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ESP32-WROOM-32E-H4

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Espressif Systems WiFi Modules, ESP32-WROOM-32E. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentiot-communication modulesesp32-wroom-32e-h4factory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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ESP32-WROOM-32E-H4

Espressif Systems · WiFi Modules · ESP32-WROOM-32E

ESP32-WROOM-32E-H4 from Espressif Systems, in a ESP32-WROOM-32E. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 3V3 power_in Module power supply input.
3 EN input Chip enable: high turns the chip on, low shuts the chip down, and the pin must not be left floating.
4 SENSOR_VP input Input-only pin carrying GPIO36, ADC1_CH0 and RTC_GPIO0.
5 SENSOR_VN input Input-only pin carrying GPIO39, ADC1_CH3 and RTC_GPIO3.
6 IO34 input Input-only pin carrying GPIO34, ADC1_CH6 and RTC_GPIO4.
7 IO35 input Input-only pin carrying GPIO35, ADC1_CH7 and RTC_GPIO5.
8 IO32 bidirectional GPIO32, also XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9 and RTC_GPIO9.
9 IO33 bidirectional GPIO33, also XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8 and RTC_GPIO8.
10 IO25 bidirectional GPIO25, also DAC_1, ADC2_CH8, RTC_GPIO6 and EMAC_RXD0.
11 IO26 bidirectional GPIO26, also DAC_2, ADC2_CH9, RTC_GPIO7 and EMAC_RXD1.
12 IO27 bidirectional GPIO27, also ADC2_CH7, TOUCH7, RTC_GPIO17 and EMAC_RX_DV.
13 IO14 bidirectional GPIO14, also ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK and EMAC_TXD2.
14 IO12 bidirectional GPIO12, also ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2 and EMAC_TXD3.
15 GND power_in Ground.
16 IO13 bidirectional GPIO13, also ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3 and EMAC_RX_ER.
17 NC unconnected Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
18 NC unconnected Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
19 NC unconnected Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
20 NC unconnected Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
21 NC unconnected Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
22 NC unconnected Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
23 IO15 bidirectional GPIO15, also ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD and EMAC_RXD3.
24 IO2 bidirectional GPIO2, also ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0 and SD_DATA0.
25 IO0 bidirectional GPIO0, also ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1 and EMAC_TX_CLK.
26 IO4 bidirectional GPIO4, also ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1 and EMAC_TX_ER.
27 IO16 bidirectional GPIO16, also HS1_DATA4, U2RXD and EMAC_CLK_OUT; it cannot be used on variants with embedded PSRAM because it connects to the PSRAM.
28 IO17 bidirectional GPIO17, also HS1_DATA5, U2TXD and EMAC_CLK_OUT_180.
29 IO5 bidirectional GPIO5, also VSPICS0, HS1_DATA6 and EMAC_RX_CLK.
30 IO18 bidirectional GPIO18, also VSPICLK and HS1_DATA7.
31 IO19 bidirectional GPIO19, also VSPIQ, U0CTS and EMAC_TXD0.
32 NC unconnected Not connected.
33 IO21 bidirectional GPIO21, also VSPIHD and EMAC_TX_EN.
34 RXD0 bidirectional GPIO3, also U0RXD and CLK_OUT2.
35 TXD0 bidirectional GPIO1, also U0TXD, CLK_OUT3 and EMAC_RXD2.
36 IO22 bidirectional GPIO22, also VSPIWP, U0RTS and EMAC_TXD1.
37 IO23 bidirectional GPIO23, also VSPID and HS1_STROBE.
38 GND power_in Ground.
39 GND power_in Exposed ground pad (P_GND); soldering it to the base board ground is optional but can improve thermal performance.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package ESP32-WROOM-32E
Category IoT/Communication Modules
Pins 39

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 28
Storage temperature TSTORE -40 105 °C 28
Power supply voltage VDD33 3 3.3 3.6 V 28
Current delivered by external power supply IVDD 0.5 A 28
Operating ambient temperature T -40 105 °C 105 °C version 28
Pin capacitance CIN 2 pF 28
Low-level input voltage VIL -0.3 V 28
High-level input current IIH 50 nA 28
Low-level input current IIL 50 nA 28
Low-level sink current IOL 28 mA VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum 29
High-level source current, VDD3P3_CPU power domain IOH 40 mA VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum 29
High-level source current, VDD3P3_RTC power domain IOH 40 mA VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum 29
High-level source current, VDD_SDIO power domain IOH 20 mA VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum 29
Resistance of internal pull-up resistor RPU 45 kΩ 29
Resistance of internal pull-down resistor RPD 45 kΩ 29
Low-level input voltage of CHIP_PU to shut down the chip VIL_nRST 0.6 V 29
Power supply voltage (3.3 V flash) VCC 2.7 3.3 3.6 V Power supply voltage (3.3 V) 30
Flash maximum clock frequency FC 80 MHz 30
ADC differential nonlinearity DNL -7 7 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
ADC integral nonlinearity INL -12 12 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
ADC total error -23 23 mV Atten = 0, effective measurement range of 100 ∼ 950 mV 26
ADC total error -30 30 mV Atten = 1, effective measurement range of 100 ∼ 1250 mV 26
ADC total error -40 40 mV Atten = 2, effective measurement range of 150 ∼ 1750 mV 26
ADC total error -60 60 mV Atten = 3, effective measurement range of 150 ∼ 2450 mV 26
Receiver sensitivity, Basic Data Rate -90 -89 -88 dBm @0.1% BER 33
Receiver sensitivity, Bluetooth LE -94 -93 -92 dBm @30.8% PER 35
RF power control range -12 9 dBm 34

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 15: Reflow Profile 46

CAD (KiCad official)

  • Symbol: ESP32-WROOM-32E-H4
  • Footprint: PCM_Espressif:ESP32-WROOM-32E
  • 3D model: ESP32-WROOM-32E (KiCad packages3D, STEP)
  • 3D model files: esp32-wroom-32e-h4-etched.step / esp32-wroom-32e-h4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-wroom-32e-h4.step / esp32-wroom-32e-h4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (52 pp, sha256 4c7a345d1c1bfec3, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF