main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 17d ago
viewers hx2300a: viewers · Ray 17d ago
hx2300a-etched.glb Publish 0.1.0 · Ray 17d ago
hx2300a-etched.step hx2300a: factory component page (tier=lcsc) · Ray 17d ago
hx2300a-hero.glb hx2300a: hero GLB from the etched model (keeps the MPN mark) · Ray 17d ago
hx2300a-hero.overlay.json Publish 0.1.0 · Ray 17d ago
hx2300a.glb Publish 0.1.0 · Ray 17d ago
hx2300a.kicad_mod Publish 0.1.0 · Ray 17d ago
hx2300a.kicad_sym Publish 0.1.0 · Ray 17d ago
hx2300a.lbr Publish 0.1.0 · Ray 17d ago
hx2300a.step Publish 0.1.0 · Ray 17d ago
package.json Publish 0.1.0 · Ray 17d ago
page.json Set visibility: public · Ray 17d ago
README.md Publish 0.1.0 · Ray 17d ago

HX2300A

HX hengjiaxing · MOSFETs · SOT-23

HX2300A from HX hengjiaxing, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the MOSFET; the absolute maximum gate-source voltage VGS is ±12 V.
2 S passive Source of the MOSFET; the continuous source (diode conduction) current IS is rated at 0.6 A.
3 D passive Drain of the MOSFET; the drain-source voltage VDS is rated at 20 V with a continuous drain current ID of 2.5 A at TA=25°C.

Key specifications

Parameter Value
Manufacturer HX hengjiaxing
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 20 V 1
Gate-source voltage VGS -12 12 V 1
Continuous drain current ID 2.5 A TJ = 150 °C, TA=25°C 1
Continuous drain current ID 2 A TJ = 150 °C, TA=70°C 1
Pulsed drain current IDM 10 A Pulse width limited by maximum junction temperature 1
Continuous source current (diode conduction) IS 0.6 A 1
Power dissipation PD 0.71 W TA=25°C 1
Power dissipation PD 0.46 W TA=70°C 1
Operating junction and storage temperature range TJ, Tstg -55 150 ℃ 1
Maximum junction-to-ambient thermal resistance RθJA 120 145 ℃/W ≤ 5 s; surface mounted on 1" x 1" FR4 board 2
Maximum junction-to-ambient thermal resistance RθJA 140 175 ℃/W Steady-State; surface mounted on 1" x 1" FR4 board 2
Maximum junction-to-foot thermal resistance RθJC 62 78 ℃/W Steady-State 2
Drain-source breakdown voltage BVDSS 20 V VGS=0V, ID=250µA 2
Zero gate voltage drain current IDSS 1 µA VDS=20V, VGS=0V 2
Gate-body leakage IGSS -100 100 nA VDS=0V, VGS=±12V 2
Gate threshold voltage VGS(th) 0.5 0.65 1 V VDS=VGS, ID=250µA 2
Drain-source on-state resistance RDS(ON) 46 60 mΩ VGS=4.5V, ID=2.5A 2
Drain-source on-state resistance RDS(ON) 61 85 mΩ VGS=2.5V, ID=1A 2
Diode forward voltage VSD 0.76 1.16 V VGS=0V, Is=2.5A 2

CAD (KiCad official)

  • Symbol: HX2300A
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: hx2300a-etched.step / hx2300a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx2300a.step / hx2300a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HX hengjiaxing datasheet (6 pp, sha256 bbc07dc847ba9767, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF