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ESP32-WROOM-32E-H4

Espressif Systems · WiFi Modules · ESP32-WROOM-32E

ESP32-WROOM-32E-H4 from Espressif Systems, in a ESP32-WROOM-32E. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND	power_in	Ground.
2	3V3	power_in	Module power supply input.
3	EN	input	Chip enable: high turns the chip on, low shuts the chip down, and the pin must not be left floating.
4	SENSOR_VP	input	Input-only pin carrying GPIO36, ADC1_CH0 and RTC_GPIO0.
5	SENSOR_VN	input	Input-only pin carrying GPIO39, ADC1_CH3 and RTC_GPIO3.
6	IO34	input	Input-only pin carrying GPIO34, ADC1_CH6 and RTC_GPIO4.
7	IO35	input	Input-only pin carrying GPIO35, ADC1_CH7 and RTC_GPIO5.
8	IO32	bidirectional	GPIO32, also XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9 and RTC_GPIO9.
9	IO33	bidirectional	GPIO33, also XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8 and RTC_GPIO8.
10	IO25	bidirectional	GPIO25, also DAC_1, ADC2_CH8, RTC_GPIO6 and EMAC_RXD0.
11	IO26	bidirectional	GPIO26, also DAC_2, ADC2_CH9, RTC_GPIO7 and EMAC_RXD1.
12	IO27	bidirectional	GPIO27, also ADC2_CH7, TOUCH7, RTC_GPIO17 and EMAC_RX_DV.
13	IO14	bidirectional	GPIO14, also ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK and EMAC_TXD2.
14	IO12	bidirectional	GPIO12, also ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2 and EMAC_TXD3.
15	GND	power_in	Ground.
16	IO13	bidirectional	GPIO13, also ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3 and EMAC_RX_ER.
17	NC	unconnected	Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
18	NC	unconnected	Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
19	NC	unconnected	Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
20	NC	unconnected	Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
21	NC	unconnected	Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
22	NC	unconnected	Not connected; GPIO6 to GPIO11 go to the on-module SPI flash and are not led out.
23	IO15	bidirectional	GPIO15, also ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD and EMAC_RXD3.
24	IO2	bidirectional	GPIO2, also ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0 and SD_DATA0.
25	IO0	bidirectional	GPIO0, also ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1 and EMAC_TX_CLK.
26	IO4	bidirectional	GPIO4, also ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1 and EMAC_TX_ER.
27	IO16	bidirectional	GPIO16, also HS1_DATA4, U2RXD and EMAC_CLK_OUT; it cannot be used on variants with embedded PSRAM because it connects to the PSRAM.
28	IO17	bidirectional	GPIO17, also HS1_DATA5, U2TXD and EMAC_CLK_OUT_180.
29	IO5	bidirectional	GPIO5, also VSPICS0, HS1_DATA6 and EMAC_RX_CLK.
30	IO18	bidirectional	GPIO18, also VSPICLK and HS1_DATA7.
31	IO19	bidirectional	GPIO19, also VSPIQ, U0CTS and EMAC_TXD0.
32	NC	unconnected	Not connected.
33	IO21	bidirectional	GPIO21, also VSPIHD and EMAC_TX_EN.
34	RXD0	bidirectional	GPIO3, also U0RXD and CLK_OUT2.
35	TXD0	bidirectional	GPIO1, also U0TXD, CLK_OUT3 and EMAC_RXD2.
36	IO22	bidirectional	GPIO22, also VSPIWP, U0RTS and EMAC_TXD1.
37	IO23	bidirectional	GPIO23, also VSPID and HS1_STROBE.
38	GND	power_in	Ground.
39	GND	power_in	Exposed ground pad (P_GND); soldering it to the base board ground is optional but can improve thermal performance.

Key specifications

Parameter	Value
Manufacturer	Espressif Systems
Package	ESP32-WROOM-32E
Category	IoT/Communication Modules
Pins	39

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Power supply voltage	VDD33	-0.3		3.6	V		28
Storage temperature	TSTORE	-40		105	°C		28
Power supply voltage	VDD33	3	3.3	3.6	V		28
Current delivered by external power supply	IVDD	0.5			A		28
Operating ambient temperature	T	-40		105	°C	105 °C version	28
Pin capacitance	CIN		2		pF		28
Low-level input voltage	VIL	-0.3			V		28
High-level input current	IIH			50	nA		28
Low-level input current	IIL			50	nA		28
Low-level sink current	IOL		28		mA	VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum	29
High-level source current, VDD3P3_CPU power domain	IOH		40		mA	VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum	29
High-level source current, VDD3P3_RTC power domain	IOH		40		mA	VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum	29
High-level source current, VDD_SDIO power domain	IOH		20		mA	VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum	29
Resistance of internal pull-up resistor	RPU		45		kΩ		29
Resistance of internal pull-down resistor	RPD		45		kΩ		29
Low-level input voltage of CHIP_PU to shut down the chip	VIL_nRST			0.6	V		29
Power supply voltage (3.3 V flash)	VCC	2.7	3.3	3.6	V	Power supply voltage (3.3 V)	30
Flash maximum clock frequency	FC	80			MHz		30
ADC differential nonlinearity	DNL	-7		7	LSB	RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off	25
ADC integral nonlinearity	INL	-12		12	LSB	RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off	25
ADC total error		-23		23	mV	Atten = 0, effective measurement range of 100 ∼ 950 mV	26
ADC total error		-30		30	mV	Atten = 1, effective measurement range of 100 ∼ 1250 mV	26
ADC total error		-40		40	mV	Atten = 2, effective measurement range of 150 ∼ 1750 mV	26
ADC total error		-60		60	mV	Atten = 3, effective measurement range of 150 ∼ 2450 mV	26
Receiver sensitivity, Basic Data Rate		-90	-89	-88	dBm	@0.1% BER	33
Receiver sensitivity, Bluetooth LE		-94	-93	-92	dBm	@30.8% PER	35
RF power control range		-12		9	dBm		34

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 15: Reflow Profile	46

CAD (KiCad official)

Symbol: ESP32-WROOM-32E-H4
Footprint: PCM_Espressif:ESP32-WROOM-32E
3D model: ESP32-WROOM-32E (KiCad packages3D, STEP)
3D model files: esp32-wroom-32e-h4-etched.step / esp32-wroom-32e-h4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-wroom-32e-h4.step / esp32-wroom-32e-h4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Espressif Systems datasheet (52 pp, sha256 4c7a345d1c1bfec3, retrieved 2026-10-28, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF