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Contents

README

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AT45DB041E-SHNHA-T

RENESAS · NOR FLASH · SOIC-8

AT45DB041E-SHNHA-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SI input Serial Input shifts in all command, address and data bits, latched on the rising edge of SCK and ignored whenever CS is deasserted.
2 SCK input Serial Clock controls data flow, with input latched on the rising edge and output on SO clocked out on the falling edge of SCK.
3 RESET input Active-low reset terminates the operation in progress and returns the internal state machine to idle while held low; drive it high externally if unused.
4 CS input Active-low Chip Select selects the device, a high-to-low transition starts and a low-to-high transition ends an operation, and a 10k Ohm pull-up to VCC is recommended.
5 WP input Active-low Write Protect protects all sectors specified in the Sector Protection Register against program and erase, is internally pulled high, and is recommended to be tied to VCC if unused.
6 VCC power_in Device power supply pin for a single 1.65 V to 3.6 V supply; operation at invalid VCC voltages can produce spurious results.
7 GND power_in Ground reference for the power supply, connected to system ground.
8 SO tri_state Serial Output shifts data out on the falling edge of SCK and is high-impedance whenever the device is deselected (CS deasserted).

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ultra-Deep Power-Down Current IUDPD 0.4 1 µA CS= VCC. All other inputs at 0V or VCC 53
Deep Power-Down Current IDPD 4.5 12 µA CS= VCC. All other inputs at 0V or VCC 53
Standby Current ISB 25 40 µA CS= VCC. All other inputs at 0 V or VCC 53
Active Current, Low Power Read (01h) ICC1 6 9 mA f = 1 MHz; IOUT = 0 mA 53
Active Current, Low Power Read (01h) ICC1 7 10 mA f = 15 MHz; IOUT = 0 mA 53
Active Current, Read Operation ICC2 10 12 mA f = 50 MHz; IOUT = 0 mA 53
Active Current, Read Operation ICC2 12 15 mA f = 85 MHz; IOUT = 0 mA 53
Active Current, Program Operation ICC3 14 16 mA CS = VCC 53
Active Current, Erase Operation ICC4 8 12 mA CS = VCC 53
Input Load Current ILI 1 µA All inputs at CMOS levels 53
Output Leakage Current ILO 1 µA All inputs at CMOS levels 53
Output Low Voltage VOL 0.4 V IOL = 100 µA 53
SCK Frequency fSCK 70 MHz 1.65 to 3.6 V 55
SCK Frequency for Continuous Read (0x0B) fCAR1 70 MHz 1.65 to 3.6 V 55
SCK Frequency for Continuous Read (0x03) (Low Frequency) fCAR2 40 MHz 1.65 to 3.6 V 55
SCK Frequency for Continuous Read (Low Power Mode, 01h Opcode) fCAR3 15 MHz 1.65 to 3.6 V 55
SCK Frequency for Continuous Read (0x1B) fCAR4 85 MHz 1.65 to 3.6 V 55
SCK High Time tWH 4 ns 1.65 to 3.6 V 55
SCK Low Time tWL 4 ns 1.65 to 3.6 V 55
SCK Rise Time, Peak-to-peak tSCKR 0.1 V/ns 1.65 to 3.6 V 55
SCK Fall Time, Peak-to-peak tSCKF 0.1 V/ns 1.65 to 3.6 V 55
Minimum CS High Time tCS 20 ns 1.65 to 3.6 V 55
CS Setup Time tCSS 6 ns 1.65 to 3.6 V 55
CS Hold Time tCSH 5 ns 1.65 to 3.6 V 55
Data In Setup Time tSU 2 ns 1.65 to 3.6 V 55
Data In Hold Time tH 1 ns 1.65 to 3.6 V 55
Output Hold Time tHO 0 ns 1.65 to 3.6 V 55
Output Disable Time tDIS 8 ns 1.65 to 3.6 V 55
Output Valid tV 7 ns 1.65 to 3.6 V 55
WP Low to Protection Enabled tWPE 1 µs 1.65 to 3.6 V 55
WP High to Protection Disabled tWPD 1 µs 1.65 to 3.6 V 55
Freeze Sector Lockdown Time (from CS High) tLOCK 200 µs 1.65 to 3.6 V 55
CS High to Ultra-Deep Power-Down tEUDPD 3 µs 1.65 to 3.6 V 55
Minimum CS Low Time to Exit Ultra-Deep Power-Down tCSLU 20 ns 1.65 to 3.6 V 55
Exit Ultra-Deep Power-Down Time tXUDPD 280 µs 1.65 to 3.6 V 55
CS High to Deep Power-Down tEDPD 2 µs 1.65 to 3.6 V 55
Resume from Deep Power-Down Time tRDPD 35 µs 1.65 to 3.6 V 55
Page to Buffer Transfer Time tXFR 100 µs 1.65 to 3.6 V 55
Page to Buffer Compare Time tCOMP 100 µs 1.65 to 3.6 V 55
RESET Pulse Width tRST 10 µs 1.65 to 3.6 V 55
RESET Recovery Time tREC 1 µs 1.65 to 3.6 V 55
Software Reset Time tSWRST 35 µs 1.65 to 3.6 V 55
Page Erase and Programming Time (256/264 bytes) tEP 10 25 ms 1.65 to 3.6 V 57
Page Programming Time tP 1.5 3 ms 1.65 to 3.6 V 57
Page Erase Time tPE 12 25 ms 1.65 to 3.6 V 57
Block Erase Time tBE 30 35 ms 1.65 to 3.6 V 57
Sector Erase Time tSE 0.7 1.1 s 1.65 to 3.6 V 57
Chip Erase Time tCE 6 17 s 1.65 to 3.6 V 57
Suspend Time Program tSUSP 8 15 µs Program, 1.65 to 3.6 V 57
Suspend Time Erase tSUSP 20 30 µs Erase, 1.65 to 3.6 V 57
Resume Time Program tRES 8 15 µs Program, 1.65 to 3.6 V 57
Resume Time Erase tRES 20 30 µs Erase, 1.65 to 3.6 V 57
OTP Security Register Program Time tOTPP 200 500 µs 1.65 to 3.6 V 57
Absolute Maximum Vcc VCC 3.96 V 52
Temperature under Bias -55 125 °C 52
Storage Temperature -65 150 °C 52
All Output Voltages with Respect to Ground -0.6 4.2 V Max VCC of 3.6 V + 0.6 V 52
All Input Voltages with Respect to Ground -0.6 4.2 V excluding VCC pin, including NC pins; Max VCC of 3.6 V + 0.6 V 52
Operating Temperature (Case) -40 85 °C VCC Power Supply 1.65 V to 3.6 V 52
VCC Power Supply VCC 1.65 3.6 V 52
Byte Programming Time tBP 8 µs 1.65 to 3.6 V 57

CAD (KiCad official)

  • Symbol: AT45DB041E-SHNHA-T
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: at45db041e-shnha-t-etched.step / at45db041e-shnha-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at45db041e-shnha-t.step / at45db041e-shnha-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (78 pp, sha256 c2799495a2e9c41b, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF