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ADM1490EBRZ

Analog Devices · RS-485/RS-422 ICs · SOIC-8

ADM1490EBRZ from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VCC	power_in	Power supply, 5 V ± 5%.
2	RO	output	Receiver output.
3	DI	input	When the driver is enabled, a logic low on DI forces pin A low and pin B high, whereas a logic high on DI forces pin A high and pin B low.
4	GND	power_in	Ground.
5	Y	output	Noninverting driver output Y.
6	Z	output	Inverting driver output Z.
7	B	input	Inverting receiver input B.
8	A	input	Noninverting receiver input A.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	SOIC-8
Category	Communication Interface Chip/UART/485/232
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply current, outputs enabled	ICC1		1.2	2	mA	Outputs unloaded, digital inputs = VCC or GND	3
Supply current, outputs disabled	ICC2		0.8	1.5	mA	Outputs unloaded, digital inputs = VCC or GND	3
Differential output voltage, loaded (RS-422)	/VOD2/	2		5	V	RL = 100 Ω (RS-422), see Figure 21	3
Differential output voltage, loaded (RS-485)	/VOD2/	1.5		5	V	RL = 54 Ω (RS-485), see Figure 21	3
Differential output voltage, common-mode range	/VOD3/	1.5		5	V	−7 V ≤ VTEST ≤ +12 V, see Figure 22	3
Change in differential output voltage for complementary output states	∆/VOD2/			0.2	V	RL = 54 Ω or 100 Ω, see Figure 21	3
Common-mode output voltage	VOC			3	V	RL = 54 Ω or 100 Ω, see Figure 21	3
Change in common-mode output voltage for complementary output states	∆/VOC/			0.2	V	RL = 54 Ω or 100 Ω, see Figure 21	3
Output leakage current (Y, Z), high	IO			100	µA	DE = 0 V, VDD = 0 V or 5 V, VIN = 12 V	3
Output leakage current (Y, Z), low	IO	-100			µA	DE = 0 V, VDD = 0 V or 5 V, VIN = −7 V	3
Output short-circuit current	IOS			250	mA	−7 V < VOUT < +12 V	3
Input low voltage (DE, RE, DI)	VIL			0.8	V	DE, RE, DI	3
Input high voltage (DE, RE, DI)	VIH	2			V	DE, RE, DI	3
Input current (DE, RE, DI)	II	-1		1	µA	DE, RE, DI	3
Differential input threshold voltage	VTH	-0.2		0.2	V	−7 V < VCM < +12 V	3
Input current (A, B) at high common-mode	II			1	mA	VCM = 12 V	3
Input current (A, B) at low common-mode	II	-0.8			mA	VCM = −7 V	3
Line input resistance	RIN	12		30	kΩ	−7 V ≤ VCM ≤ +12 V	3
Output voltage low (receiver)	VOL			0.4	V	IOUT = +4.0 mA, VA − VB = −0.2 V	3
Output voltage high (receiver)	VOH	4			V	IOUT = −4.0 mA, VA − VB = +0.2 V	3
Short-circuit current (receiver output)				85	mA		3
Three-state output leakage current (RO)	IOZR	-1		1	µA	VCC = 5.25 V, 0.4 V < VOUT < 2.4 V	3
Maximum data rate				16	Mbps		4
Driver propagation delay	tDPLH, tDPHL		11	17	ns	RL = 54 Ω, CL = 100 pF, see Figure 23 and Figure 3	4
Driver output skew	tSKEW		0.5	2	ns	RL = 54 Ω, CL = 100 pF, see Figure 23 and Figure 3, tSKEW = /tDPLH − tDPHL/	4
Driver rise time / fall time	tDR, tDF		8	15	ns	RL = 54 Ω, CL = 100 pF, see Figure 23 and Figure 3	4
Driver enable time	tZH, tZL			20	ns	RL = 110 Ω, CL = 50 pF, see Figure 24 and Figure 5	4
Driver disable time	tHZ, tLZ			20	ns	RL = 110 Ω, CL = 50 pF, see Figure 24 and Figure 5	4
Receiver propagation delay	tPLH, tPHL		12	20	ns	CL = 15 pF, see Figure 25 and Figure 4	4
Receiver skew	tSKEW		0.4	2	ns	CL = 15 pF, see Figure 25 and Figure 4	4
Receiver enable time	tZH, tZL			13	ns	RL = 1 kΩ, CL = 15 pF, see Figure 26 and Figure 6	4
Receiver disable time	tHZ, tLZ			13	ns	RL = 1 kΩ, CL = 15 pF, see Figure 26 and Figure 6	4
Recommended supply voltage	VCC	4.75		5.25	V	All min/max specifications apply over the entire recommended operating range	3
VCC to GND	VCC	-0.3		7	V		5
Digital I/O voltage (DE, RE)		-0.3			V		5
Driver input voltage (DI)		-0.3			V		5
Receiver output voltage (RO)		-0.3			V		5
Driver output / receiver input voltage (A, B, Y, Z)		-9		14	V		5
Operating temperature range	TA	-40		85	°C		5
Storage temperature range	TSTG	-55		150	°C		5
ESD (HBM) on A, B, Y, and Z		-8		8	kV		5
Thermal resistance, junction to ambient, 8-lead SOIC	θJA			121	°C/W	Worst-case; device soldered in circuit board, surface-mount package	5

CAD (KiCad official)

Symbol: ADM1490EBRZ
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: adm1490ebrz-etched.step / adm1490ebrz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm1490ebrz.step / adm1490ebrz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (16 pp, sha256 74a5d8439f987121, retrieved 2026-10-29, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF