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Contents

README

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SFG08R06DF

ORIENTAL SEMI · MOSFETs · TO-252-2

SFG08R06DF from ORIENTAL SEMI, in a TO-252-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limit is ±20 V, with threshold VGS(th) of 1.0 V min to 2.5 V max at VDS=VGS, ID=250 μA.
2 D passive Drain (middle lead and the exposed tab); VDS rated 80 V, continuous ID 100 A at TC=25 °C and pulsed ID 300 A.
3 S passive Source; continuous body-diode forward current IS is 100 A at TC=25 °C (pulsed 300 A).

Key specifications

Parameter Value
Manufacturer ORIENTAL SEMI
Package TO-252-2
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate-source leakage current (VGS=-20 V) IGSS -100 nA VGS=-20 V 2
Gate-source leakage current (VGS=20 V) IGSS 100 nA VGS=20 V 2
Drain-source breakdown voltage BVDSS 80 V VGS=0 V, ID=250 μA 2
Gate threshold voltage VGS(th) 1 2.5 V VDS=VGS, ID=250 μA 2
Drain-source on-state resistance (VGS=10 V) RDS(ON) 5.5 6.5 mΩ VGS=10 V, ID=12 A 2
Drain-source on-state resistance (VGS=4.5 V) RDS(ON) 7.5 9 mΩ VGS=4.5 V, ID=10 A 2
Drain-source leakage current IDSS 1 μA VDS=80 V, VGS=0 V 2
Drain-source voltage VDS 80 V 2
Gate-source voltage VGS -20 20 V 2
Continuous drain current ID 100 A TC=25 °C 2
Pulsed drain current ID, pulse 300 A TC=25 °C 2
Continuous diode forward current IS 100 A TC=25 °C 2
Diode pulsed current IS, pulse 300 A TC=25 °C 2
Power dissipation PD 148 W TC=25 °C 2
Single pulsed avalanche energy EAS 80 mJ 2
Operation and storage temperature Tstg, Tj -55 150 °C 2
Thermal resistance, junction-case RθJC 0.84 °C/W 2
Thermal resistance, junction-ambient RθJA 62 °C/W Device mounted on 1 in² FR-4 board with 2oz. Cu, still air, Ta=25 °C 2

CAD (KiCad official)

  • Symbol: SFG08R06DF
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2 (KiCad packages3D, STEP)
  • 3D model files: sfg08r06df-etched.step / sfg08r06df-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sfg08r06df.step / sfg08r06df.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ORIENTAL SEMI datasheet (8 pp, sha256 47eb8cbc7f000d76, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF