main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 7d ago
viewers max20078ate-t: viewers · Ray 7d ago
max20078ate-t-etched.glb Publish 0.1.0 · Ray 7d ago
max20078ate-t-etched.step max20078ate-t: factory component page (tier=lcsc) · Ray 7d ago
max20078ate-t-hero.glb max20078ate-t: hero GLB from the etched model (keeps the MPN mark) · Ray 7d ago
max20078ate-t-hero.overlay.json Publish 0.1.0 · Ray 7d ago
max20078ate-t.glb Publish 0.1.0 · Ray 7d ago
max20078ate-t.kicad_mod Publish 0.1.0 · Ray 7d ago
max20078ate-t.kicad_sym Publish 0.1.0 · Ray 7d ago
max20078ate-t.lbr Publish 0.1.0 · Ray 7d ago
max20078ate-t.step Publish 0.1.0 · Ray 7d ago
package.json Publish 0.1.0 · Ray 7d ago
page.json Set visibility: public · Ray 7d ago
README.md Publish 0.1.0 · Ray 7d ago

MAX20078ATE+T

Analog Devices Inc Maxim Integrated · LED Drivers · TQFN-16-EP(3x3)

MAX20078ATE+T from Analog Devices Inc Maxim Integrated, in a TQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BST power_out High-side power supply for the high-side gate drive; connect a 0.1µF ceramic capacitor from BST to LX (minimum 100nF, 220nF recommended with a Schottky diode).
2 DH output Connect to the gate of the high-side n-channel MOSFET of the buck LED driver; a series resistor may be used to limit current slew rate and EMI.
3 LX passive Switching node of the buck LED driver; connect to one end of the output inductor.
4 IN power_in Bias supply input; connect a 4.5V to 65V supply and bypass to ground with a 2.2µF ceramic capacitor.
5 DIM input PWM dimming input; the device enters shutdown mode if DIM is below the ON threshold minus hysteresis for 210ms, with input current below 5µA (typ) in shutdown.
6 TON input Connect a resistor to the input supply and a capacitor to AGND to set the switching frequency.
7 OUT input Connect a resistor divider from OUT to the output voltage to provide a scaled-down output voltage measurement; overvoltage setpoint is OVP_ON = 3.0 × (R2 + R3) / R3 V.
8 REFI input Analog dimming control input; apply 0 to 1.2V to set LED current (zero at or below 0.18V), with a maximum withstand voltage of 2V.
9 AGND power_in Analog ground connection; the exposed pad must be connected to AGND.
10 IOUTV output Analog voltage indication of inductor current (VIOUTV = ILED × RCS × 5 + 0.2V); bypass to ground with a 1µF ceramic capacitor.
11 FLT output Active-low open-drain fault output that goes low for output short, open LED, overvoltage, thermal shutdown, or shutdown mode.
12 CSP input Connect to the source of the external MOSFET driven by DL, with a resistor from CSP to CSN to sense the MOSFET current.
13 CSN input Connect directly to the other end of the current-sense resistor; this end is also connected to the power-ground plane.
14 PGND power_in Power-ground connection for the gate drivers and the buck power stage.
15 VCC power_out 5V regulator output that can deliver up to 10mA to external circuitry; bypass to AGND with a 2.2µF ceramic capacitor.
16 DL output Connect to the gate of the low-side n-channel MOSFET of the buck LED driver; a series resistor may be used to limit current slew rate and EMI.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices Inc Maxim Integrated
Package TQFN-16-EP(3x3)
Category LED Drivers
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
IN, DIM, TON to AGND -0.3 70 V 2
LX to AGND -1 70 V 2
BST to AGND -0.3 75 V 2
BST, DH to LX -0.3 6 V 2
DH to AGND -0.3 75 V 2
DL to AGND -0.3 V upper limit is +VCC 2
VCC to AGND -0.3 6 V upper limit is lower of (VIN + 0.3V) and +6V 2
CSP, CSN to AGND -2.5 V upper limit is +VCC 2
OUT, FLT, IOUTV to AGND -0.3 6 V 2
PGND to AGND -0.3 0.3 V 2
REFI -0.3 2.5 V 2
Operating Temperature Range -40 125 °C 2
Junction Temperature 150 °C 2
Storage Temperature Range -65 150 °C 2
Lead Temperature (soldering) 300 °C soldering, 10s 2
Soldering Temperature (reflow) 260 °C 2
Junction-to-Case Thermal Resistance, 16 TQFN-EP θJC 7 °C/W 2
Input Voltage Range VIN 4.5 65 V 2
Input Voltage Range, IN connected to VCC VIN 4.5 5.5 V IN connected to VCC 2
Quiescent Current IQ 2 4 mA VDIM = 5V, VIN = 65V 2
Shutdown Current ISHDN 8 15 µA VDIM = 0V, VIN = 12V 2
Shutdown Current ISHDN 12 30 µA VDIM = 0V, VIN = 65V 2
VCC Output Voltage VCC 4.85 5 5.15 V 6V < VIN < 25V; IVCC = 10mA 2
VCC Dropout Voltage VCC DROP 0.07 0.15 V VIN = 4.5V, IVCC = 5mA 2
VCC UVLO Rising VCC UVLOR 3.8 4.1 4.4 V Rising 2
VCC UVLO Falling VCC UVLOFALL 3.55 3.8 4 V Falling 2
DH Sourcing Resistance RDH_SRC 2.5 5 Ω DH = high, TA = -40°C to +125°C 3
DH Sinking Resistance RDH_SINK 1 2 Ω DH = low, TA = -40°C to +125°C 3
DL Sourcing Resistance RDL_SRC 2.5 5 Ω DL = low, TA = -40°C to +125°C 3
DL Sinking Resistance RDL_SINK 1.5 3 Ω DL = low, TA = -40°C to +125°C 3
Minimum On-Time tON_MIN 80 110 ns 3
TON Pulldown Resistance 15 30 Ω VIN = 65V, R1 > 20kΩ 3
OUT Overvoltage Threshold VTH_OVP 2.9 3 3.1 V OUT rising 3
Linear Range of Pulse Doubler 0 5 µs 3
REFI Input Voltage Range REFIRNG 0.2 1.2 V 3
REFI Zero-Current Threshold REFIZC_VTH 0.165 0.18 0.195 V VCS < 5mV 3
REFI Clamp Voltage REFICLMP 1.274 1.3 1.326 V IREFI sink = 1µA 3
REFI Input Bias Current REFIIN 0 20 200 nA VREFI = 0 to 2V 3
Current-Sense Amplifier Offset 0.18 0.2 0.22 V 3
Current-Sense Gain 4.9 5 5.05 V/V 3
DIM Shutdown Detect Timer tSHDW 180 200 220 ms DIM low duration to enter shutdown mode 4
FLT Output Voltage FLTV 0.05 0.3 V ISINK is 1mA after fault 4
LED Open-Fault REFI Range LOFREFI_RNG 300 325 350 mV 4
LED Open-Fault Threshold LOFTH 10 25 40 % VIOUTV is lower than the threshold when DIM is high 4

CAD (KiCad official)

  • Symbol: MAX20078ATE+T
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: TQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: max20078ate-t-etched.step / max20078ate-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max20078ate-t.step / max20078ate-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices Inc Maxim Integrated datasheet (22 pp, sha256 d05be57c3cc251b2, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF