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Contents

README

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DMN2024U-13

Diodes Incorporated · MOSFETs · SOT-23-3

DMN2024U-13 from Diodes Incorporated, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 G input Gate, ESD-protected through an internal gate protection diode with a 22K resistor; VGSS rating is ±10 V and threshold is 0.5 to 0.9 V at ID = 250µA.
2 S passive Source terminal; the body diode conducts from source to drain with a maximum continuous forward current of 2.2 A.
3 D passive Drain terminal; drain-source voltage rating is 20 V with continuous drain current up to 6.8 A at TA = +25°C and VGS = 4.5V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 20 V VGS = 0V, ID = 250µA 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 20V, VGS = 0V, TJ = +25°C 2
Gate-Source Leakage IGSS 10 µA VGS = ±8V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) 0.5 0.9 V VDS = VGS, ID = 250µA 2
Static Drain-Source On-Resistance RDS(ON) 16 25 mΩ VGS = 4.5V, ID = 6.5A 2
Static Drain-Source On-Resistance RDS(ON) 18.5 29 mΩ VGS = 2.5V, ID = 5.5A 2
Static Drain-Source On-Resistance RDS(ON) 23 36 mΩ VGS = 1.8V, ID = 3.5A 2
Diode Forward Voltage VSD 0.8 1.2 V VGS = 0V, ID = 5A 2
Drain-Source Voltage VDSS 20 V TA = +25°C 2
Gate-Source Voltage VGSS -10 10 V TA = +25°C 2
Continuous Drain Current ID 6.8 A VGS = 4.5V, Steady State, TA = +25°C, Note 6 2
Continuous Drain Current ID 5.5 A VGS = 4.5V, Steady State, TA = +70°C, Note 6 2
Maximum Continuous Body Diode Forward Current IS 2.2 A Note 6 2
Pulsed Drain Current IDM 45 A 10µs pulse, duty cycle = 1% 2
Total Power Dissipation PD 0.8 W Note 5, minimum recommended pad layout 2
Total Power Dissipation PD 1.4 W Note 6, 1"x1" FR-4 PCB 2oz copper 2
Thermal Resistance, Junction to Ambient RθJA 159 °C/W Steady State, Note 5 2
Thermal Resistance, Junction to Ambient RθJA 92 °C/W Steady State, Note 6 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Input Capacitance Ciss 647 pF VDS = 10V, VGS = 0V, f = 1.0MHz 2
Output Capacitance Coss 78 pF VDS = 10V, VGS = 0V, f = 1.0MHz 2
Reverse Transfer Capacitance Crss 38 pF VDS = 10V, VGS = 0V, f = 1.0MHz 2
Gate Resistance Rg 628 Ω VDS = 0V, VGS = 0V, f = 1MHz 2
Total Gate Charge Qg 7.1 nC VGS = 4.5V, VDS = 10V, ID = 6.5A 2
Gate-Source Charge Qgs 0.9 nC VGS = 4.5V, VDS = 10V, ID = 6.5A 2
Gate-Drain Charge Qgd 0.7 nC VGS = 4.5V, VDS = 10V, ID = 6.5A 2
Turn-On Delay Time tD(ON) 98 ns VDS = 10V, VGS = 4.5V, RL = 10Ω, RG = 6Ω, ID = 1A 2
Turn-On Rise Time tR 140 ns VDS = 10V, VGS = 4.5V, RL = 10Ω, RG = 6Ω, ID = 1A 2
Turn-Off Delay Time tD(OFF) 1024 ns VDS = 10V, VGS = 4.5V, RL = 10Ω, RG = 6Ω, ID = 1A 2
Turn-Off Fall Time tF 434 ns VDS = 10V, VGS = 4.5V, RL = 10Ω, RG = 6Ω, ID = 1A 2
Reverse Recovery Time tRR 245 ns IF = 1.0A, di/dt = 100A/µs 2
Reverse Recovery Charge QRR 149 nC IF = 1.0A, di/dt = 100A/µs 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin • Terminals: FinishMatte Tin Annealed over Copper Leadframe. 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: DMN2024U-13
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.025 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: dmn2024u-13-etched.step / dmn2024u-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmn2024u-13.step / dmn2024u-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 6c5c4746041ac5af, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF