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Contents

README

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SI2310-TP

MCC Micro Commercial Components · MOSFETs · SOT-23

SI2310-TP from MCC Micro Commercial Components, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GATE input Gate of the N-channel enhancement-mode MOSFET; the datasheet specifies a gate-source voltage rating of ±20 V.
2 SOURCE passive Source of the N-channel MOSFET; the datasheet gives a diode forward voltage of 1.2 V max at IS = 3 A (VGS = 0 V) for the source-drain body diode.
3 DRAIN passive Drain of the N-channel MOSFET; the datasheet gives a drain-source voltage rating of 60 V and a continuous drain current of 3.0 A.

Key specifications

Parameter Value
Manufacturer MCC Micro Commercial Components
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 60 V VGS=0V, ID=250µA 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS=60V, VGS=0V 2
Gate-Source Leakage Current IGSS -100 100 nA VDS=0V, VGS=±20V 2
Gate-Threshold Voltage VGS(th) 0.5 2 V VDS=VGS, ID=250µA 2
Drain-Source On-Resistance (VGS=10V) RDS(on) 105 mΩ VGS=10V, ID=3A 2
Drain-Source On-Resistance (VGS=4.5V) RDS(on) 125 mΩ VGS=4.5V, ID=3A 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=3A 2
Forward Transconductance gFS 1.4 S VDS=15V, ID=2A 2
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current ID 3 A 1
Pulsed Drain Current IDM 10 A Repetitive rating: pulse width limited by junction temperature (Note 1) 1
Total Power Dissipation PD 1.2 W 1
Operating Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1
Thermal Resistance Junction to Ambient RθJA 105 °C/W Junction to ambient, surface mounted on FR4 board, t≤10s (Note 2) 1

CAD (KiCad official)

  • Symbol: SI2310-TP
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2310-tp-etched.step / si2310-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2310-tp.step / si2310-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC Micro Commercial Components datasheet (4 pp, sha256 85dd5b75ac395412, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF