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Contents

README

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TPS65735RSNR

Texas Instruments · Power Management - Specialized · QFN-32-EP(4x4)

TPS65735RSNR from Texas Instruments, in a QFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BST_EN input Boost enable input from an MCU; logic high (VIH 1.2 V min) enables the boost converter.
2 DGND power_in Digital ground pin of the device.
3 LCLP output Positive (+) H-bridge output terminal for the left LC shutter.
4 LCLN output Negative (−) H-bridge output terminal for the left LC shutter.
5 LCRP output Positive (+) H-bridge output terminal for the right LC shutter.
6 LCRN output Negative (−) H-bridge output terminal for the right LC shutter.
7 HBL2 input H-bridge input 2 for the left LC shutter; logic levels VIL 0.4 V max and VIH 1.2 V min.
8 HBR1 input H-bridge input 1 for the right LC shutter; logic levels VIL 0.4 V max and VIH 1.2 V min.
9 HBR2 input H-bridge input 2 for the right LC shutter; logic levels VIL 0.4 V max and VIH 1.2 V min.
10 BST_OUT output Boost converter output, adjustable 8 V to 16 V; a boost output capacitor of at least 4.7 µF is recommended.
11 BST_SW output Boost switch node; the boost inductor (4.7 µH to 10 µH) connects between SYS and this pin.
12 PGNDBST power_in Boost converter power ground.
13 BST_FB input Boost feedback node; the feedback network sets the output with a 1.2 V feedback voltage (VFB).
14 NC unconnected No connection; connect to the main system ground.
15 ISET bidirectional Fast-charge current set resistor connection.
16 TS input Input for a 10 kΩ NTC thermistor; float this pin if the thermistor/TS function is not used.
17 NC unconnected No connection; connect to the main system ground.
18 BAT bidirectional Charger power-stage output and battery voltage sense input; recommended operating range 2.5 V to 6.4 V.
19 SYS output Output to the system; recommended SYS voltage 2.5 V to 6.4 V with up to 100 mA output current.
20 VIN power_in AC or USB adapter input; recommended range 3.7 V to 28 V (28 V ESD protection) with up to 200 mA input current.
21 VLDO output LDO output; continuous output current up to 30 mA, with 1 µF to 10 µF external decoupling capacitor.
22 VLDO_SET input Sets the LDO output voltage (see Table 2-2 of the datasheet); logic levels VIL 0.4 V max, VIH 1.2 V min.
23 COMP output Scaled battery voltage output for an MCU comparator or ADC input; do not connect if the COMP function is not used.
24 AGND power_in Analog ground; must always be connected to ground.
25 SWITCH input On/off switch input for a push-button or slider switch, with behavior selected by SW_SEL.
26 SW_SEL input Selects the switch type on SWITCH: low (VIL 0.4 V max) for slider switch, high (VIH 1.2 V min) for push-button.
27 PSDA bidirectional I2C data pin, for TI debug and test only; ground this pin in the application.
28 PSCL bidirectional I2C clock pin, for TI debug and test only; ground this pin in the application.
29 nCHG_STAT output Open-drain charger status indication output; connect to ground if the function is not used.
30 CHG_EN input Charger enable input from an MCU; the datasheet text describes the high level as enabling the boost (see review notes).
31 SLEEP bidirectional Sleep enable input from an MCU, edge-triggered and used only for system power-off; a falling edge below VIL (0.4 V) powers the system off after SLEEP was held high (above VIH 1.2 V).
32 HBL1 input H-bridge input 1 for the left LC shutter; logic levels VIL 0.4 V max and VIH 1.2 V min.
33 Thermal PAD power_in Exposed thermal pad, internally connected to AGND; must be held at the PCB AGND potential and must not be used as the main ground input.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package QFN-32-EP(4x4)
Category Power Management (PMIC)
Pins 33

CAD (KiCad official)

  • Symbol: TPS65735RSNR
  • Footprint: Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm
  • 3D model: QFN-32-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: tps65735rsnr-etched.step / tps65735rsnr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps65735rsnr.step / tps65735rsnr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 a8002731c7cf96b9, retrieved 2026-10-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF