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Contents

README

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RC65D600E

RealChip(正芯半导体) · GaN Transistors(GaN HEMT) · TO-252

RC65D600E from RealChip(正芯半导体), in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; normally-off GaN HEMT gate with absolute maximum VGS of -20 to +20 V, driven with VGS=10 V for the RDS(on) rating and compatible with standard gate drivers.
2 S passive Source (short middle stub, also connected to the exposed bottom/tab source pad); Package Configuration is listed as Source.
3 D passive Drain; rated for VDSS 650 V (900 V transient) and continuous drain current of 4.8 A at TC=25°C.

Key specifications

Parameter Value
Manufacturer RealChip(正芯半导体)
Package TO-252
Category Gallium Nitride (GaN) Devices
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage (breakdown) V(BL)DSS 650 V VGS= 0V 4
Drain-source on-resistance RDS(on) 600 720 mΩ VGS=10V, ID=1A, TJ=25°C 4
Drain-to-source leakage current IDSS 10 μA VDS=650V, VGS= 0V, TJ=25°C 4
Drain-to-source leakage current IDSS 100 μA VDS=650V, VGS= 0V, TJ=150°C 4
Gate-to-source forward leakage current IGSS -100 100 nA VGS=±20V 4
Drain to source voltage (TJ = -55°C to 150°C) VDSS 650 V TJ = -55°C to 150°C 2
Drain to source voltage-transient V(TR)DSS 900 V Off-state spike, duty cycle D<0.01, spike duration <1μs (note a) 2
Gate to source voltage VGSS -20 20 V 2
Continuous drain current @TC=25°C ID 4.8 A TC=25°C (note b) 2
Continuous drain current @TC=125°C ID 2.1 A TC=125°C (note b) 2
Pulse drain current IDM 14 A pulse width: 100μs 2
Maximum power dissipation PD 25 W TC=25°C 2
Operating temperature, case TC -55 150 °C 2
Operating temperature, junction TJ -55 150 °C 2
Storage temperature TS -55 150 °C 2
Junction-to-case thermal resistance Rθ JC 5 °C/W 3

CAD (KiCad official)

  • Symbol: RC65D600E
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: rc65d600e-etched.step / rc65d600e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rc65d600e.step / rc65d600e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RealChip(正芯半导体) datasheet (10 pp, sha256 9d128e405f2f2af4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF