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LM2738XMY

Texas Instruments · DC-DC Converters · HVSSOP-8

LM2738XMY from Texas Instruments, in a HVSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOST input Boost voltage that drives the internal NMOS control switch, with a bootstrap capacitor connected between BOOST and SW; Boost-to-SW voltage is recommended at 2.5 V to 5.5 V.
2 VIN power_in Supply voltage for the output power stage, with a bypass capacitor to this pin; must be tied to pin 3 at the package and VIN/VCC is recommended at 3 V to 20 V.
3 VCC power_in Input supply voltage of the device, with a bypass capacitor to this pin; must be tied to pin 2 at the package and VIN/VCC is recommended at 3 V to 20 V.
4 EN input Enable control input where logic high enables operation; do not allow this pin to float or exceed VIN + 0.3 V.
5 GND power_in Signal and power ground; the bottom resistor of the feedback network should be placed as close as possible to this pin.
6 FB input Feedback pin that connects to the external resistor divider to set the output voltage (0.8 V internal reference).
7 GND power_in Signal and power ground; the bottom resistor of the feedback network should be placed as close as possible to this pin.
8 SW output Output switch that connects to the inductor, catch diode, and bootstrap capacitor; SW voltage is recommended at -0.5 V to 20 V.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-8
Category Power Management (PMIC)
Pins 9

CAD (KiCad official)

  • Symbol: LM2738XMY
  • Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • 3D model: HVSSOP-8, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: lm2738xmy-etched.step / lm2738xmy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2738xmy.step / lm2738xmy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (44 pp, sha256 2b1805b4c3e0d675, retrieved 2026-10-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF