component
IRFR3806TR
Public Made by Adomby adom
UMW MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownIRFR3806TR
UMW · MOSFETs · TO-252
IRFR3806TR from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | GATE terminal of the N-channel MOSFET; the datasheet gives a gate-to-source voltage rating of ±20 V. |
| 2 | D | passive | DRAIN terminal, which is also the tab of the TO-252 package; the datasheet gives a 60 V drain-to-source rating and 43 A continuous drain current at TC=25°C (VGS=10V). |
| 3 | S | passive | SOURCE terminal of the MOSFET; the integral body diode is connected between source and drain. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 60 | V | ID=250µA, VGS=0V | 3 | ||
| Static Drain-to-Source On-Resistance | RDS(ON) | 12.6 | 15.8 | mΩ | VGS=10V, ID=25A ④ | 3 | |
| Drain-to-Source Leakage Current (TJ=125°C) | IDSS | 250 | µA | VDS=48V, VGS=0V, TJ=125°C | 3 | ||
| Gate-to-Source Forward Leakage | IGSS | 100 | nA | VGS=20V | 3 | ||
| Gate-to-Source Reverse Leakage | IGSS | -100 | nA | VGS=-20V | 3 | ||
| Continuous Drain Current | ID | 43 | A | TC=25°C | 1 | ||
| Continuous Drain Current | ID | 31 | A | TC=100°C | 1 | ||
| Pulsed Drain Current | IDM | 170 | A | 1 | |||
| Maximum Power Dissipation | PD | 71 | W | 1 | |||
| Linear Derating Factor | 0.47 | W/°C | 1 | ||||
| Gate-to-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Peak Diode Recovery | dv/dt | 24 | V/ns | 1 | |||
| Operating Junction and Storage Temperature Range | TJ, TSTG | -55 | 175 | °C | 1 | ||
| Soldering Temperature | 300 | °C | 10 s, 1.6mm from case | 1 | |||
| Junction-to-Case | RθJC | 2.12 | °C/W | 2 | |||
| Junction-to-Ambient | RθJA | 62 | °C/W | 2 | |||
| Case-to-Sink | RθCS | 0.5 | °C/W | Flat, greased surface | 2 |
CAD (KiCad official)
- Symbol:
IRFR3806TR - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
irfr3806tr-etched.step/irfr3806tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);irfr3806tr.step/irfr3806tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: UMW datasheet (12 pp, sha256
55d9c477bbf64541, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).