component
HX2300A
Public Made by Adomby adom
HX hengjiaxing MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHX2300A
HX hengjiaxing · MOSFETs · SOT-23
HX2300A from HX hengjiaxing, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the MOSFET; the absolute maximum gate-source voltage VGS is ±12 V. |
| 2 | S | passive | Source of the MOSFET; the continuous source (diode conduction) current IS is rated at 0.6 A. |
| 3 | D | passive | Drain of the MOSFET; the drain-source voltage VDS is rated at 20 V with a continuous drain current ID of 2.5 A at TA=25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HX hengjiaxing |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 20 | V | 1 | |||
| Gate-source voltage | VGS | -12 | 12 | V | 1 | ||
| Continuous drain current | ID | 2.5 | A | TJ = 150 °C, TA=25°C | 1 | ||
| Continuous drain current | ID | 2 | A | TJ = 150 °C, TA=70°C | 1 | ||
| Pulsed drain current | IDM | 10 | A | Pulse width limited by maximum junction temperature | 1 | ||
| Continuous source current (diode conduction) | IS | 0.6 | A | 1 | |||
| Power dissipation | PD | 0.71 | W | TA=25°C | 1 | ||
| Power dissipation | PD | 0.46 | W | TA=70°C | 1 | ||
| Operating junction and storage temperature range | TJ, Tstg | -55 | 150 | ℃ | 1 | ||
| Maximum junction-to-ambient thermal resistance | RθJA | 120 | 145 | ℃/W | ≤ 5 s; surface mounted on 1" x 1" FR4 board | 2 | |
| Maximum junction-to-ambient thermal resistance | RθJA | 140 | 175 | ℃/W | Steady-State; surface mounted on 1" x 1" FR4 board | 2 | |
| Maximum junction-to-foot thermal resistance | RθJC | 62 | 78 | ℃/W | Steady-State | 2 | |
| Drain-source breakdown voltage | BVDSS | 20 | V | VGS=0V, ID=250µA | 2 | ||
| Zero gate voltage drain current | IDSS | 1 | µA | VDS=20V, VGS=0V | 2 | ||
| Gate-body leakage | IGSS | -100 | 100 | nA | VDS=0V, VGS=±12V | 2 | |
| Gate threshold voltage | VGS(th) | 0.5 | 0.65 | 1 | V | VDS=VGS, ID=250µA | 2 |
| Drain-source on-state resistance | RDS(ON) | 46 | 60 | mΩ | VGS=4.5V, ID=2.5A | 2 | |
| Drain-source on-state resistance | RDS(ON) | 61 | 85 | mΩ | VGS=2.5V, ID=1A | 2 | |
| Diode forward voltage | VSD | 0.76 | 1.16 | V | VGS=0V, Is=2.5A | 2 |
CAD (KiCad official)
- Symbol:
HX2300A - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
hx2300a-etched.step/hx2300a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hx2300a.step/hx2300a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HX hengjiaxing datasheet (6 pp, sha256
bbc07dc847ba9767, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).