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PIC12F1572-E
Public Made by Adomby adom
Microchip Tech Pre-ordered MCUs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPIC12F1572-E
Microchip Tech · Pre-ordered MCUs · SOIC-8
PIC12F1572-E from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Positive supply; the PIC12F1572 operating voltage range is stated as 2.3V to 5.5V. |
| 2 | RA5 | bidirectional | General purpose I/O, also serving as T1CKI Timer1 clock input, CLKIN external clock input in EC mode, and PWM1 output. |
| 3 | RA4 | bidirectional | General purpose I/O, also serving as AN3 ADC channel input, T1G Timer1 gate input, and CLKOUT FOSC/4 output. |
| 4 | RA3 | input | General purpose input with IOC and WPU; input-only pin that also serves as MCLR with internal pull-up and as VPP programming voltage. |
| 5 | RA2 | bidirectional | General purpose I/O, also serving as AN2 ADC channel input, C1OUT comparator output, T0CKI Timer0 clock input, and INT external interrupt. |
| 6 | RA1 | bidirectional | General purpose I/O, also serving as AN1 ADC channel input, VREF+ ADC voltage reference input, C1IN0- comparator negative input, and ICSPCLK ICSP programming clock. |
| 7 | RA0 | bidirectional | General purpose I/O, also serving as AN0 ADC channel input, C1IN+ comparator positive input, DACOUT, and ICSPDAT ICSP data I/O. |
| 8 | VSS | power_in | Ground reference. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-8 |
| Category | Embedded Processors & Controllers |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage VDD, FOSC <= 16 MHz | VDD | 2.3 | 5.5 | V | FOSC <= 16 MHz | 262 | |
| Supply voltage VDD, FOSC <= 32 MHz | VDD | 2.5 | 5.5 | V | FOSC <= 32 MHz (Note 3, PLL required) | 262 | |
| Operating supply voltage VDDMIN | VDD | 2.3 | V | PIC12F1571/2 VDDMIN (FOSC <= 16 MHz) | 260 | ||
| Operating supply voltage VDDMAX | VDD | 5.5 | V | PIC12F1571/2 VDDMAX | 260 | ||
| Operating ambient temperature, industrial | TA | -40 | 85 | C | Industrial temperature range | 260 | |
| Operating ambient temperature, extended | TA | -40 | 125 | C | Extended temperature range | 260 | |
| Ambient temperature under bias | -40 | 125 | C | 259 | |||
| Storage temperature | -65 | 150 | C | 259 | |||
| Voltage on VDD pin, PIC12F1571/2 | VDD | -0.3 | 6.5 | V | with respect to VSS | 259 | |
| Voltage on MCLR pin | MCLR | -0.3 | 9 | V | with respect to VSS | 259 | |
| Voltage on all other pins | -0.3 | V | with respect to VSS; upper limit printed as VDD + 0.3V | 259 | |||
| Maximum current on VSS pin | 250 | mA | -40C <= TA <= +85C | 259 | |||
| Maximum current on VSS pin | 85 | mA | +85C <= TA <= +125C | 259 | |||
| Maximum current on VDD pin | 250 | mA | -40C <= TA <= +85C | 259 | |||
| Maximum current on VDD pin | 85 | mA | +85C <= TA <= +125C | 259 | |||
| Sunk by any standard I/O pin | 50 | mA | 259 | ||||
| Sourced by any standard I/O pin | 50 | mA | 259 | ||||
| Clamp current | IK | 20 | mA | VPIN < 0 or VPIN > VDD | 259 | ||
| Input low voltage, I/O ports with TTL buffer | VIL | 0.8 | V | 4.5V <= VDD <= 5.5V | 268 | ||
| Input high voltage, I/O ports with TTL buffer | VIH | 2 | V | 4.5V <= VDD <= 5.5V | 268 | ||
| Output low voltage, I/O ports | VOL | 0.6 | V | IOL = 8 mA, VDD = 5V | 268 | ||
| Input leakage current, I/O ports | IIL | -125 | 125 | nA | VSS <= VPIN <= VDD, pin at high-impedance, +85C | 268 | |
| Input leakage current, I/O ports | IIL | -1000 | 1000 | nA | VSS <= VPIN <= VDD, pin at high-impedance, +125C | 268 | |
| Input leakage current, MCLR | IIL | -200 | 200 | nA | VSS <= VPIN <= VDD, pin at high-impedance, +85C | 268 | |
| Weak pull-up current | IPUR | 25 | 100 | 200 | µA | VDD = 3.3V, VPIN = VSS | 268 |
| Capacitive loading on all I/O pins | CIO | 50 | pF | 268 | |||
| RAM data retention voltage | VDR | 1.7 | V | Device in Sleep mode | 262 | ||
| VDD rise rate | SVDD | 0.05 | V/ms | Ensures that the Power-on Reset signal is released properly | 262 | ||
| Brown-out Reset voltage, BORV = 0 | VBOR | 2.55 | 2.7 | 2.85 | V | BORV = 0 | 276 |
| Brown-out Reset voltage, BORV = 1 (PIC12F1571/2) | VBOR | 2.35 | 2.45 | 2.58 | V | BORV = 1 (PIC12F1571/2) | 276 |
| Brown-out Reset hysteresis | VHYST | 0 | 25 | 60 | mV | -40C <= TA <= +85C | 276 |
| Low-Power Brown-out Reset voltage | VLPBOR | 1.8 | 2.1 | 2.5 | V | LPBOR = 1 | 276 |
| Power-up Timer period | TPWRT | 40 | 65 | 140 | ms | PWRTE = 0 | 276 |
| MCLR pulse width (low) | TMCL | 2 | s | 276 | |||
| FOSC to CLKOUT | TosH2ckL | 70 | ns | 3.3V <= VDD <= 5.0V | 274 | ||
| External CLKIN frequency, ECL | FOSC | 0.5 | MHz | External Clock (ECL) | 272 | ||
| External CLKIN frequency, ECM | FOSC | 4 | MHz | External Clock (ECM) | 272 | ||
| External CLKIN frequency, ECH | FOSC | 20 | MHz | External Clock (ECH) | 272 | ||
| External CLKIN period | TOSC | 50 | ns | External Clock (EC) | 272 | ||
| Oscillator frequency range | F10 | 4 | 8 | MHz | 273 | ||
| On-chip VCO system frequency | F11 | 16 | 32 | MHz | 273 | ||
| PLL start-up time (lock time) | TRC | 2 | ms | 273 | |||
| HFINTOSC frequency tolerance | OS08 | -2 | 2 | % | VDD = 3.0V, TA = 25C | 273 | |
| HFINTOSC frequency tolerance | OS08 | -5 | 5 | % | Over VDD and temperature range (Figure 26-6) | 273 | |
| ADC integral error | EIL | -1.7 | 1.7 | LSb | VREF = 3.0V | 278 | |
| ADC gain error | EGN | -2 | 2 | LSb | VREF = 3.0V | 278 | |
| ADC reference voltage | VREF | 1.8 | V | VREF = (VRPOS - VRNEG) | 278 | ||
| Comparator response time, rising edge | TRESP | 400 | 800 | ns | CxSP = 1 | 281 | |
| Comparator response time, falling edge | TRESP | 200 | 400 | ns | CxSP = 1 | 281 | |
| Characteristic retention | TRETD | 40 | Year | Provided no other specifications are violated | 269 | ||
| Power-down/operating current, LFINTOSC 31 kHz | IDD | 13 | 21 | µA | VDD 2.3V; FOSC = 31 kHz, LFINTOSC, -40C <= TA <= +85C | 264 | |
| FVR gain voltage accuracy for ADC, 1x | VADFVR | -4 | 4 | % | 1x VFVR, ADFVR = 01, VDD 2.5V | 262 | |
| FVR gain voltage accuracy for ADC, 2x | VADFVR | -4 | 4 | % | 2x VFVR, ADFVR = 10, VDD 2.5V | 262 | |
| FVR gain voltage accuracy for ADC, 4x | VADFVR | -4 | 4 | % | 4x VFVR, ADFVR = 11, VDD 4.75V | 262 | |
| Fixed Voltage Reference voltage | VFVR | 1.024 | V | -40C <= TA <= +85C | 262 | ||
| Power-on Reset release voltage | VPOR | 1.6 | V | 262 | |||
| Thermal resistance junction to ambient, 8-pin SOIC | JA | 149.5 | C/W | 8-pin SOIC package | 270 |
CAD (KiCad official)
- Symbol:
PIC12F1572-E - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
pic12f1572-e-etched.step/pic12f1572-e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pic12f1572-e.step/pic12f1572-e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (334 pp, sha256
c28be7d052c3bf4f, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).