component

ISL55210IRTZ

Public Made by Adom

by adom

RENESAS Pre-ordered Chips, TQFN-16(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icsisl55210irtzfactory-2.0.0extractor-text

Verified ISL55210IRTZ

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 17 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: ISL55210IRTZ · TQFN-16(3x3) · 17 pins
  • ✓copper: 17 copper pads, none touching another net
  • ✓datasheet: all 17 pin names found in the 19-page datasheet
  • ✓distributor: lcsc C1346691, digikey ISL55210IRTZ-ND, mouser 968-ISL55210IRTZ
  • ✓family: QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-dlempsfj/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • ✓package_fit: height within the datasheet's package drawing (datasheet p.19)
  • ✓pads: 17 pins = 17 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 17 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ isl55210irtz.kicad_sym✓ isl55210irtz.kicad_mod✓ isl55210irtz.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 10d ago
viewers isl55210irtz: viewers · Ray 10d ago
isl55210irtz-etched.glb Publish 0.1.0 · Ray 10d ago
isl55210irtz-etched.step isl55210irtz: factory component page (tier=mfr) · Ray 10d ago
isl55210irtz-hero.glb isl55210irtz: hero GLB from the etched model (keeps the MPN mark) · Ray 10d ago
isl55210irtz-hero.overlay.json Publish 0.1.0 · Ray 10d ago
isl55210irtz.glb Publish 0.1.0 · Ray 10d ago
isl55210irtz.kicad_mod Publish 0.1.0 · Ray 10d ago
isl55210irtz.kicad_sym Publish 0.1.0 · Ray 10d ago
isl55210irtz.lbr Publish 0.1.0 · Ray 10d ago
isl55210irtz.step Publish 0.1.0 · Ray 10d ago
package.json Publish 0.1.0 · Ray 10d ago
page.json Set visibility: public · Ray 10d ago
README.md Publish 0.1.0 · Ray 10d ago
verification.json Verified: Published by the parts factory: tier mfr, 17 pins · Ray 10d ago

ISL55210IRTZ

RENESAS · Pre-ordered Chips · TQFN-16(3x3)

ISL55210IRTZ from RENESAS, in a TQFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FB+ passive Positive output feedback resistor connection, used with the external feedback and gain-setting resistors.
2 Vi- input Inverting amplifier input.
3 Vi+ input Noninverting amplifier input.
4 FB- passive Negative output feedback resistor connection, used with the external feedback and gain-setting resistors.
5 GND power_in Supply ground; electrically connected to the thermal pad.
6 VS+ power_in Positive power supply, specified in the pin table at 3.0V to 4.5V.
7 PD input Power-down input: logic low puts the part into low-power mode, while logic high or a 1kΩ connection to VS+ gives normal operation.
8 GND power_in Supply ground; electrically connected to the thermal pad.
9 VO- output Inverting amplifier output.
10 NC unconnected No internal connection.
11 NC unconnected No internal connection.
12 VO+ output Noninverting amplifier output.
13 GND power_in Supply ground; electrically connected to the thermal pad.
14 VCM input Common-mode voltage input for the output common mode; the internal default is about 1.2V nominal when left open.
15 VS+ power_in Positive power supply, specified in the pin table at 3.0V to 4.5V.
16 GND power_in Supply ground; electrically connected to the thermal pad.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer RENESAS
Package TQFN-16(3x3)
Category Interface ICs
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Open-loop Voltage Gain (AOL) AOL 86 100 dB Differential 4
Input Offset Voltage -1.4 0.1 1.4 mV TA = +25°C 4
Input Offset Voltage -1.6 0.1 1.6 mV TA = -40°C to +85°C 4
Input Bias Current 50 120 µA TA = +25°C, positive current into the pin 4
Input Bias Current 50 140 µA TA = -40°C to +85°C 4
Input Offset Current -5 1 5 µA TA = +25°C 4
Input Offset Current -6 1 6 µA TA = -40°C to +85°C 4
Common-mode Input Range High 1.7 V 4
Common-mode Input Range Low 1.1 V 4
Common-mode Rejection Ratio 56 75 dB f < 10MHz, common mode to differential output 4
Maximum Output Voltage 2.15 2.35 V Each output (with 200Ω differential load), linear operation 4
Minimum Output Voltage 0.45 0.63 V 4
Differential Output Voltage Swing 3.04 3.8 VP-P TA = +25°C 4
Differential Output Voltage Swing 2.95 V TA = -40°C to +85°C 4
Differential Output Current Drive 40 45 mA RL = 10Ω [sourcing or sinking] 4
Gain, VCM input pin 0.995 0.999 V/V VCM input pin 1.0V to 1.4V 4
Output Common-Mode Offset from CM Input -8 1 8 mV 4
CM Default Voltage Output VCM 1.18 1.2 1.22 V VCM pin floating 4
CM Input Voltage Range 0.9 1.9 V At control pin 4
Specified Operation Voltage 3 3.3 4.2 V 4
Quiescent Current 33 35 37 mA TA = +25°, VS+ = 3.3V, VS- = 0V 4
Quiescent Current 30.5 36 39.5 mA TA = -40°C to +85°C 4
Power-supply Rejection (PSRR) 56 90 dB VS+ 3.0V - 4.5V range 4
Supply Voltage from VS+ to GND 4.5 V 3
ESD Rating, Human Body Model 3500 V Per MIL-STD-883 Method 3015.7 3
ESD Rating, Machine Model 250 V Per EIAJ ED-4701 Method C-111 3
ESD Rating, Charged Device Model 1500 V 3
Storage Temperature -65 125 °C 3
Maximum Continuous Operating Junction Temperature 135 °C 3
Ambient Operating Temperature -40 85 °C 3
Thermal Resistance, Junction to Ambient JA 63 °C/W 16 Ld TQFN, free air, high effective thermal conductivity board with direct attach 3
Thermal Resistance, Junction to Case JC 16.5 °C/W Case temp at center of exposed metal pad 3
Thermal Resistance, Junction to Ambient (insulating layer under exposed pad) JA 120 °C/W Exposed pad mounted to an insulating layer (device measurement) 14

CAD (KiCad official)

  • Symbol: ISL55210IRTZ
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: TQFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: isl55210irtz-etched.step / isl55210irtz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl55210irtz.step / isl55210irtz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (19 pp, sha256 3fb5bd86736e1a0f, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF