Loads on click. Unloads only if this page sits in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

PCB Footprint

Open full view ↗
Loads on click. Unloads only if this page sits in the background.
Loads on click. Unloads only if this page sits in the background.
Download PDF
Contents

README

markdown

LM2738XMY

Texas Instruments · DC-DC Converters · HVSSOP-8

LM2738XMY from Texas Instruments, in a HVSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOST input Boost voltage that drives the internal NMOS control switch, with a bootstrap capacitor connected between BOOST and SW; Boost-to-SW voltage is recommended at 2.5 V to 5.5 V.
2 VIN power_in Supply voltage for the output power stage, with a bypass capacitor to this pin; must be tied to pin 3 at the package and VIN/VCC is recommended at 3 V to 20 V.
3 VCC power_in Input supply voltage of the device, with a bypass capacitor to this pin; must be tied to pin 2 at the package and VIN/VCC is recommended at 3 V to 20 V.
4 EN input Enable control input where logic high enables operation; do not allow this pin to float or exceed VIN + 0.3 V.
5 GND power_in Signal and power ground; the bottom resistor of the feedback network should be placed as close as possible to this pin.
6 FB input Feedback pin that connects to the external resistor divider to set the output voltage (0.8 V internal reference).
7 GND power_in Signal and power ground; the bottom resistor of the feedback network should be placed as close as possible to this pin.
8 SW output Output switch that connects to the inductor, catch diode, and bootstrap capacitor; SW voltage is recommended at -0.5 V to 20 V.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-8
Category Power Management (PMIC)
Pins 9

CAD (KiCad official)

  • Symbol: LM2738XMY
  • Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • 3D model: HVSSOP-8, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: lm2738xmy-etched.step / lm2738xmy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2738xmy.step / lm2738xmy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (44 pp, sha256 2b1805b4c3e0d675, retrieved 2026-10-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF