component
TPS65735RSNR
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Texas Instruments Power Management - Specialized, QFN-32-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS65735RSNR
Texas Instruments · Power Management - Specialized · QFN-32-EP(4x4)
TPS65735RSNR from Texas Instruments, in a QFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BST_EN | input | Boost enable input from an MCU; logic high (VIH 1.2 V min) enables the boost converter. |
| 2 | DGND | power_in | Digital ground pin of the device. |
| 3 | LCLP | output | Positive (+) H-bridge output terminal for the left LC shutter. |
| 4 | LCLN | output | Negative (−) H-bridge output terminal for the left LC shutter. |
| 5 | LCRP | output | Positive (+) H-bridge output terminal for the right LC shutter. |
| 6 | LCRN | output | Negative (−) H-bridge output terminal for the right LC shutter. |
| 7 | HBL2 | input | H-bridge input 2 for the left LC shutter; logic levels VIL 0.4 V max and VIH 1.2 V min. |
| 8 | HBR1 | input | H-bridge input 1 for the right LC shutter; logic levels VIL 0.4 V max and VIH 1.2 V min. |
| 9 | HBR2 | input | H-bridge input 2 for the right LC shutter; logic levels VIL 0.4 V max and VIH 1.2 V min. |
| 10 | BST_OUT | output | Boost converter output, adjustable 8 V to 16 V; a boost output capacitor of at least 4.7 µF is recommended. |
| 11 | BST_SW | output | Boost switch node; the boost inductor (4.7 µH to 10 µH) connects between SYS and this pin. |
| 12 | PGNDBST | power_in | Boost converter power ground. |
| 13 | BST_FB | input | Boost feedback node; the feedback network sets the output with a 1.2 V feedback voltage (VFB). |
| 14 | NC | unconnected | No connection; connect to the main system ground. |
| 15 | ISET | bidirectional | Fast-charge current set resistor connection. |
| 16 | TS | input | Input for a 10 kΩ NTC thermistor; float this pin if the thermistor/TS function is not used. |
| 17 | NC | unconnected | No connection; connect to the main system ground. |
| 18 | BAT | bidirectional | Charger power-stage output and battery voltage sense input; recommended operating range 2.5 V to 6.4 V. |
| 19 | SYS | output | Output to the system; recommended SYS voltage 2.5 V to 6.4 V with up to 100 mA output current. |
| 20 | VIN | power_in | AC or USB adapter input; recommended range 3.7 V to 28 V (28 V ESD protection) with up to 200 mA input current. |
| 21 | VLDO | output | LDO output; continuous output current up to 30 mA, with 1 µF to 10 µF external decoupling capacitor. |
| 22 | VLDO_SET | input | Sets the LDO output voltage (see Table 2-2 of the datasheet); logic levels VIL 0.4 V max, VIH 1.2 V min. |
| 23 | COMP | output | Scaled battery voltage output for an MCU comparator or ADC input; do not connect if the COMP function is not used. |
| 24 | AGND | power_in | Analog ground; must always be connected to ground. |
| 25 | SWITCH | input | On/off switch input for a push-button or slider switch, with behavior selected by SW_SEL. |
| 26 | SW_SEL | input | Selects the switch type on SWITCH: low (VIL 0.4 V max) for slider switch, high (VIH 1.2 V min) for push-button. |
| 27 | PSDA | bidirectional | I2C data pin, for TI debug and test only; ground this pin in the application. |
| 28 | PSCL | bidirectional | I2C clock pin, for TI debug and test only; ground this pin in the application. |
| 29 | nCHG_STAT | output | Open-drain charger status indication output; connect to ground if the function is not used. |
| 30 | CHG_EN | input | Charger enable input from an MCU; the datasheet text describes the high level as enabling the boost (see review notes). |
| 31 | SLEEP | bidirectional | Sleep enable input from an MCU, edge-triggered and used only for system power-off; a falling edge below VIL (0.4 V) powers the system off after SLEEP was held high (above VIH 1.2 V). |
| 32 | HBL1 | input | H-bridge input 1 for the left LC shutter; logic levels VIL 0.4 V max and VIH 1.2 V min. |
| 33 | Thermal PAD | power_in | Exposed thermal pad, internally connected to AGND; must be held at the PCB AGND potential and must not be used as the main ground input. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-32-EP(4x4) |
| Category | Power Management (PMIC) |
| Pins | 33 |
CAD (KiCad official)
- Symbol:
TPS65735RSNR - Footprint:
Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm - 3D model: QFN-32-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
tps65735rsnr-etched.step/tps65735rsnr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps65735rsnr.step/tps65735rsnr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (32 pp, sha256
a8002731c7cf96b9, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).