component
HG24C512CM
Public Made by Adomby adom
HGSEMI EEPROM, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHG24C512CM
HGSEMI · EEPROM · SOP-8
HG24C512CM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | E0 | input | Device address input that can be tied to VCC or GND to allow up to eight devices on one bus, and is internally pulled down to GND if left floating. |
| 2 | E1 | input | Device address input that can be tied to VCC or GND to allow up to eight devices on one bus, and is internally pulled down to GND if left floating. |
| 3 | E2 | input | Device address input that can be tied to VCC or GND to allow up to eight devices on one bus, and is internally pulled down to GND if left floating. |
| 4 | GND | power_in | Ground reference for the power supply, to be connected to system ground. |
| 5 | SDA | bidirectional | Serial data pin, an open-drain bidirectional input/output used to transfer data to and from the device. |
| 6 | SCL | input | Serial clock input that controls data flow, with input data latched on the rising edge of SCL and output data clocked out on the falling edge. |
| 7 | WP | input | Write protect input that makes the whole memory array read-only when connected to VCC, while connected to GND or left floating enables write operations. |
| 8 | VCC | power_in | Device power supply pin for a supply range of 1.7V to 5.5V, where operation at invalid VCC voltages may produce spurious results. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Ambient temperature with power applied | -55 | 130 | °C | 18 | |||
| Storage temperature | TSTG | -65 | 150 | °C | 18 | ||
| Supply voltage | VCC | -0.5 | 6.5 | V | 18 | ||
| Voltage on input pins | VIN | -0.5 | 6.5 | V | 18 | ||
| Electrostatic pulse (human body model) | VESD | 6000 | V | human body model | 18 | ||
| Lead temperature (soldering, 10 seconds) | TL | 245 | °C | soldering, 10 seconds | 18 | ||
| Operating temperature range | TA | -40 | 105 | °C | 18 | ||
| Power-On Reset Time | tPOR | 10 | ms | 6 | |||
| Power-On Reset Voltage | VPOR | 1.5 | V | 6 | |||
| Brown-out Reset Voltage | VBOR | 0.8 | V | 6 | |||
| Time from Power-On to First Command | tINIT | 10 | ms | 6 | |||
| Warm Power Cycle Off Time | tPOFF | 1 | ms | 6 | |||
| Supply Voltage | VCC | 1.7 | 5.5 | V | 18 | ||
| Supply Current (Read) | ICC1 | 0.15 | mA | VCC= 1.7V, Read at 1MHz | 18 | ||
| Supply Current (Read) | ICC1 | 0.4 | mA | VCC= 5.5V, Read at 400 kHz | 18 | ||
| Supply Current (Read) | ICC1 | 0.5 | mA | VCC= 5.5V, Read at 1MHz | 18 | ||
| Supply Current (Write) | ICC2 | 0.5 | mA | VCC= 1.7V, Write at 400 kHz | 18 | ||
| Supply Current (Write) | ICC2 | 1 | mA | VCC= 5.5V, Write at 400 kHz | 18 | ||
| Standby Current | ISB | 0.5 | μA | VCC = 1.7V, VIN = VCC or GND | 18 | ||
| Standby Current | ISB | 1 | μA | VCC = 5.5V, VIN = VCC or GND | 18 | ||
| Input Leakage Current | ILI | 1 | μA | VIN = VCC or GND | 18 | ||
| Output Leakage Current | ILO | 1 | μA | VOUT = VCC or GND | 18 | ||
| Input Low-Level Voltage (SDA, SCL) | VIL | -0.5 | 0.3 | V | 18 | ||
| Input High-Level Voltage (SDA, SCL) | VIH | 0.7 | V | 18 | |||
| Low-Level Output Voltage | VOL1 | 0.4 | V | VCC> 2V, IOL= 3mA | 18 | ||
| Low-Level Output Voltage | VOL2 | 0.2 | V | VCC≤2V, IOL= 2mA | 18 | ||
| Clock Frequency, SCL | fSCL | 400 | kHz | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Clock Frequency, SCL | fSCL | 1000 | kHz | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| Clock Pulse Width Low | tLOW | 1300 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Clock Pulse Width Low | tLOW | 600 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| Clock Pulse Width High | tHIGH | 600 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Clock Pulse Width High | tHIGH | 260 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| SDA Rise Time | tR | 300 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| SDA(Out) Fall Time | tF | 300 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| SDA(Out) Fall Time | tF | 100 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| Start Hold Time | tHD.STA | 600 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Start Hold Time | tHD.STA | 250 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| Start Setup Time | tSU.STA | 600 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Start Setup Time | tSU.STA | 250 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| Stop Setup Time | tSU.STO | 600 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Stop Setup Time | tSU.STO | 250 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| Bus Free Time between Stop and Next Start | tBUF | 1300 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Bus Free Time between Stop and Next Start | tBUF | 500 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| Data In Hold Time | tHD.DI | 0 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Data In Setup Time | tSU.DAT | 100 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Data In Setup Time | tSU.DAT | 50 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| Data Out Hold Time | tHD.DAT | 50 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| SCL Low to Data Out Valid | tAA | 100 | 900 | ns | Fast, VCC = 1.7V to 5.5V | 19 | |
| SCL Low to Data Out Valid | tAA | 50 | 500 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | |
| WP Pin Setup Time | tSU.WP | 1200 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| WP Pin Setup Time | tSU.WP | 600 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| WP Pin Hold Time | tHD.WP | 1200 | ns | Fast, VCC = 1.7V to 5.5V | 19 | ||
| WP Pin Hold Time | tHD.WP | 600 | ns | High Speed, VCC = 1.7V to 5.5V | 19 | ||
| Write Cycle Time | tWR | 3 | ms | Fast, VCC = 1.7V to 5.5V | 19 | ||
| Noise Suppression Time | tI | 50 | ns | Fast, VCC = 1.7V to 5.5V | 19 |
CAD (KiCad official)
- Symbol:
HG24C512CM - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hg24c512cm-etched.step/hg24c512cm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hg24c512cm.step/hg24c512cm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (26 pp, sha256
5db8169ddefca69b, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).