component
TLV76708DGNR
Public Made by Adomby adom
Texas Instruments Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, HVSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTLV76708DGNR
Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · HVSSOP-8
TLV76708DGNR from Texas Instruments, in a HVSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Output pin; use the recommended output capacitor from the Recommended Operating Conditions table (1 µF to 220 µF, ESR 2 mΩ to 500 mΩ) and place it as close to OUT and GND as possible. |
| 2 | SNS | input | Output sense pin for the fixed-voltage version; connect it to OUT, or to the load for remote sensing, and do not float it. |
| 3 | NC | unconnected | Not connected pin labeled NC in Figure 5-4; the datasheet states no function for it. |
| 4 | GND | power_in | Ground pin; all ground pins must be grounded. |
| 5 | EN | input | Enable pin; driving it high enables the device and driving it low disables it, with an internal pullup and an absolute maximum VEN of -0.3 V to 18 V. |
| 6 | GND | power_in | Ground pin; all ground pins must be grounded. |
| 7 | NC | unconnected | Not connected pin labeled NC in Figure 5-4; the datasheet states no function for it. |
| 8 | IN | power_in | Input pin; place the input capacitor as close to the IN and GND pins as possible, with VIN rated 2.5 V to 16 V in the Recommended Operating Conditions. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | • Use copper planes for device connections to IN, OUT, and GND pins to optimize thermal performance | 24 |
CAD (KiCad official)
- Symbol:
TLV76708DGNR - Footprint:
Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm - 3D model: HVSSOP-8 (KiCad packages3D, STEP)
- 3D model files:
tlv76708dgnr-etched.step/tlv76708dgnr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv76708dgnr.step/tlv76708dgnr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (44 pp, sha256
aed3fd87aee66ba5, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).