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KSZ8463RLI

Microchip Tech · Interface - Specialized · LQFP-64(10x10)

KSZ8463RLI from Microchip Tech, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RXM1 bidirectional Port 1 physical receive (MDI) or transmit (MDI-X) signal, negative differential.
2 RXP1 bidirectional Port 1 physical receive (MDI) or transmit (MDI-X) signal, positive differential.
3 AGND power_in Analog ground.
4 TXM1 bidirectional Port 1 physical transmit (MDI) or receive (MDI-X) signal, negative differential.
5 TXP1 bidirectional Port 1 physical transmit (MDI) or receive (MDI-X) signal, positive differential.
6 VDD_AL power_in Low-voltage analog power input, to be filtered with a ferrite bead and capacitors.
7 ISET output Sets the PHY transmit output current; pull down with a 6.49 kΩ (1%) resistor to ground.
8 AGND power_in Analog ground.
9 VDD_A3.3 power_in 3.3 V analog VDD input power supply; must be well decoupled.
10 RXM2 bidirectional Port 2 physical receive (MDI) or transmit (MDI-X) signal, negative differential.
11 RXP2 bidirectional Port 2 physical receive (MDI) or transmit (MDI-X) signal, positive differential.
12 AGND power_in Analog ground.
13 TXM2 bidirectional Port 2 physical transmit (MDI) or receive (MDI-X) signal, negative differential.
14 TXP2 bidirectional Port 2 physical transmit (MDI) or receive (MDI-X) signal, positive differential.
15 FXSD2 input Fiber signal detect input for port 2 in 100BASE-FX mode; must be pulled to GND in copper mode and is available only on KSZ8463FML/FRL.
16 VDD_COL power_in Second low-voltage analog power input, to be filtered with a ferrite bead and capacitors.
17 PWRDN input Active-low full-chip power-down (low = power-down, high or floating = normal); while low, all I/O are tri-stated and registers return to default.
18 X1 input 25 MHz crystal or oscillator input with ±50 ppm clock requirement; on the KSZ8463RL it can instead take a 50 MHz REFCLK_I selected by pin 41 at power-up.
19 X2 output Crystal connection; left as no connect when an oscillator drives X1.
20 DGND power_in Digital ground.
21 VDD_IO power_in 3.3 V, 2.5 V, or 1.8 V digital I/O supply, also the input to the internal low-voltage regulator.
22 TX_EN input RMII transmit enable; active high indicates valid transmit data on TXD[1:0].
23 TXD3/EN_REFCLKO input In RMII mode, pulling this pin up enables the 50 MHz REFCLK_O output on pin 32 and pulling it down disables it.
24 TXD2/NC input No connect in RMII mode (not used).
25 TXD1 input RMII transmit data bit 1, synchronous to the 50 MHz REFCLK.
26 TXD0 input RMII transmit data bit 0, synchronous to the 50 MHz REFCLK.
27 TX_CLK/REFCLK_I bidirectional In RMII mode, the 50 MHz reference clock input (internal or external source).
28 TX_ER/MII_BP input No connect in RMII mode (not used).
29 DGND power_in Digital ground.
30 VDD_IO power_in 3.3 V, 2.5 V, or 1.8 V digital I/O supply, also the input to the internal low-voltage regulator.
31 RX_DV bidirectional RMII receive data valid, active high indicates RXD[1:0] is valid; the power-up pull-up/no-connect or pull-down level selects PHY or MAC MII mode in MII operation.
32 RXD3/REFCLK_O bidirectional In RMII mode, outputs the 50 MHz REFCLK_O clock when EN_REFCLKO (pin 23) is pulled up, with 16 mA drive.
33 RXD2 bidirectional Not used in RMII mode; at power-up/reset the pull-up/no-connect selects high-speed SPI (up to 50 MHz) and pull-down selects low-speed SPI (up to 12.5 MHz).
34 RXD1 bidirectional RMII receive data bit 1, synchronous to the 50 MHz REFCLK; latched with RXD0 at power-up to select the serial bus mode.
35 RXD0 bidirectional RMII receive data bit 0, synchronous to the 50 MHz REFCLK; latched with RXD1 at power-up to select the serial bus mode (default SPI slave).
36 CRS/GPIO9_RLI bidirectional In RMII mode this pin is GPIO9 (internal pull-down), see GPIO0 pin 48 description.
37 COL/GPIO10_RLI bidirectional In RMII mode this pin is GPIO10 (internal pull-down), see GPIO0 pin 48 description.
38 RX_CLK/GPIO7_RLI bidirectional In RMII mode this pin is GPIO7 (internal pull-down), see GPIO0 pin 48 description.
39 DGND power_in Digital ground.
40 VDD_L power_in Low-voltage core connection: a low-voltage input when the internal regulator is not used, or the low-voltage output when it is used.
41 SPI_DO bidirectional SPI slave data output (high-impedance when SPI_CSN is high); its power-up level selects 25 MHz from X1/X2 (pull-up) or 50 MHz from REFCLK_I (pull-down, KSZ8463RL/FRL only).
42 SPI_CSN input Active-low chip select for SPI slave mode; requires an external 4.7 kΩ pull-up when in use.
43 INTRN output Active-low interrupt output to the host CPU; requires an external 4.7 kΩ pull-up.
44 SPI_SCLK/MDC input SPI slave serial clock input in SPI mode, or MIIM MDC clock input in MIIM mode.
45 SPI_DI/MDIO bidirectional SPI slave serial data input in SPI mode, or MIIM MDIO data input/output; requires an external 4.7 kΩ pull-up.
46 GPIO8 bidirectional General purpose I/O 8 (internal pull-down), see GPIO0 pin 48 description.
47 GPIO11 bidirectional General purpose I/O 11 (internal pull-up), see GPIO0 pin 48 description.
48 GPIO0 bidirectional General purpose I/O 0 usable for IEEE 1588 event trigger or time stamp capture, synchronized to the internal 1588 clock and directly drivable or readable by the host.
49 GPIO1 bidirectional General purpose I/O 1 (internal pull-up), see GPIO0 pin 48 description.
50 DGND power_in Digital ground.
51 VDD_L power_in Low-voltage core connection: a low-voltage input when the internal regulator is not used, or the low-voltage output when it is used.
52 GPIO2 bidirectional General purpose I/O 2 (internal pull-up), see GPIO0 pin 48 description.
53 GPIO3 bidirectional General purpose I/O 3 (internal pull-down), see GPIO0 pin 48 description.
54 GPIO4 bidirectional General purpose I/O 4 (internal pull-down), see GPIO0 pin 48 description.
55 GPIO5 bidirectional General purpose I/O 5 (internal pull-down), see GPIO0 pin 48 description.
56 VDD_IO power_in 3.3 V, 2.5 V, or 1.8 V digital I/O supply, also the input to the internal low-voltage regulator.
57 DGND power_in Digital ground.
58 GPIO6 bidirectional General purpose I/O 6 (internal pull-up), see GPIO0 pin 48 description.
59 P1LED1/GPIO7_MLI bidirectional Programmable active-low LED output for port 1 activity/status (LED on when low); in RMII mode this pin is P1LED1.
60 P1LED0 bidirectional Programmable LED output for port 1 status, active low (LED on when low), with internal pull-up.
61 P2LED1/GPIO9_MLI bidirectional Programmable LED output for port 2 activity/status, active low; in RMII mode this pin is P2LED1.
62 P2LED0/GPIO10_MLI bidirectional Programmable LED output for port 2 status, active low; in RMII mode this pin is P2LED0.
63 RSTN input Active-low hardware reset input; must be held low for at least 10 ms after VDD_IO and 3.3 V are stable.
64 FXSD1 input Fiber signal detect input for port 1 in 100BASE-FX mode; must be pulled to GND in copper mode and is available only on KSZ8463FML/FRL.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package LQFP-64(10x10)
Category Communication Interface Chip/UART/485/232
Pins 64

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (VDD_A3.3, VDD_IO) -0.5 5 V 189
Supply Voltage (VDD_AL, VDD_L) -0.5 1.8 V 189
Input Voltage (All Inputs) -0.5 5 V 189
Output Voltage (All Outputs) -0.5 5 V 189
Lead Temperature 260 °C soldering, 10 s 189
Storage Temperature TS -65 150 °C 189
Maximum Junction Temperature TJ 125 °C 189
HBM ESD Rating 2 kV HBM 189
Supply Voltage VDDA_3.3 VDDA_3.3 3.135 3.465 V 189
Supply Voltage VDD_L, VDD_AL, VDD_COL VDD_L, VDD_AL, VDD_COL 1.25 1.4 V 189
Supply Voltage VDD_IO (3.3V) VDD_IO 3.135 3.465 V 3.3V I/O 189
Supply Voltage VDD_IO (2.5V) VDD_IO 2.375 2.625 V 2.5V I/O 189
Supply Voltage VDD_IO (1.8V) VDD_IO 1.71 1.89 V 1.8V I/O 189
Ambient Operating Temperature (Industrial) TA -40 85 °C Industrial 189
Reference crystal/oscillator clock frequency tolerance -50 50 ppm 25 MHz on X1/X2 crystal or oscillator 11
CMOS Input High Voltage VIH 2.1 V VDD_IO = 3.3V 191
CMOS Input High Voltage VIH 1.7 V VDD_IO = 2.5V 191
CMOS Input High Voltage VIH 1.3 V VDD_IO = 1.8V 191
CMOS Input Low Voltage VIL 0.9 V VDD_IO = 3.3V 191
CMOS Input Low Voltage VIL 0.6 V VDD_IO = 1.8V 191
Input Current IIN -10 10 µA VIN = GND ~ VDD_IO 191
X1 Crystal/Osc Input High Voltage VIH 2.1 V VDD_A3.3 = 3.3V, VDD_IO = any 191
X1 Crystal/Osc Input Low Voltage VIL 0.9 V VDD_A3.3 = 3.3V, VDD_IO = any 191
X1 Crystal/Osc Input Current IIN 10 µA 191
PWRDN Input High Voltage VIH 1.1 V VDD_A3.3 = 3.3V, VDD_IO = any 191
PWRDN Input Low Voltage VIL 0.3 V VDD_A3.3 = 3.3V, VDD_IO = any 192
FXSD Input High Voltage VIH 2.1 V VDD_A3.3 = 3.3V, VDD_IO = any 192
FXSD Input Low Voltage VIL 1.2 V VDD_A3.3 = 3.3V, VDD_IO = any 192
CMOS Output High Voltage VOH 2.4 V IOH = -8 mA; VDD_IO = 3.3V 192
CMOS Output High Voltage VOH 1.9 V IOH = -8 mA; VDD_IO = 2.5V 192
CMOS Output High Voltage VOH 1.5 V IOH = -8 mA; VDD_IO = 1.8V 192
CMOS Output Low Voltage VOL 0.4 V VIOL = 8 mA; VDD_IO = 3.3V 192
CMOS Output Low Voltage VOL 0.2 V VIOL = 8 mA; VDD_IO = 1.8V 192
Output Tri-State Leakage /IOZ/ 10 µA 192
100BASE-TX Peak Differential Output Voltage VO 0.95 1.05 V 100Ω termination on the diff. output; printed ±0.95 / ±1.05 192
100BASE-TX Output Voltage Imbalance VIMB 2 % 100Ω termination on the diff. output 192
100BASE-TX Rise/Fall Time tr/tf 3 5 ns 192
100BASE-TX Rise/Fall Time Imbalance 0 0.5 ns 192
100BASE-TX Duty Cycle Distortion -0.25 0.25 ns 192
100BASE-TX Overshoot 5 % 192
100BASE-TX Output Jitter 0.7 1.4 ns Peak-to-peak 192
100BASE-TX Jitter Added 3.5 ns 100Ω termination on the differential output (peak-to-peak) 192
10BASE-T Peak Differential Output Voltage VP 2.2 2.5 2.8 V 100Ω termination on the differential output 192
1.8V Pull-Up Resistance R1.8PU 57 100 187 kΩ VDD_IO = 1.8V 192
1.8V Pull-Down Resistance R1.8PD 55 100 190 kΩ VDD_IO = 1.8V 192
2.5V Pull-Up Resistance R2.5PU 37 59 102 kΩ VDD_IO = 2.5V 192
2.5V Pull-Down Resistance R2.5PD 35 60 110 kΩ VDD_IO = 2.5V 192
3.3V Pull-Up Resistance R3.3PU 29 43 70 kΩ VDD_IO = 3.3V 192
3.3V Pull-Down Resistance R3.3PD 27 43 76 kΩ VDD_IO = 3.3V 192
ISET Resistor Tolerance -1 1 % External ISET pull-down resistor (printed 1%) 10
ISET External Resistor 6.49 kΩ Pull-down on ISET to ground 10
Crystal Effective Series Resistance 50 Ω Typical reference crystal, 25 MHz 205
Junction-to-Ambient Thermal Resistance ΘJA 49 °C/W No heat spreader; 0 m/s air velocity 189
Junction-to-Case Thermal Resistance ΘJC 19 °C/W No heat spreader; 0 m/s air velocity 189

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper In copper mode, and on the KSZ8463ML and KSZ8463RL, the FXSD pins are unused and should be pulled low. 18

CAD (KiCad official)

  • Symbol: KSZ8463RLI
  • Footprint: Package_QFP:LQFP-64_10x10mm_P0.5mm
  • 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
  • 3D model files: ksz8463rli-etched.step / ksz8463rli-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ksz8463rli.step / ksz8463rli.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (213 pp, sha256 6e2255020c924402, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF