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README

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ADS8568SRGCR

Texas Instruments · Analog To Digital Converters (ADCs) · VQFN-64-EP(9x9)

ADS8568SRGCR from Texas Instruments, in a VQFN-64-EP(9x9). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 HVSS power_in Negative supply voltage for the analog inputs, specified from -16.5 V to -5.0 V with -15.0 V nominal.
2 CH_D1 passive Analog input of channel D1; input range is set by the RANGE pin or CONFIG bit C19 and the channel can be powered down with CONFIG bit C18.
3 REFDN passive Decoupling capacitor input for the channel pair D reference, to be connected to the decoupling capacitor and AGND.
4 AVDD power_in Analog power supply, specified from 4.5 V to 5.5 V with 5.0 V nominal.
5 AGND power_in Analog ground; connect to the analog ground plane.
6 REFDP passive Decoupling capacitor input for the channel pair D reference, to be connected to the decoupling capacitor.
7 CH_D0 passive Analog input of channel D0; input range is set by the RANGE pin or CONFIG bit C19 and the channel can be powered down with CONFIG bit C18.
8 PAR/SER input Interface mode selection input; low selects the parallel interface and high enables the serial interface.
9 STBY input In hardware mode, low powers down the entire device including clock source and reference; in software mode, connect to DGND or DVDD.
10 RESET input Active-high reset input that aborts conversions and resets CONFIG to 000003FFh; a valid reset pulse must be at least 50 ns long.
11 REFEN/WR input In hardware mode, high enables the internal reference and low applies an external reference at REFIO; in software mode it is the write input.
12 RD input Read data input; when low the parallel data output is enabled if CS is low, and it must be connected to DGND.
13 CS/FS input Chip-select input enables the parallel interface when low; in serial mode it is the frame synchronization input, where the FS falling edge controls the frame transfer.
14 AVDD power_in Analog power supply, specified from 4.5 V to 5.5 V with 5.0 V nominal.
15 AGND power_in Analog ground; connect to the analog ground plane.
16 DB15/SDO_D bidirectional Data bit 15 (MSB) input/output; it is the SDO_D data output when SEL_CD = 1 and must be tied to DGND when SEL_CD = 0.
17 DB14/SDO_C bidirectional Data bit 14 input/output; it is the SDO_C data output when SEL_CD = 1 and must be tied to DGND when SEL_CD = 0.
18 DB13/SDO_B bidirectional Data bit 13 input/output; it is the SDO_B data output when SEL_B = 1 and must be tied to DGND when SEL_B = 0.
19 DB12/SDO_A bidirectional Data bit 12 input/output; it is the data output for channel pair A.
20 DB11/REFBUFEN bidirectional Data bit 11 input/output; in hardware mode low enables all internal reference buffers (mandatory if the internal reference is used) and high disables them.
21 DB10/SCLK bidirectional Data bit 10 input/output; serves as the serial interface clock input.
22 DB9/SDI bidirectional Data bit 9 input/output; connect to DGND in hardware mode and serves as the serial data input in software mode.
23 DB8/DCEN bidirectional Data bit 8 input/output; daisy-chain enable input, connected to DGND if daisy-chain mode is not used.
24 DGND power_in Buffer I/O ground; connect to the digital ground plane.
25 DVDD power_in Buffer I/O supply, specified from 2.7 V to 5.5 V with 3.3 V nominal.
26 DB7 bidirectional Data bit 7 input/output; must be connected to DGND.
27 DB6/SEL_B bidirectional Data bit 6 input/output; when low SDO_B is disabled and all eight channels are available only through SDO_A.
28 DB5/SEL_CD bidirectional Data bit 5 input/output; selects SDO_C and SDO_D, with high placing channel pairs C and D on SDO_C and SDO_D.
29 DB4 bidirectional Data bit 4 input/output; connect to DGND.
30 DB3/DCIN_A bidirectional Data bit 3 input/output; when DCEN = 1 it is the daisy-chain data input for SDO_A of the previous device, and when DCEN = 0 it is connected to DGND.
31 DB2/DCIN_B bidirectional Data bit 2 input/output; when DCEN = 1 and SEL_B = 1 it is the daisy-chain data input for SDO_B, and when DCEN = 0 it is connected to DGND.
32 DB1/DCIN_C bidirectional Data bit 1 input/output; when DCEN = 1 and SEL_CD = 1 it is the daisy-chain data input for SDO_C, and when DCEN = 0 it is connected to DGND.
33 DB0/DCIN_D bidirectional Data bit 0 (LSB) input/output; when DCEN = 1 and SEL_CD = 1 it is the daisy-chain data input for SDO_D, and when DCEN = 0 it is connected to DGND.
34 RANGE/XCLK bidirectional In hardware mode, low selects an input range of ±4 VREF and high selects ±2 VREF; in software mode it is an external or internal conversion clock pin, and it is connected to DGND if unused.
35 BUSY/INT output Converter busy status output that goes high at conversion start and pulses low per channel pair completion, or an interrupt output when CONFIG bit C27 = 1.
36 ASLEEP input Auto-sleep enable input; when high the device enters auto-sleep mode, which is recommended to save power at lower data rates.
37 CONVST_A input Conversion start for channel pair A; its rising edge initiates simultaneous conversion of CH_A[1:0] and resets the internal channel state machine.
38 CONVST_B input Conversion start for channel pair B; its rising edge initiates simultaneous conversion of CH_B[1:0].
39 CONVST_C input Conversion start for channel pair C; its rising edge initiates simultaneous conversion of CH_C[1:0].
40 CONVST_D input Conversion start for channel pair D; its rising edge initiates simultaneous conversion of CH_D[1:0].
41 HW/SW input Mode selection input; low selects hardware mode using external pins and high selects software mode configured through the CONFIG register.
42 CH_A0 passive Analog input of channel A0; channel A is the master pair that is always active and must run at the highest data rate when pairs use different rates.
43 REFAP passive Decoupling capacitor input for the channel pair A reference, to be connected to the decoupling capacitor.
44 AGND power_in Analog ground; connect to the analog ground plane.
45 AVDD power_in Analog power supply, specified from 4.5 V to 5.5 V with 5.0 V nominal.
46 REFAN passive Decoupling capacitor input for the channel pair A reference, to be connected to the decoupling capacitor and AGND.
47 CH_A1 passive Analog input of channel A1; channel A is the master pair that is always active and must run at the highest data rate when pairs use different rates.
48 HVDD power_in Positive supply voltage for the analog inputs, specified from 5.0 V to 16.5 V with 15.0 V nominal.
49 CH_B0 passive Analog input of channel B0; input range is set by the RANGE pin or CONFIG bit C23.
50 REFBP passive Decoupling capacitor input for the channel pair B reference, to be connected to the decoupling capacitor.
51 AGND power_in Analog ground; connect to the analog ground plane.
52 AVDD power_in Analog power supply, specified from 4.5 V to 5.5 V with 5.0 V nominal.
53 REFBN passive Decoupling capacitor input for the channel pair B reference, to be connected to the decoupling capacitor and AGND.
54 CH_B1 passive Analog input of channel B1; input range is set by the RANGE pin or CONFIG bit C23.
55 REFN passive Negative reference input/output; connect to a decoupling capacitor and AGND.
56 REFIO bidirectional Reference voltage input/output whose value is set by the internal DAC through CONFIG bits C[9:0]; connect to a decoupling capacitor.
57 AVDD power_in Analog power supply, specified from 4.5 V to 5.5 V with 5.0 V nominal.
58 AGND power_in Analog ground; connect to the analog ground plane.
59 CH_C1 passive Analog input of channel C1; input range is set by the RANGE pin or CONFIG bit C21.
60 REFCN passive Decoupling capacitor input for the channel pair C reference, to be connected to the decoupling capacitor and AGND.
61 AVDD power_in Analog power supply, specified from 4.5 V to 5.5 V with 5.0 V nominal.
62 AGND power_in Analog ground; connect to the analog ground plane.
63 REFCP passive Decoupling capacitor input for the channel pair C reference, to be connected to the decoupling capacitor.
64 CH_C0 passive Analog input of channel C0; input range is set by the RANGE pin or CONFIG bit C21.
65 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-64-EP(9x9)
Category ADC/DAC/Data Conversion
Pins 65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
HVDD to AGND supply voltage -0.3 18 V 9
HVSS to AGND supply voltage -18 0.3 V 9
AVDD to AGND supply voltage -0.3 6 V 9
DVDD to DGND supply voltage -0.3 6 V 9
Ground voltage difference AGND to DGND -0.3 0.3 V 9
Input current to all pins except supply -10 10 mA 9
Maximum virtual junction temperature TJ 150 °C 9
Storage temperature Tstg -65 150 °C 9
Analog supply voltage AVDD 4.5 5 5.5 V 9
Buffer I/O supply voltage DVDD 2.7 3.3 5.5 V 9
Input positive supply voltage HVDD 5 15 16.5 V 9
Input negative supply voltage HVSS -16.5 -15 -5 V 9
Operating ambient temperature range TA -40 25 125 °C 9
Input leakage current -1 1 μA No ongoing conversion 10
Reference voltage at 2.5-V operation VREF 2.485 2.5 2.515 V 2.5-V operation, REFDAC = 3FFh 10
Reference voltage at 2.5-V operation, 25°C VREF 2.496 2.5 2.504 V 2.5-V operation, REFDAC = 3FFh at 25°C 10
Reference voltage at 3.0-V operation VREF 2.985 3 3.015 V 3.0-V operation, REFDAC = 3FFh 10
Reference voltage at 3.0-V operation, 25°C VREF 2.995 3 3.005 V 3.0-V operation, REFDAC = 3FFh at 25°C 10
Reference voltage drift dVREF/dT -10 10 ppm/°C 10
Reference output current IREFOUT -2 2 mA At dc current 10
External load capacitance at REFIO pin 100 470 nF At REFIO pin 10
External load capacitance at REF_xP, REF_xN pins 4.7 10 μF At REF_xP, REF_xN pins 10
REFDAC differential nonlinearity DNLDAC -1 0.1 1 LSB 10
REFDAC integral nonlinearity INLDAC -2 0.1 2 LSB 10
REFDAC offset error VOSDAC -4 0.65 4 LSB VREF = 0.5 V (DAC = 0CDh) 10
Reference input voltage VREFIN 0.5 2.5 3.025 V 10
Digital input current -50 50 nA VI = DVDD to DGND 10
High-impedance-state output current -50 50 nA 10
Analog supply current, ADS8568 at maximum fDATA IAVDD 36.6 48.4 mA ADS8568, fDATA = maximum 11
Buffer I/O supply current at maximum fDATA IDVDD 0.5 2 mA fDATA = maximum 11
Input positive supply current, ADS8568 at maximum fDATA IHVDD 2.3 3.2 mA ADS8568, fDATA = maximum 11
Input negative supply current, ADS8568 at maximum fDATA IHVSS 2.7 3.6 mA ADS8568, fDATA = maximum 12
Power dissipation, ADS8568 at maximum fDATA 259.7 389.4 mW ADS8568, fDATA = maximum 12
Integral linearity error, VQFN, TA -40 to +85°C INL -3 1.5 3 LSB At TA = -40°C to +85°C, VQFN package (RGC) 15
Integral linearity error, VQFN, TA -40 to +125°C INL -4 1.5 4 LSB At TA = -40°C to +125°C, VQFN package (RGC) 15
Differential linearity error, TA -40 to +85°C DNL -1 0.75 1.75 LSB At TA = -40°C to +85°C 15
Differential linearity error, TA -40 to +125°C DNL -1 0.75 2 LSB At TA = -40°C to +125°C 15
Offset error -1.5 0.5 1.5 mV 15
Offset error matching -0.65 0.65 mV 15
Offset error drift -3.5 3.5 μV/°C 15
Gain error -0.5 0.25 0.5 % Referenced to voltage at REFIO 15
Gain error matching between channels of any pair -0.2 0.2 % Between channels of any pair 15
Gain error matching between any two channels -0.4 0.4 % Between any two channels 15
Gain error drift -6 6 ppm/°C Referenced to voltage at REFIO 15
Signal-to-noise ratio, TA -40 to +85°C SNR 90 91.5 dB At fIN = 10 kHz, TA = -40°C to +85°C 15
Signal-to-noise ratio, TA -40 to +125°C SNR 89 91.5 dB At fIN = 10 kHz, TA = -40°C to +125°C 15
Signal-to-noise ratio and distortion, TA -40 to +85°C SINAD 87 90 dB At fIN = 10 kHz, TA = -40°C to +85°C 15
Signal-to-noise ratio and distortion, TA -40 to +125°C SINAD 86.5 90 dB At fIN = 10 kHz, TA = -40°C to +125°C 15
Total harmonic distortion, TA -40 to +85°C THD -94 -90 dB At fIN = 10 kHz, TA = -40°C to +85°C 15
Total harmonic distortion, TA -40 to +125°C THD -94 -89.5 dB At fIN = 10 kHz, TA = -40°C to +125°C 15
Spurious-free dynamic range, TA -40 to +85°C SFDR 90 95 dB At fIN = 10 kHz, TA = -40°C to +85°C 15
Spurious-free dynamic range, TA -40 to +125°C SFDR 89.5 95 dB At fIN = 10 kHz, TA = -40°C to +125°C 15
Power-supply rejection ratio, analog input PSRR -78 dB At output code FFFFh, related to HVDD and HVSS 10
Power-supply rejection ratio, reference PSRR -77 dB At output code FFFFh, related to AVDD 10
Thermal resistance, junction-to-ambient (RGC) RθJA 22 °C/W RGC (VQFN) 64 pins 9
Thermal resistance, junction-to-case top (RGC) RθJC(top) 9 °C/W RGC (VQFN) 64 pins 9
Thermal resistance, junction-to-board (RGC) RθJB 3.6 °C/W RGC (VQFN) 64 pins 9
Junction-to-top characterization parameter (RGC) ψJT 0.1 °C/W RGC (VQFN) 64 pins 9
Junction-to-board characterization parameter (RGC) ψJB 2.9 °C/W RGC (VQFN) 64 pins 9
Thermal resistance, junction-to-case bottom (RGC) RθJC(bot) 0.3 °C/W RGC (VQFN) 64 pins 9

CAD (KiCad official)

  • Symbol: ADS8568SRGCR
  • Footprint: Package_DFN_QFN:QFN-64-1EP_9x9mm_P0.5mm_EP6x6mm
  • 3D model: VQFN-64-EP(9x9) (KiCad packages3D, STEP)
  • 3D model files: ads8568srgcr-etched.step / ads8568srgcr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ads8568srgcr.step / ads8568srgcr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (62 pp, sha256 79c029913ea9ce5c, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF