component
HSU55N02
Public Made by Adomby adom
HUASHUO MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHSU55N02
HUASHUO · MOSFETs · TO-252
HSU55N02 from HUASHUO, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage is rated ±12 V max, with threshold VGS(th) of 0.5 to 0.9 V at ID=250uA. |
| 2 | D | passive | Drain, connected to the tab; VDS is rated 20 V and continuous drain current is 55 A at TC=25°C. |
| 3 | S | passive | Source; continuous source (body diode) current is 55 A max. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUASHUO |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 20 | V | 1 | |||
| Gate-Source Voltage | VGS | -12 | 12 | V | 1 | ||
| Continuous Drain Current, TC=25℃ | ID | 55 | A | VGS @ 10V | 1 | ||
| Continuous Drain Current, TC=100℃ | ID | 40 | A | VGS @ 10V | 1 | ||
| Pulsed Drain Current | IDM | 220 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 135 | mJ | 1 | |||
| Total Power Dissipation, TC=25℃ | PD | 29 | W | TC=25℃ | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction-ambient (Steady State) | RθJA | 62 | ℃/W | Steady State | 1 | ||
| Thermal Resistance Junction-Case | RθJC | 4 | ℃/W | 1 | |||
| Drain-Source Breakdown Voltage | BVDSS | 20 | V | VGS=0V, ID=250uA | 2 | ||
| BVDSS Temperature Coefficient | △BVDSS/△TJ | 0.028 | V/℃ | Reference to 25℃, ID=1mA | 2 | ||
| Static Drain-Source On-Resistance, VGS=4.5V | RDS(ON) | 5.3 | 7 | mΩ | VGS=4.5V, ID=20A | 2 | |
| Static Drain-Source On-Resistance, VGS=2.5V | RDS(ON) | 6.5 | 8.6 | mΩ | VGS=2.5V, ID=15A | 2 | |
| Gate Threshold Voltage | VGS(th) | 0.5 | 0.9 | V | VGS=VDS, ID=250uA | 2 | |
| VGS(th) Temperature Coefficient | △VGS(th) | -6.16 | mV/℃ | 2 | |||
| Drain-Source Leakage Current, TJ=25℃ | IDSS | 1 | uA | VDS=20V, VGS=0V, TJ=25℃ | 2 | ||
| Drain-Source Leakage Current, TJ=55℃ | IDSS | 5 | uA | VDS=20V, VGS=0V, TJ=55℃ | 2 | ||
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±12V, VDS=0V | 2 | |
| Forward Transconductance | gfs | 10 | S | VDS=10V, ID=20A | 2 | ||
| Gate Resistance | Rg | 1.2 | VDS=0V, VGS=0V, f=1MHz | 2 | |||
| Total Gate Charge (4.5V) | Qg | 23 | nC | VDS=20V, VGS=10V, ID=20A | 2 | ||
| Gate-Source Charge | Qgs | 4.5 | nC | VDS=20V, VGS=10V, ID=20A | 2 | ||
| Gate-Drain Charge | Qgd | 7.5 | nC | VDS=20V, VGS=10V, ID=20A | 2 | ||
| Turn-On Delay Time | Td(on) | 15 | ns | VDD=10V, VGS=4.5V, RG=3.3, ID=15A | 2 | ||
| Rise Time | Tr | 33 | ns | VDD=10V, VGS=4.5V, RG=3.3, ID=15A | 2 | ||
| Turn-Off Delay Time | Td(off) | 44 | ns | VDD=10V, VGS=4.5V, RG=3.3, ID=15A | 2 | ||
| Fall Time | Tf | 95 | ns | VDD=10V, VGS=4.5V, RG=3.3, ID=15A | 2 | ||
| Input Capacitance | Ciss | 2250 | pF | VDS=10V, VGS=0V, f=1MHz | 2 | ||
| Output Capacitance | Coss | 200 | pF | VDS=10V, VGS=0V, f=1MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 125 | pF | VDS=10V, VGS=0V, f=1MHz | 2 | ||
| Continuous Source Current | IS | 55 | A | VG=VD=0V, Force Current | 2 | ||
| Pulsed Source Current | ISM | 220 | A | VG=VD=0V, Force Current | 2 | ||
| Diode Forward Voltage | VSD | 1 | V | VGS=0V, IS=20A, TJ=25℃ | 2 | ||
| Reverse Recovery Time | trr | 12 | nS | IF=20A, dI/dt=100A/µs, TJ=25℃ | 2 | ||
| Reverse Recovery Charge | Qrr | 2.6 | nC | IF=20A, dI/dt=100A/µs, TJ=25℃ | 2 |
CAD (KiCad official)
- Symbol:
HSU55N02 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
hsu55n02-etched.step/hsu55n02-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsu55n02.step/hsu55n02.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HUASHUO datasheet (5 pp, sha256
6c47da6cac4eb9fc, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).