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TPS26611DDFR
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Texas Instruments Power Management - Specialized, TSOT-23-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS26611DDFR
Texas Instruments · Power Management - Specialized · TSOT-23-8
TPS26611DDFR from Texas Instruments, in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Reference ground for all internal voltages; connect to GND of the ±Vs supply. |
| 2 | MODE | input | MODE selection pin for overload response; sets current limit to IOL, 2 × IOL, or 2 × IOL with extended IOL expiry time (GND, open, or 180 kΩ to GND), absolute max −0.3 to 5.5 V. |
| 3 | -Vs | power_in | Negative supply for dual supply configurations; connect to GND when used in a single supply configuration (recommended −20 V to 0 V). |
| 4 | IN | passive | Signal/power input, rated for −50 V to 50 V operating (±55 V absolute maximum). |
| 5 | OUT | passive | Signal/power output, rated for −50 V to 50 V operating (±55 V absolute maximum). |
| 6 | +Vs | power_in | Positive supply for powering the device, recommended 0 to 30 V (absolute max 32 V). |
| 7 | EN | input | Enable control on the TPS26611: pull EN low to turn off the device; it has an internal pullup and can be left floating to enable the device. |
| 8 | SGOOD | output | Signal good indicator that is low when the device is within normal operating condition and high on fault conditions; can drive an external LED, sourcing current from +Vs. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | TSOT-23-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IN, OUT, IN-OUT voltage | -55 | 55 | V | 4 | |||
| SGOOD, EN, MODE, VSNS voltage | -0.3 | 5.5 | V | 4 | |||
| +Vs voltage | +Vs | -0.3 | 32 | V | 4 | ||
| -Vs voltage | -Vs | -22 | 0.3 | V | 4 | ||
| SGOOD current | ISGOOD | 200 | µA | 4 | |||
| Operating junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| IN, OUT voltage | -50 | 50 | V | 4 | |||
| +Vs supply voltage | +Vs | 0 | 30 | V | 4 | ||
| -Vs supply voltage | -Vs | -20 | 0 | V | 4 | ||
| EN, SGOOD, VSNS voltage | 0 | 5 | V | 4 | |||
| MODE voltage | 0 | 3 | V | 4 | |||
| Operating junction temperature | TJ | -40 | 125 | °C | 4 | ||
| IN signal voltage | V(IN) | -50 | 50 | V | 5 | ||
| Leakage from IN and OUT to GND, normal operation | IQ | -0.1 | 0.1 | µA | (-Vs) < VIN, VOUT < (+Vs, 0.35 V) | 5 | |
| Leakage from IN and OUT to GND, near +Vs | IQ | 1 | µA | (+Vs, 0.35 V) < VIN, VOUT < +Vs | 5 | ||
| Leakage to -Vs during fault, % of loop current | IQFLT | 20 | % | VIN > +Vs, Current Limit Operation | 5 | ||
| Bipolar current limit | I(OL) | 25 | 32 | 40 | mA | V(IN)-V(OUT) = ±1 V, -Vs connected to negative supply; printed ± | 5 |
| Unipolar current limit | I(OL) | 25 | 32 | 40 | mA | V(IN)-V(OUT) = +1 V, -Vs connected to GND | 5 |
| Transient pulse over current limit | I(OL_Pulse) | 50 | 60 | 72 | mA | V(IN)-V(OUT) = +1.5 V, MODE = Floating | 5 |
| Fast-trip current limit | I(FASTRIP) | 65 | 165 | mA | MODE = GND; printed ± | 5 | |
| Fast-trip current limit | I(FASTRIP) | 140 | 275 | mA | MODE = Floating or 180 kΩ to GND; printed ± | 5 | |
| Off-state leakage sum IN+OUT (VIN swept) | IOff-Lkg-IN + IOff-Lkg-OUT | -9.75 | -5.25 | µA | -12.5 V < VIN <12.5 V; VOUT = 0 V; EN = Low; +Vs = 15V; -Vs = -15 V | 5 | |
| Off-state leakage sum IN+OUT (VOUT swept) | IOff-Lkg-IN + IOff-Lkg-OUT | -9.75 | -5.25 | µA | -12.5 V < VOUT < 12.5 V; VIN = 0 V; EN = Low; +Vs = 15V; -Vs = -15 V | 5 | |
| Off-state leakage from IN | IOff-Lkg-IN | -6 | -1 | µA | -12.5 V< VIN <12.5 V; VOUT = 0 V; EN = Low; +Vs = 15V; -Vs = -15 V | 5 | |
| Off-state leakage from OUT | IOff-Lkg-OUT | -6 | -1 | µA | -12.5 V < VOUT < 12.5 V; VIN = 0 V; EN = Low; +Vs = 15V; -Vs = -15 V | 5 | |
| OUT overvoltage threshold, rising (relative to +Vs) | VOUT_OVLO | 0.05 | 0.3 | V | TPS26610/11/13/14 Only; printed (+Vs)+0.05 to (+Vs)+0.30 | 5 | |
| OUT overvoltage hysteresis | VOUT_OVLO_hyst | 30 | 75 | mV | 5 | ||
| OUT/IN undervoltage threshold, falling (relative to -Vs) | VO/I_UVLO | -0.4 | -0.2 | V | TPS26610/11/12 Only; printed (-Vs)-0.40 to (-Vs)-0.20 | 5 | |
| OUT/IN undervoltage hysteresis | VO/I_UVLO_hyst | 30 | 75 | mV | TPS26610/11/12 Only | 6 | |
| +Vs supply operating voltage | V(+Vs) | 2.25 | 30 | V | TPS26610/11/13/14 | 6 | |
| -Vs supply operating voltage | V(-Vs) | -20 | 0 | V | 6 | ||
| Difference between +Vs and -Vs | Vs_DIFF | 3 | 50 | V | 6 | ||
| +Vs current, normal operation | I(+Vs) | 1.07 | 1.65 | mA | SGOOD = Floating | 6 | |
| +Vs current, fault operation | I(+Vs) | 1.2 | 1.75 | mA | SGOOD = Floating | 6 | |
| Current sinked by -Vs supply | I(-Vs) | 0.2 | mA | 6 | |||
| OFF state supply current | IVS_OFF | 0.27 | mA | EN = Low | 6 | ||
| IN to OUT total ON resistance | RON | 4.8 | 7.5 | 12.5 | Ω | -40 ℃ < T < 125 ℃, I(IN) < Overload Current | 6 |
| EN rising threshold | V(ENR) | 1.72 | V | 6 | |||
| EN falling threshold | V(ENF) | 1 | V | 6 | |||
| EN leakage current (sink) | I(EN_LKG) | 10 | µA | V(EN) = 5.5 V | 6 | ||
| EN leakage current (source) | I(EN_LKG) | -10 | µA | V(EN) = 0 V | 6 | ||
| EN open circuit voltage | V(EN) | 2.1 | 2.5 | V | I(EN) = -0.1 µA | 6 | |
| SGOOD output level, HIGH | VOH_SGOOD | 2 | 3 | V | (+Vs) > 2.5 V, 0 mA < ISGOOD< 1 mA | 7 | |
| SGOOD pull down impedance | RSGOOD | 6.3 | kΩ | 0 µA < ISGOOD < 200 µA | 7 | ||
| MODE source current | I(MODE) | 1.55 | 2 | 2.4 | µA | 7 | |
| Mode selection resistor | RMODE | 180 | kΩ | 7 | |||
| Thermal shutdown threshold, rising | T(TSD) | 160 | °C | 7 | |||
| Thermal shutdown hysteresis | T(TSDHyst) | 11 | °C | 7 | |||
| Turn ON delay with Vs supply | tON_dly | 120 | µs | Delay from +Vs/-Vs supply applied to FET on, EN = Floating | 7 | ||
| Overload current limit response time | tOL | 30 | 55 | µs | Load transient from 20 mA to 50 mA. Time from Load Transient to Current coming within 20%.of IOL. | 7 | |
| Pulse overload current limit response time | tOL_PULSE | 20 | 50 | µs | Load transient from 20 mA to 80 mA. Time from Load Transient to Current coming within 20% of IOL_Pulse | 7 | |
| OUT OVLO cutoff detection time | tOUT_OV_CUT | 1 | 5 | µs | V(OUT) ↑ 100 mV above VOUT_OVLO to FET OFF | 7 | |
| Junction-to-ambient thermal resistance | RθJA | 117.8 | °C/W | DDF (SOT-23-THN), 8 pins | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 57.6 | °C/W | DDF (SOT-23-THN), 8 pins | 4 | ||
| Junction-to-board thermal resistance | RθJB | 40.2 | °C/W | DDF (SOT-23-THN), 8 pins | 4 |
CAD (KiCad official)
- Symbol:
TPS26611DDFR - Footprint:
Package_TO_SOT_SMD:TSOT-23-8 - 3D model: TSOT-23-8 (KiCad packages3D, STEP)
- 3D model files:
tps26611ddfr-etched.step/tps26611ddfr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps26611ddfr.step/tps26611ddfr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (45 pp, sha256
d7602fcda1d74f81, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).