component
HYG200P10LR1B
Public Made by Adomby adom
HUAYI MOSFETs, TO-263-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHYG200P10LR1B
HUAYI · MOSFETs · TO-263-2L
HYG200P10LR1B from HUAYI, in a TO-263-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage is limited to ±20 V (VGSS), with threshold of -1 V min to -3 V max at IDS = -250 µA. |
| 2 | D | passive | Drain, brought out on the exposed tab (middle lead position absent); rated -100 V VDSS and -80 A continuous at Tc=25°C. |
| 3 | S | passive | Source; continuous body-diode source current is -80 A at Tc=25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUAYI |
| Package | TO-263-2L |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | -100 | V | 2 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 2 | ||
| Maximum Junction Temperature | TJ | 175 | °C | 2 | |||
| Storage Temperature Range | TSTG | -55 | 175 | °C | 2 | ||
| Source Current-Continuous (Body Diode) | IS | -80 | A | Tc=25°C | 2 | ||
| Pulsed Drain Current | IDM | -230 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | -80 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | -56.6 | A | Tc=100°C | 2 | ||
| Maximum Power Dissipation | PD | 214 | W | Tc=25°C | 2 | ||
| Maximum Power Dissipation | PD | 107 | W | Tc=100°C | 2 | ||
| Thermal Resistance, Junction-to-Case | RJC | 0.7 | °C/W | 2 | |||
| Thermal Resistance, Junction-to-Ambient | RJA | 62.5 | °C/W | Surface mounted on 1in2 FR-4 board | 2 | ||
| Single Pulsed Avalanche Energy | EAS | 308 | mJ | L=0.3mH | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | -100 | V | VGS=0V,IDS= -250μA | 2 | ||
| Drain-to-Source Leakage Current | IDSS | -1 | μA | VDS= -100V,VGS=0V | 2 | ||
| Drain-to-Source Leakage Current | IDSS | -50 | μA | TJ=125°C | 2 | ||
| Gate Threshold Voltage | VGS(th) | -1 | -1.8 | -3 | V | VDS=VGS, IDS= -250μA | 2 |
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V,VDS=0V | 2 | |
| Drain-Source On-State Resistance | RDS(ON) | 20 | 28 | mΩ | VGS= -10V,IDS= -40A | 2 | |
| Drain-Source On-State Resistance | RDS(ON) | 24 | 32 | mΩ | VGS= -4.5V,IDS=-40A | 2 | |
| Diode Forward Voltage | VSD | -0.86 | -1.3 | V | ISD= -40A,VGS=0V | 2 |
CAD (KiCad official)
- Symbol:
HYG200P10LR1B - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: TO-263-2L (KiCad packages3D, STEP)
- 3D model files:
hyg200p10lr1b-etched.step/hyg200p10lr1b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hyg200p10lr1b.step/hyg200p10lr1b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HUAYI datasheet (10 pp, sha256
4b47e075e703b8d0, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).