range -60 150 ℃ 3
Soldering temperature, 10 s TLEAD 260 ℃ 10 s 3
Supply voltage operating range 3 3.6 V 2
Differential output voltage, RL=54 ohm VOD2 1.5 V Fig 2, RL = 54 Ω; max printed as VCC 4
Differential output voltage, RL=100 ohm VOD2 2 V Fig 2, RL = 100 Ω; max printed as VCC 4
Change in differential output voltage magnitude ΔVOD 0.2 V Fig 2, RL = 54 Ω 4
Common-mode output voltage VOC 3 V Fig 2, RL = 54 Ω 4
Change in common-mode output voltage magnitude ΔVOC 0.2 V Fig 2, RL = 54 Ω 4
High-level input voltage VIH 2 V DE, DI, RE 4
Low-level input voltage VIL 0.8 V DE, DI, RE 4
Logic input current IIN1 -2 2 uA DE, DI, RE 4
Output short-circuit current, short to high IOSD1 250 mA Short to 0V~12V 4
Output short-circuit current, short to low IOSD2 -250 mA Short to -7V~0V 4
Input current (A, B) at VIN=12 V IIN2 1 mA DE = 0 V, VCC=0 or 3.3V, VIN = 12 V 5
Input current (A, B) at VIN=-7 V IIN2 -0.8 mA DE = 0 V, VCC=0 or 3.3V, VIN = -7 V 5
Positive input threshold voltage VIT+ 200 mV -7V≦VCM≦12V 5
Negative input threshold voltage VIT- -200 mV -7V≦VCM≦12V 5
Input hysteresis voltage Vhys 10 30 mV -7V≦VCM≦12V 5
Low-level output voltage VOL 0.4 V IOUT = +2.5mA, VID = -200 mV 5
Three-state input leakage current IOZR -1 1 uA 0.4 V < VO < 2.4 V 5
Receiver input resistance RIN 12 kΩ -7V≦VCM≦12V 5
Receiver short-circuit current IOSR -8 60 mA 0 V≤VO≤VCC; printed ±8 (min) and ±60 (max) 5
Supply current, driver and receiver enabled ICC1 520 800 uA RE =0V, DE = 0 V 5
Supply current, driver and receiver disabled ICC2 540 700 uA RE =VCC, DE=VCC 5
Shutdown current ISHDN 0.5 30 uA RE =VCC, DE=0V 5
Driver differential output delay tDD 10 35 ns RDIFF = 60 Ω, CL1=CL2=100pF 6
Driver differential transition time tTD 12 25 ns 6
Driver propagation delay, low to high tPLH 8 35 ns RDIFF = 27 Ω, (见图 3 与图 4) 6
Driver propagation delay, high to low tPHL 8 35 ns 6
Driver propagation delay skew /tPLH-tPHL/ tPDS 1 8 ns 6
Driver enable to output high tPZH 20 90 ns RL = 110Ω, (见图 5、6) 6
Driver enable to output low tPZL 20 90 ns 6
Driver input low to disable tPLZ 20 80 ns RL = 110Ω, (见图 5、6) 6
Driver input high to disable tPHZ 20 80 ns 6
Driver enable to output high in shutdown tDSH 500 900 ns RL = 110Ω, (见图 5、6) 6
Driver enable to output low in shutdown tDSL 500 900 ns 6
Receiver propagation delay, low to high tRPLH 80 150 ns CL=15pF, 见图 7 与图 8 7
Receiver propagation delay, high to low tRPHL 80 150 ns 7
Receiver propagation delay skew /tRPLH - tRPHL/ tRPDS 7 10 ns 7
Receiver enable to output low tRPZL 20 50 ns CL=15pF, 见图 7 与图 8 7
Receiver enable to output high tRPZH 20 50 ns 7
Receiver output low to disable tPRLZ 20 45 ns CL=15pF, 见图 7 与图 8 7
Receiver output high to disable tPRHZ 20 45 ns 7
Receiver enable to output high in shutdown tRPSH 200 1400 ns CL=15pF, 见图 7 与图 8 7
Receiver enable to output low in shutdown tRPSL 200 1400 ns 7
Time to enter shutdown tSHDN 80 300 ns NOTE2 7

CAD (KiCad official)

  • Symbol: MAX3485ECMM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: max3485ecmm-etched.step / max3485ecmm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3485ecmm.step / max3485ecmm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (17 pp, sha256 2c206ef20fa97d7e, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF