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MAX20078ATE+T
Public Made by Adomby adom
Analog Devices Inc Maxim Integrated LED Drivers, TQFN-16-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMAX20078ATE+T
Analog Devices Inc Maxim Integrated · LED Drivers · TQFN-16-EP(3x3)
MAX20078ATE+T from Analog Devices Inc Maxim Integrated, in a TQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BST | power_out | High-side power supply for the high-side gate drive; connect a 0.1µF ceramic capacitor from BST to LX (minimum 100nF, 220nF recommended with a Schottky diode). |
| 2 | DH | output | Connect to the gate of the high-side n-channel MOSFET of the buck LED driver; a series resistor may be used to limit current slew rate and EMI. |
| 3 | LX | passive | Switching node of the buck LED driver; connect to one end of the output inductor. |
| 4 | IN | power_in | Bias supply input; connect a 4.5V to 65V supply and bypass to ground with a 2.2µF ceramic capacitor. |
| 5 | DIM | input | PWM dimming input; the device enters shutdown mode if DIM is below the ON threshold minus hysteresis for 210ms, with input current below 5µA (typ) in shutdown. |
| 6 | TON | input | Connect a resistor to the input supply and a capacitor to AGND to set the switching frequency. |
| 7 | OUT | input | Connect a resistor divider from OUT to the output voltage to provide a scaled-down output voltage measurement; overvoltage setpoint is OVP_ON = 3.0 × (R2 + R3) / R3 V. |
| 8 | REFI | input | Analog dimming control input; apply 0 to 1.2V to set LED current (zero at or below 0.18V), with a maximum withstand voltage of 2V. |
| 9 | AGND | power_in | Analog ground connection; the exposed pad must be connected to AGND. |
| 10 | IOUTV | output | Analog voltage indication of inductor current (VIOUTV = ILED × RCS × 5 + 0.2V); bypass to ground with a 1µF ceramic capacitor. |
| 11 | FLT | output | Active-low open-drain fault output that goes low for output short, open LED, overvoltage, thermal shutdown, or shutdown mode. |
| 12 | CSP | input | Connect to the source of the external MOSFET driven by DL, with a resistor from CSP to CSN to sense the MOSFET current. |
| 13 | CSN | input | Connect directly to the other end of the current-sense resistor; this end is also connected to the power-ground plane. |
| 14 | PGND | power_in | Power-ground connection for the gate drivers and the buck power stage. |
| 15 | VCC | power_out | 5V regulator output that can deliver up to 10mA to external circuitry; bypass to AGND with a 2.2µF ceramic capacitor. |
| 16 | DL | output | Connect to the gate of the low-side n-channel MOSFET of the buck LED driver; a series resistor may be used to limit current slew rate and EMI. |
| 17 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices Inc Maxim Integrated |
| Package | TQFN-16-EP(3x3) |
| Category | LED Drivers |
| Pins | 17 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IN, DIM, TON to AGND | -0.3 | 70 | V | 2 | |||
| LX to AGND | -1 | 70 | V | 2 | |||
| BST to AGND | -0.3 | 75 | V | 2 | |||
| BST, DH to LX | -0.3 | 6 | V | 2 | |||
| DH to AGND | -0.3 | 75 | V | 2 | |||
| DL to AGND | -0.3 | V | upper limit is +VCC | 2 | |||
| VCC to AGND | -0.3 | 6 | V | upper limit is lower of (VIN + 0.3V) and +6V | 2 | ||
| CSP, CSN to AGND | -2.5 | V | upper limit is +VCC | 2 | |||
| OUT, FLT, IOUTV to AGND | -0.3 | 6 | V | 2 | |||
| PGND to AGND | -0.3 | 0.3 | V | 2 | |||
| REFI | -0.3 | 2.5 | V | 2 | |||
| Operating Temperature Range | -40 | 125 | °C | 2 | |||
| Junction Temperature | 150 | °C | 2 | ||||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Lead Temperature (soldering) | 300 | °C | soldering, 10s | 2 | |||
| Soldering Temperature (reflow) | 260 | °C | 2 | ||||
| Junction-to-Case Thermal Resistance, 16 TQFN-EP | θJC | 7 | °C/W | 2 | |||
| Input Voltage Range | VIN | 4.5 | 65 | V | 2 | ||
| Input Voltage Range, IN connected to VCC | VIN | 4.5 | 5.5 | V | IN connected to VCC | 2 | |
| Quiescent Current | IQ | 2 | 4 | mA | VDIM = 5V, VIN = 65V | 2 | |
| Shutdown Current | ISHDN | 8 | 15 | µA | VDIM = 0V, VIN = 12V | 2 | |
| Shutdown Current | ISHDN | 12 | 30 | µA | VDIM = 0V, VIN = 65V | 2 | |
| VCC Output Voltage | VCC | 4.85 | 5 | 5.15 | V | 6V < VIN < 25V; IVCC = 10mA | 2 |
| VCC Dropout Voltage | VCC DROP | 0.07 | 0.15 | V | VIN = 4.5V, IVCC = 5mA | 2 | |
| VCC UVLO Rising | VCC UVLOR | 3.8 | 4.1 | 4.4 | V | Rising | 2 |
| VCC UVLO Falling | VCC UVLOFALL | 3.55 | 3.8 | 4 | V | Falling | 2 |
| DH Sourcing Resistance | RDH_SRC | 2.5 | 5 | Ω | DH = high, TA = -40°C to +125°C | 3 | |
| DH Sinking Resistance | RDH_SINK | 1 | 2 | Ω | DH = low, TA = -40°C to +125°C | 3 | |
| DL Sourcing Resistance | RDL_SRC | 2.5 | 5 | Ω | DL = low, TA = -40°C to +125°C | 3 | |
| DL Sinking Resistance | RDL_SINK | 1.5 | 3 | Ω | DL = low, TA = -40°C to +125°C | 3 | |
| Minimum On-Time | tON_MIN | 80 | 110 | ns | 3 | ||
| TON Pulldown Resistance | 15 | 30 | Ω | VIN = 65V, R1 > 20kΩ | 3 | ||
| OUT Overvoltage Threshold | VTH_OVP | 2.9 | 3 | 3.1 | V | OUT rising | 3 |
| Linear Range of Pulse Doubler | 0 | 5 | µs | 3 | |||
| REFI Input Voltage Range | REFIRNG | 0.2 | 1.2 | V | 3 | ||
| REFI Zero-Current Threshold | REFIZC_VTH | 0.165 | 0.18 | 0.195 | V | VCS < 5mV | 3 |
| REFI Clamp Voltage | REFICLMP | 1.274 | 1.3 | 1.326 | V | IREFI sink = 1µA | 3 |
| REFI Input Bias Current | REFIIN | 0 | 20 | 200 | nA | VREFI = 0 to 2V | 3 |
| Current-Sense Amplifier Offset | 0.18 | 0.2 | 0.22 | V | 3 | ||
| Current-Sense Gain | 4.9 | 5 | 5.05 | V/V | 3 | ||
| DIM Shutdown Detect Timer | tSHDW | 180 | 200 | 220 | ms | DIM low duration to enter shutdown mode | 4 |
| FLT Output Voltage | FLTV | 0.05 | 0.3 | V | ISINK is 1mA after fault | 4 | |
| LED Open-Fault REFI Range | LOFREFI_RNG | 300 | 325 | 350 | mV | 4 | |
| LED Open-Fault Threshold | LOFTH | 10 | 25 | 40 | % | VIOUTV is lower than the threshold when DIM is high | 4 |
CAD (KiCad official)
- Symbol:
MAX20078ATE+T - Footprint:
Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm - 3D model: TQFN-16-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
max20078ate-t-etched.step/max20078ate-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max20078ate-t.step/max20078ate-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices Inc Maxim Integrated datasheet (22 pp, sha256
d05be57c3cc251b2, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).