ISL55210IRTZ from RENESAS, in a TQFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	FB+	passive	Positive output feedback resistor connection, used with the external feedback and gain-setting resistors.
2	Vi-	input	Inverting amplifier input.
3	Vi+	input	Noninverting amplifier input.
4	FB-	passive	Negative output feedback resistor connection, used with the external feedback and gain-setting resistors.
5	GND	power_in	Supply ground; electrically connected to the thermal pad.
6	VS+	power_in	Positive power supply, specified in the pin table at 3.0V to 4.5V.
7	PD	input	Power-down input: logic low puts the part into low-power mode, while logic high or a 1kΩ connection to VS+ gives normal operation.
8	GND	power_in	Supply ground; electrically connected to the thermal pad.
9	VO-	output	Inverting amplifier output.
10	NC	unconnected	No internal connection.
11	NC	unconnected	No internal connection.
12	VO+	output	Noninverting amplifier output.
13	GND	power_in	Supply ground; electrically connected to the thermal pad.
14	VCM	input	Common-mode voltage input for the output common mode; the internal default is about 1.2V nominal when left open.
15	VS+	power_in	Positive power supply, specified in the pin table at 3.0V to 4.5V.
16	GND	power_in	Supply ground; electrically connected to the thermal pad.
17	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	RENESAS
Package	TQFN-16(3x3)
Category	Interface ICs
Pins	17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Open-loop Voltage Gain (AOL)	AOL	86	100		dB	Differential	4
Input Offset Voltage		-1.4	0.1	1.4	mV	TA = +25°C	4
Input Offset Voltage		-1.6	0.1	1.6	mV	TA = -40°C to +85°C	4
Input Bias Current		50		120	µA	TA = +25°C, positive current into the pin	4
Input Bias Current		50		140	µA	TA = -40°C to +85°C	4
Input Offset Current		-5	1	5	µA	TA = +25°C	4
Input Offset Current		-6	1	6	µA	TA = -40°C to +85°C	4
Common-mode Input Range High				1.7	V		4
Common-mode Input Range Low		1.1			V		4
Common-mode Rejection Ratio		56	75		dB	f < 10MHz, common mode to differential output	4
Maximum Output Voltage		2.15	2.35		V	Each output (with 200Ω differential load), linear operation	4
Minimum Output Voltage			0.45	0.63	V		4
Differential Output Voltage Swing		3.04	3.8		VP-P	TA = +25°C	4
Differential Output Voltage Swing		2.95			V	TA = -40°C to +85°C	4
Differential Output Current Drive		40	45		mA	RL = 10Ω [sourcing or sinking]	4
Gain, VCM input pin		0.995	0.999		V/V	VCM input pin 1.0V to 1.4V	4
Output Common-Mode Offset from CM Input		-8	1	8	mV		4
CM Default Voltage Output VCM		1.18	1.2	1.22	V	VCM pin floating	4
CM Input Voltage Range		0.9		1.9	V	At control pin	4
Specified Operation Voltage		3	3.3	4.2	V		4
Quiescent Current		33	35	37	mA	TA = +25°, VS+ = 3.3V, VS- = 0V	4
Quiescent Current		30.5	36	39.5	mA	TA = -40°C to +85°C	4
Power-supply Rejection (PSRR)		56	90		dB	VS+ 3.0V - 4.5V range	4
Supply Voltage from VS+ to GND				4.5	V		3
ESD Rating, Human Body Model				3500	V	Per MIL-STD-883 Method 3015.7	3
ESD Rating, Machine Model				250	V	Per EIAJ ED-4701 Method C-111	3
ESD Rating, Charged Device Model				1500	V		3
Storage Temperature		-65		125	°C		3
Maximum Continuous Operating Junction Temperature				135	°C		3
Ambient Operating Temperature		-40		85	°C		3
Thermal Resistance, Junction to Ambient	JA		63		°C/W	16 Ld TQFN, free air, high effective thermal conductivity board with direct attach	3
Thermal Resistance, Junction to Case	JC		16.5		°C/W	Case temp at center of exposed metal pad	3
Thermal Resistance, Junction to Ambient (insulating layer under exposed pad)	JA		120		°C/W	Exposed pad mounted to an insulating layer (device measurement)	14

CAD (KiCad official)

Symbol: ISL55210IRTZ
Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
3D model: TQFN-16(3x3) (KiCad packages3D, STEP)
3D model files: isl55210irtz-etched.step / isl55210irtz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl55210irtz.step / isl55210irtz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: RENESAS datasheet (19 pp, sha256 3fb5bd86736e1a0f, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ISL55210IRTZ

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3D Model

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Datasheet

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