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HG24C512CM

Public Made by Adom

by adom

HGSEMI EEPROM, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HG24C512CM

HGSEMI · EEPROM · SOP-8

HG24C512CM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E0 input Device address input that can be tied to VCC or GND to allow up to eight devices on one bus, and is internally pulled down to GND if left floating.
2 E1 input Device address input that can be tied to VCC or GND to allow up to eight devices on one bus, and is internally pulled down to GND if left floating.
3 E2 input Device address input that can be tied to VCC or GND to allow up to eight devices on one bus, and is internally pulled down to GND if left floating.
4 GND power_in Ground reference for the power supply, to be connected to system ground.
5 SDA bidirectional Serial data pin, an open-drain bidirectional input/output used to transfer data to and from the device.
6 SCL input Serial clock input that controls data flow, with input data latched on the rising edge of SCL and output data clocked out on the falling edge.
7 WP input Write protect input that makes the whole memory array read-only when connected to VCC, while connected to GND or left floating enables write operations.
8 VCC power_in Device power supply pin for a supply range of 1.7V to 5.5V, where operation at invalid VCC voltages may produce spurious results.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient temperature with power applied -55 130 °C 18
Storage temperature TSTG -65 150 °C 18
Supply voltage VCC -0.5 6.5 V 18
Voltage on input pins VIN -0.5 6.5 V 18
Electrostatic pulse (human body model) VESD 6000 V human body model 18
Lead temperature (soldering, 10 seconds) TL 245 °C soldering, 10 seconds 18
Operating temperature range TA -40 105 °C 18
Power-On Reset Time tPOR 10 ms 6
Power-On Reset Voltage VPOR 1.5 V 6
Brown-out Reset Voltage VBOR 0.8 V 6
Time from Power-On to First Command tINIT 10 ms 6
Warm Power Cycle Off Time tPOFF 1 ms 6
Supply Voltage VCC 1.7 5.5 V 18
Supply Current (Read) ICC1 0.15 mA VCC= 1.7V, Read at 1MHz 18
Supply Current (Read) ICC1 0.4 mA VCC= 5.5V, Read at 400 kHz 18
Supply Current (Read) ICC1 0.5 mA VCC= 5.5V, Read at 1MHz 18
Supply Current (Write) ICC2 0.5 mA VCC= 1.7V, Write at 400 kHz 18
Supply Current (Write) ICC2 1 mA VCC= 5.5V, Write at 400 kHz 18
Standby Current ISB 0.5 μA VCC = 1.7V, VIN = VCC or GND 18
Standby Current ISB 1 μA VCC = 5.5V, VIN = VCC or GND 18
Input Leakage Current ILI 1 μA VIN = VCC or GND 18
Output Leakage Current ILO 1 μA VOUT = VCC or GND 18
Input Low-Level Voltage (SDA, SCL) VIL -0.5 0.3 V 18
Input High-Level Voltage (SDA, SCL) VIH 0.7 V 18
Low-Level Output Voltage VOL1 0.4 V VCC> 2V, IOL= 3mA 18
Low-Level Output Voltage VOL2 0.2 V VCC≤2V, IOL= 2mA 18
Clock Frequency, SCL fSCL 400 kHz Fast, VCC = 1.7V to 5.5V 19
Clock Frequency, SCL fSCL 1000 kHz High Speed, VCC = 1.7V to 5.5V 19
Clock Pulse Width Low tLOW 1300 ns Fast, VCC = 1.7V to 5.5V 19
Clock Pulse Width Low tLOW 600 ns High Speed, VCC = 1.7V to 5.5V 19
Clock Pulse Width High tHIGH 600 ns Fast, VCC = 1.7V to 5.5V 19
Clock Pulse Width High tHIGH 260 ns High Speed, VCC = 1.7V to 5.5V 19
SDA Rise Time tR 300 ns Fast, VCC = 1.7V to 5.5V 19
SDA(Out) Fall Time tF 300 ns Fast, VCC = 1.7V to 5.5V 19
SDA(Out) Fall Time tF 100 ns High Speed, VCC = 1.7V to 5.5V 19
Start Hold Time tHD.STA 600 ns Fast, VCC = 1.7V to 5.5V 19
Start Hold Time tHD.STA 250 ns High Speed, VCC = 1.7V to 5.5V 19
Start Setup Time tSU.STA 600 ns Fast, VCC = 1.7V to 5.5V 19
Start Setup Time tSU.STA 250 ns High Speed, VCC = 1.7V to 5.5V 19
Stop Setup Time tSU.STO 600 ns Fast, VCC = 1.7V to 5.5V 19
Stop Setup Time tSU.STO 250 ns High Speed, VCC = 1.7V to 5.5V 19
Bus Free Time between Stop and Next Start tBUF 1300 ns Fast, VCC = 1.7V to 5.5V 19
Bus Free Time between Stop and Next Start tBUF 500 ns High Speed, VCC = 1.7V to 5.5V 19
Data In Hold Time tHD.DI 0 ns Fast, VCC = 1.7V to 5.5V 19
Data In Setup Time tSU.DAT 100 ns Fast, VCC = 1.7V to 5.5V 19
Data In Setup Time tSU.DAT 50 ns High Speed, VCC = 1.7V to 5.5V 19
Data Out Hold Time tHD.DAT 50 ns Fast, VCC = 1.7V to 5.5V 19
SCL Low to Data Out Valid tAA 100 900 ns Fast, VCC = 1.7V to 5.5V 19
SCL Low to Data Out Valid tAA 50 500 ns High Speed, VCC = 1.7V to 5.5V 19
WP Pin Setup Time tSU.WP 1200 ns Fast, VCC = 1.7V to 5.5V 19
WP Pin Setup Time tSU.WP 600 ns High Speed, VCC = 1.7V to 5.5V 19
WP Pin Hold Time tHD.WP 1200 ns Fast, VCC = 1.7V to 5.5V 19
WP Pin Hold Time tHD.WP 600 ns High Speed, VCC = 1.7V to 5.5V 19
Write Cycle Time tWR 3 ms Fast, VCC = 1.7V to 5.5V 19
Noise Suppression Time tI 50 ns Fast, VCC = 1.7V to 5.5V 19

CAD (KiCad official)

  • Symbol: HG24C512CM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24c512cm-etched.step / hg24c512cm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24c512cm.step / hg24c512cm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (26 pp, sha256 5db8169ddefca69b, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF