component
KSZ8463RLI
Public Made by Adomby adom
Microchip Tech Interface - Specialized, LQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownKSZ8463RLI
Microchip Tech · Interface - Specialized · LQFP-64(10x10)
KSZ8463RLI from Microchip Tech, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RXM1 | bidirectional | Port 1 physical receive (MDI) or transmit (MDI-X) signal, negative differential. |
| 2 | RXP1 | bidirectional | Port 1 physical receive (MDI) or transmit (MDI-X) signal, positive differential. |
| 3 | AGND | power_in | Analog ground. |
| 4 | TXM1 | bidirectional | Port 1 physical transmit (MDI) or receive (MDI-X) signal, negative differential. |
| 5 | TXP1 | bidirectional | Port 1 physical transmit (MDI) or receive (MDI-X) signal, positive differential. |
| 6 | VDD_AL | power_in | Low-voltage analog power input, to be filtered with a ferrite bead and capacitors. |
| 7 | ISET | output | Sets the PHY transmit output current; pull down with a 6.49 kΩ (1%) resistor to ground. |
| 8 | AGND | power_in | Analog ground. |
| 9 | VDD_A3.3 | power_in | 3.3 V analog VDD input power supply; must be well decoupled. |
| 10 | RXM2 | bidirectional | Port 2 physical receive (MDI) or transmit (MDI-X) signal, negative differential. |
| 11 | RXP2 | bidirectional | Port 2 physical receive (MDI) or transmit (MDI-X) signal, positive differential. |
| 12 | AGND | power_in | Analog ground. |
| 13 | TXM2 | bidirectional | Port 2 physical transmit (MDI) or receive (MDI-X) signal, negative differential. |
| 14 | TXP2 | bidirectional | Port 2 physical transmit (MDI) or receive (MDI-X) signal, positive differential. |
| 15 | FXSD2 | input | Fiber signal detect input for port 2 in 100BASE-FX mode; must be pulled to GND in copper mode and is available only on KSZ8463FML/FRL. |
| 16 | VDD_COL | power_in | Second low-voltage analog power input, to be filtered with a ferrite bead and capacitors. |
| 17 | PWRDN | input | Active-low full-chip power-down (low = power-down, high or floating = normal); while low, all I/O are tri-stated and registers return to default. |
| 18 | X1 | input | 25 MHz crystal or oscillator input with ±50 ppm clock requirement; on the KSZ8463RL it can instead take a 50 MHz REFCLK_I selected by pin 41 at power-up. |
| 19 | X2 | output | Crystal connection; left as no connect when an oscillator drives X1. |
| 20 | DGND | power_in | Digital ground. |
| 21 | VDD_IO | power_in | 3.3 V, 2.5 V, or 1.8 V digital I/O supply, also the input to the internal low-voltage regulator. |
| 22 | TX_EN | input | RMII transmit enable; active high indicates valid transmit data on TXD[1:0]. |
| 23 | TXD3/EN_REFCLKO | input | In RMII mode, pulling this pin up enables the 50 MHz REFCLK_O output on pin 32 and pulling it down disables it. |
| 24 | TXD2/NC | input | No connect in RMII mode (not used). |
| 25 | TXD1 | input | RMII transmit data bit 1, synchronous to the 50 MHz REFCLK. |
| 26 | TXD0 | input | RMII transmit data bit 0, synchronous to the 50 MHz REFCLK. |
| 27 | TX_CLK/REFCLK_I | bidirectional | In RMII mode, the 50 MHz reference clock input (internal or external source). |
| 28 | TX_ER/MII_BP | input | No connect in RMII mode (not used). |
| 29 | DGND | power_in | Digital ground. |
| 30 | VDD_IO | power_in | 3.3 V, 2.5 V, or 1.8 V digital I/O supply, also the input to the internal low-voltage regulator. |
| 31 | RX_DV | bidirectional | RMII receive data valid, active high indicates RXD[1:0] is valid; the power-up pull-up/no-connect or pull-down level selects PHY or MAC MII mode in MII operation. |
| 32 | RXD3/REFCLK_O | bidirectional | In RMII mode, outputs the 50 MHz REFCLK_O clock when EN_REFCLKO (pin 23) is pulled up, with 16 mA drive. |
| 33 | RXD2 | bidirectional | Not used in RMII mode; at power-up/reset the pull-up/no-connect selects high-speed SPI (up to 50 MHz) and pull-down selects low-speed SPI (up to 12.5 MHz). |
| 34 | RXD1 | bidirectional | RMII receive data bit 1, synchronous to the 50 MHz REFCLK; latched with RXD0 at power-up to select the serial bus mode. |
| 35 | RXD0 | bidirectional | RMII receive data bit 0, synchronous to the 50 MHz REFCLK; latched with RXD1 at power-up to select the serial bus mode (default SPI slave). |
| 36 | CRS/GPIO9_RLI | bidirectional | In RMII mode this pin is GPIO9 (internal pull-down), see GPIO0 pin 48 description. |
| 37 | COL/GPIO10_RLI | bidirectional | In RMII mode this pin is GPIO10 (internal pull-down), see GPIO0 pin 48 description. |
| 38 | RX_CLK/GPIO7_RLI | bidirectional | In RMII mode this pin is GPIO7 (internal pull-down), see GPIO0 pin 48 description. |
| 39 | DGND | power_in | Digital ground. |
| 40 | VDD_L | power_in | Low-voltage core connection: a low-voltage input when the internal regulator is not used, or the low-voltage output when it is used. |
| 41 | SPI_DO | bidirectional | SPI slave data output (high-impedance when SPI_CSN is high); its power-up level selects 25 MHz from X1/X2 (pull-up) or 50 MHz from REFCLK_I (pull-down, KSZ8463RL/FRL only). |
| 42 | SPI_CSN | input | Active-low chip select for SPI slave mode; requires an external 4.7 kΩ pull-up when in use. |
| 43 | INTRN | output | Active-low interrupt output to the host CPU; requires an external 4.7 kΩ pull-up. |
| 44 | SPI_SCLK/MDC | input | SPI slave serial clock input in SPI mode, or MIIM MDC clock input in MIIM mode. |
| 45 | SPI_DI/MDIO | bidirectional | SPI slave serial data input in SPI mode, or MIIM MDIO data input/output; requires an external 4.7 kΩ pull-up. |
| 46 | GPIO8 | bidirectional | General purpose I/O 8 (internal pull-down), see GPIO0 pin 48 description. |
| 47 | GPIO11 | bidirectional | General purpose I/O 11 (internal pull-up), see GPIO0 pin 48 description. |
| 48 | GPIO0 | bidirectional | General purpose I/O 0 usable for IEEE 1588 event trigger or time stamp capture, synchronized to the internal 1588 clock and directly drivable or readable by the host. |
| 49 | GPIO1 | bidirectional | General purpose I/O 1 (internal pull-up), see GPIO0 pin 48 description. |
| 50 | DGND | power_in | Digital ground. |
| 51 | VDD_L | power_in | Low-voltage core connection: a low-voltage input when the internal regulator is not used, or the low-voltage output when it is used. |
| 52 | GPIO2 | bidirectional | General purpose I/O 2 (internal pull-up), see GPIO0 pin 48 description. |
| 53 | GPIO3 | bidirectional | General purpose I/O 3 (internal pull-down), see GPIO0 pin 48 description. |
| 54 | GPIO4 | bidirectional | General purpose I/O 4 (internal pull-down), see GPIO0 pin 48 description. |
| 55 | GPIO5 | bidirectional | General purpose I/O 5 (internal pull-down), see GPIO0 pin 48 description. |
| 56 | VDD_IO | power_in | 3.3 V, 2.5 V, or 1.8 V digital I/O supply, also the input to the internal low-voltage regulator. |
| 57 | DGND | power_in | Digital ground. |
| 58 | GPIO6 | bidirectional | General purpose I/O 6 (internal pull-up), see GPIO0 pin 48 description. |
| 59 | P1LED1/GPIO7_MLI | bidirectional | Programmable active-low LED output for port 1 activity/status (LED on when low); in RMII mode this pin is P1LED1. |
| 60 | P1LED0 | bidirectional | Programmable LED output for port 1 status, active low (LED on when low), with internal pull-up. |
| 61 | P2LED1/GPIO9_MLI | bidirectional | Programmable LED output for port 2 activity/status, active low; in RMII mode this pin is P2LED1. |
| 62 | P2LED0/GPIO10_MLI | bidirectional | Programmable LED output for port 2 status, active low; in RMII mode this pin is P2LED0. |
| 63 | RSTN | input | Active-low hardware reset input; must be held low for at least 10 ms after VDD_IO and 3.3 V are stable. |
| 64 | FXSD1 | input | Fiber signal detect input for port 1 in 100BASE-FX mode; must be pulled to GND in copper mode and is available only on KSZ8463FML/FRL. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | LQFP-64(10x10) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 64 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VDD_A3.3, VDD_IO) | -0.5 | 5 | V | 189 | |||
| Supply Voltage (VDD_AL, VDD_L) | -0.5 | 1.8 | V | 189 | |||
| Input Voltage (All Inputs) | -0.5 | 5 | V | 189 | |||
| Output Voltage (All Outputs) | -0.5 | 5 | V | 189 | |||
| Lead Temperature | 260 | °C | soldering, 10 s | 189 | |||
| Storage Temperature | TS | -65 | 150 | °C | 189 | ||
| Maximum Junction Temperature | TJ | 125 | °C | 189 | |||
| HBM ESD Rating | 2 | kV | HBM | 189 | |||
| Supply Voltage VDDA_3.3 | VDDA_3.3 | 3.135 | 3.465 | V | 189 | ||
| Supply Voltage VDD_L, VDD_AL, VDD_COL | VDD_L, VDD_AL, VDD_COL | 1.25 | 1.4 | V | 189 | ||
| Supply Voltage VDD_IO (3.3V) | VDD_IO | 3.135 | 3.465 | V | 3.3V I/O | 189 | |
| Supply Voltage VDD_IO (2.5V) | VDD_IO | 2.375 | 2.625 | V | 2.5V I/O | 189 | |
| Supply Voltage VDD_IO (1.8V) | VDD_IO | 1.71 | 1.89 | V | 1.8V I/O | 189 | |
| Ambient Operating Temperature (Industrial) | TA | -40 | 85 | °C | Industrial | 189 | |
| Reference crystal/oscillator clock frequency tolerance | -50 | 50 | ppm | 25 MHz on X1/X2 crystal or oscillator | 11 | ||
| CMOS Input High Voltage | VIH | 2.1 | V | VDD_IO = 3.3V | 191 | ||
| CMOS Input High Voltage | VIH | 1.7 | V | VDD_IO = 2.5V | 191 | ||
| CMOS Input High Voltage | VIH | 1.3 | V | VDD_IO = 1.8V | 191 | ||
| CMOS Input Low Voltage | VIL | 0.9 | V | VDD_IO = 3.3V | 191 | ||
| CMOS Input Low Voltage | VIL | 0.6 | V | VDD_IO = 1.8V | 191 | ||
| Input Current | IIN | -10 | 10 | µA | VIN = GND ~ VDD_IO | 191 | |
| X1 Crystal/Osc Input High Voltage | VIH | 2.1 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 191 | ||
| X1 Crystal/Osc Input Low Voltage | VIL | 0.9 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 191 | ||
| X1 Crystal/Osc Input Current | IIN | 10 | µA | 191 | |||
| PWRDN Input High Voltage | VIH | 1.1 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 191 | ||
| PWRDN Input Low Voltage | VIL | 0.3 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 192 | ||
| FXSD Input High Voltage | VIH | 2.1 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 192 | ||
| FXSD Input Low Voltage | VIL | 1.2 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 192 | ||
| CMOS Output High Voltage | VOH | 2.4 | V | IOH = -8 mA; VDD_IO = 3.3V | 192 | ||
| CMOS Output High Voltage | VOH | 1.9 | V | IOH = -8 mA; VDD_IO = 2.5V | 192 | ||
| CMOS Output High Voltage | VOH | 1.5 | V | IOH = -8 mA; VDD_IO = 1.8V | 192 | ||
| CMOS Output Low Voltage | VOL | 0.4 | V | VIOL = 8 mA; VDD_IO = 3.3V | 192 | ||
| CMOS Output Low Voltage | VOL | 0.2 | V | VIOL = 8 mA; VDD_IO = 1.8V | 192 | ||
| Output Tri-State Leakage | /IOZ/ | 10 | µA | 192 | |||
| 100BASE-TX Peak Differential Output Voltage | VO | 0.95 | 1.05 | V | 100Ω termination on the diff. output; printed ±0.95 / ±1.05 | 192 | |
| 100BASE-TX Output Voltage Imbalance | VIMB | 2 | % | 100Ω termination on the diff. output | 192 | ||
| 100BASE-TX Rise/Fall Time | tr/tf | 3 | 5 | ns | 192 | ||
| 100BASE-TX Rise/Fall Time Imbalance | 0 | 0.5 | ns | 192 | |||
| 100BASE-TX Duty Cycle Distortion | -0.25 | 0.25 | ns | 192 | |||
| 100BASE-TX Overshoot | 5 | % | 192 | ||||
| 100BASE-TX Output Jitter | 0.7 | 1.4 | ns | Peak-to-peak | 192 | ||
| 100BASE-TX Jitter Added | 3.5 | ns | 100Ω termination on the differential output (peak-to-peak) | 192 | |||
| 10BASE-T Peak Differential Output Voltage | VP | 2.2 | 2.5 | 2.8 | V | 100Ω termination on the differential output | 192 |
| 1.8V Pull-Up Resistance | R1.8PU | 57 | 100 | 187 | kΩ | VDD_IO = 1.8V | 192 |
| 1.8V Pull-Down Resistance | R1.8PD | 55 | 100 | 190 | kΩ | VDD_IO = 1.8V | 192 |
| 2.5V Pull-Up Resistance | R2.5PU | 37 | 59 | 102 | kΩ | VDD_IO = 2.5V | 192 |
| 2.5V Pull-Down Resistance | R2.5PD | 35 | 60 | 110 | kΩ | VDD_IO = 2.5V | 192 |
| 3.3V Pull-Up Resistance | R3.3PU | 29 | 43 | 70 | kΩ | VDD_IO = 3.3V | 192 |
| 3.3V Pull-Down Resistance | R3.3PD | 27 | 43 | 76 | kΩ | VDD_IO = 3.3V | 192 |
| ISET Resistor Tolerance | -1 | 1 | % | External ISET pull-down resistor (printed 1%) | 10 | ||
| ISET External Resistor | 6.49 | kΩ | Pull-down on ISET to ground | 10 | |||
| Crystal Effective Series Resistance | 50 | Ω | Typical reference crystal, 25 MHz | 205 | |||
| Junction-to-Ambient Thermal Resistance | ΘJA | 49 | °C/W | No heat spreader; 0 m/s air velocity | 189 | ||
| Junction-to-Case Thermal Resistance | ΘJC | 19 | °C/W | No heat spreader; 0 m/s air velocity | 189 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | In copper mode, and on the KSZ8463ML and KSZ8463RL, the FXSD pins are unused and should be pulled low. | 18 |
CAD (KiCad official)
- Symbol:
KSZ8463RLI - Footprint:
Package_QFP:LQFP-64_10x10mm_P0.5mm - 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files:
ksz8463rli-etched.step/ksz8463rli-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ksz8463rli.step/ksz8463rli.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (213 pp, sha256
6e2255020c924402, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).