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Contents

README

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ADM1490EBRZ

Analog Devices · RS-485/RS-422 ICs · SOIC-8

ADM1490EBRZ from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Power supply, 5 V ± 5%.
2 RO output Receiver output.
3 DI input When the driver is enabled, a logic low on DI forces pin A low and pin B high, whereas a logic high on DI forces pin A high and pin B low.
4 GND power_in Ground.
5 Y output Noninverting driver output Y.
6 Z output Inverting driver output Z.
7 B input Inverting receiver input B.
8 A input Noninverting receiver input A.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-8
Category Communication Interface Chip/UART/485/232
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply current, outputs enabled ICC1 1.2 2 mA Outputs unloaded, digital inputs = VCC or GND 3
Supply current, outputs disabled ICC2 0.8 1.5 mA Outputs unloaded, digital inputs = VCC or GND 3
Differential output voltage, loaded (RS-422) /VOD2/ 2 5 V RL = 100 Ω (RS-422), see Figure 21 3
Differential output voltage, loaded (RS-485) /VOD2/ 1.5 5 V RL = 54 Ω (RS-485), see Figure 21 3
Differential output voltage, common-mode range /VOD3/ 1.5 5 V −7 V ≤ VTEST ≤ +12 V, see Figure 22 3
Change in differential output voltage for complementary output states ∆/VOD2/ 0.2 V RL = 54 Ω or 100 Ω, see Figure 21 3
Common-mode output voltage VOC 3 V RL = 54 Ω or 100 Ω, see Figure 21 3
Change in common-mode output voltage for complementary output states ∆/VOC/ 0.2 V RL = 54 Ω or 100 Ω, see Figure 21 3
Output leakage current (Y, Z), high IO 100 µA DE = 0 V, VDD = 0 V or 5 V, VIN = 12 V 3
Output leakage current (Y, Z), low IO -100 µA DE = 0 V, VDD = 0 V or 5 V, VIN = −7 V 3
Output short-circuit current IOS 250 mA −7 V < VOUT < +12 V 3
Input low voltage (DE, RE, DI) VIL 0.8 V DE, RE, DI 3
Input high voltage (DE, RE, DI) VIH 2 V DE, RE, DI 3
Input current (DE, RE, DI) II -1 1 µA DE, RE, DI 3
Differential input threshold voltage VTH -0.2 0.2 V −7 V < VCM < +12 V 3
Input current (A, B) at high common-mode II 1 mA VCM = 12 V 3
Input current (A, B) at low common-mode II -0.8 mA VCM = −7 V 3
Line input resistance RIN 12 30 kΩ −7 V ≤ VCM ≤ +12 V 3
Output voltage low (receiver) VOL 0.4 V IOUT = +4.0 mA, VA − VB = −0.2 V 3
Output voltage high (receiver) VOH 4 V IOUT = −4.0 mA, VA − VB = +0.2 V 3
Short-circuit current (receiver output) 85 mA 3
Three-state output leakage current (RO) IOZR -1 1 µA VCC = 5.25 V, 0.4 V < VOUT < 2.4 V 3
Maximum data rate 16 Mbps 4
Driver propagation delay tDPLH, tDPHL 11 17 ns RL = 54 Ω, CL = 100 pF, see Figure 23 and Figure 3 4
Driver output skew tSKEW 0.5 2 ns RL = 54 Ω, CL = 100 pF, see Figure 23 and Figure 3, tSKEW = /tDPLH − tDPHL/ 4
Driver rise time / fall time tDR, tDF 8 15 ns RL = 54 Ω, CL = 100 pF, see Figure 23 and Figure 3 4
Driver enable time tZH, tZL 20 ns RL = 110 Ω, CL = 50 pF, see Figure 24 and Figure 5 4
Driver disable time tHZ, tLZ 20 ns RL = 110 Ω, CL = 50 pF, see Figure 24 and Figure 5 4
Receiver propagation delay tPLH, tPHL 12 20 ns CL = 15 pF, see Figure 25 and Figure 4 4
Receiver skew tSKEW 0.4 2 ns CL = 15 pF, see Figure 25 and Figure 4 4
Receiver enable time tZH, tZL 13 ns RL = 1 kΩ, CL = 15 pF, see Figure 26 and Figure 6 4
Receiver disable time tHZ, tLZ 13 ns RL = 1 kΩ, CL = 15 pF, see Figure 26 and Figure 6 4
Recommended supply voltage VCC 4.75 5.25 V All min/max specifications apply over the entire recommended operating range 3
VCC to GND VCC -0.3 7 V 5
Digital I/O voltage (DE, RE) -0.3 V 5
Driver input voltage (DI) -0.3 V 5
Receiver output voltage (RO) -0.3 V 5
Driver output / receiver input voltage (A, B, Y, Z) -9 14 V 5
Operating temperature range TA -40 85 °C 5
Storage temperature range TSTG -55 150 °C 5
ESD (HBM) on A, B, Y, and Z -8 8 kV 5
Thermal resistance, junction to ambient, 8-lead SOIC θJA 121 °C/W Worst-case; device soldered in circuit board, surface-mount package 5

CAD (KiCad official)

  • Symbol: ADM1490EBRZ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: adm1490ebrz-etched.step / adm1490ebrz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm1490ebrz.step / adm1490ebrz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (16 pp, sha256 74a5d8439f987121, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF