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Contents

README

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TPS65563ARGTR

Texas Instruments · Power Management - Specialized · TQFN-16-EP(3x3)

TPS65563ARGTR from Texas Instruments, in a TQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW output Primary-side power MOSFET switch output; connect to the switched side of the transformer.
2 SW output Primary-side power MOSFET switch output; connect to the switched side of the transformer.
3 VBAT power_in Battery voltage input for MOSFET OFF timing detection; input range 1.4 V to 12 V with 10-µF bypass capacitor to GND.
4 I_PEAK input Primary-side peak current control input; voltage at I_PEAK sets the peak current threshold into SW.
5 GND power_in Ground for power and IC internal circuits; connect to ground plane.
6 CHG input Charge enable/disable input; drive high to start charging output capacitor, low to terminate charging.
7 F_ON input Flash on/off input; high enables xenon flash if F_EN is high, low disables flash.
8 F_EN input Flash acceptable input; high permits xenon flash with F_ON high, low forces flash disable.
9 XFULL tri_state Charge completion indicator open-drain output; pulls low when output fully charged, high impedance during charging and fault conditions.
10 VCC power_in Power supply input for gate driver and IC; voltage range 2.7 V to 5.5 V with 1-µF bypass capacitor to GND.
11 IGBT_VCC power_out Power supply output for IGBT driver block.
12 G_IGBT_P output IGBT gate driver output for turn-on; output swings from GND to IGBT_VCC to drive external IGBT devices with external resistor.
13 G_IGBT_N output IGBT gate driver output for turn-off; output swings from IGBT_VCC to GND to drive external IGBT devices with external resistor.
14 GND power_in Ground for power and IC internal circuits; connect to ground plane.
15 GND power_in Ground for power and IC internal circuits; connect to ground plane.
16 TEST_GND power_in Test ground used by TI for manufacturing; should be connected to GND and ground plane.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TQFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

CAD (KiCad official)

  • Symbol: TPS65563ARGTR
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: TQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tps65563argtr-etched.step / tps65563argtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps65563argtr.step / tps65563argtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (19 pp, sha256 59ee3fba0d7dece2, retrieved 2026-09-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF