Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SMUN5211DW1T1G

onsemi · Digital Transistors · SOT-363

SMUN5211DW1T1G from onsemi, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E2 passive Emitter of Q2, connected to the Q2 base through the R2 base-emitter resistor (10 kΩ).
2 B2 input Base (input) of Q2 through the series base resistor R1 (10 kΩ), with input forward voltage max 40 Vdc and input reverse voltage max 10 Vdc.
3 C1 passive Collector of Q1, with VCEO max 50 Vdc, VCBO max 50 Vdc and continuous IC max 100 mAdc.
4 E1 passive Emitter of Q1, connected to the Q1 base through the R2 base-emitter resistor (10 kΩ).
5 B1 input Base (input) of Q1 through the series base resistor R1 (10 kΩ), with input forward voltage max 40 Vdc and input reverse voltage max 10 Vdc.
6 C2 passive Collector of Q2, with VCEO max 50 Vdc, VCBO max 50 Vdc and continuous IC max 100 mAdc.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-363
Category Transistors/Thyristors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-Base Cutoff Current ICBO 100 nAdc VCB = 50 V, IE = 0 3
Collector-Emitter Cutoff Current ICEO 500 nAdc VCE = 50 V, IB = 0 3
Emitter-Base Cutoff Current IEBO 0.5 mAdc VEB = 6.0 V, IC = 0 3
Collector-Base Breakdown Voltage V(BR)CBO 50 Vdc IC = 10 A, IE = 0 3
Collector-Emitter Breakdown Voltage V(BR)CEO 50 Vdc IC = 2.0 mA, IB = 0 3
DC Current Gain hFE 35 60 IC = 5.0 mA, VCE = 10 V 3
Collector-Emitter Saturation Voltage VCE(sat) 0.25 V IC = 10 mA, IB = 0.3 mA 3
Output Voltage (On) VOL 0.2 Vdc VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k 3
Output Voltage (Off) VOH 4.9 Vdc VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k 3
Input Resistor R1 R1 7 10 13 k 3
Resistor Ratio R1/R2 R1/R2 0.8 1 1.2 3
Collector-Base Voltage VCBO 50 Vdc 1
Collector-Emitter Voltage VCEO 50 Vdc 1
Collector Current - Continuous IC 100 mAdc 1
Input Forward Voltage VIN(fwd) 40 Vdc 1
Input Reverse Voltage VIN(rev) 10 Vdc 1
Total Device Dissipation, one junction heated PD 187 mW ONE JUNCTION HEATED; TA = 25°C (Note 1) 2
Total Device Dissipation, one junction heated PD 256 mW ONE JUNCTION HEATED; TA = 25°C (Note 2) 2
Derate above 25°C, one junction heated 1.5 mW/°C ONE JUNCTION HEATED (Note 1) 2
Derate above 25°C, one junction heated 2 mW/°C ONE JUNCTION HEATED (Note 2) 2
Thermal Resistance, Junction to Ambient, one junction heated RJA 670 °C/W ONE JUNCTION HEATED (Note 1) 2
Thermal Resistance, Junction to Ambient, one junction heated RJA 490 °C/W ONE JUNCTION HEATED (Note 2) 2
Total Device Dissipation, both junctions heated PD 250 mW BOTH JUNCTION HEATED; TA = 25°C (Note 1) 2
Total Device Dissipation, both junctions heated PD 385 mW BOTH JUNCTION HEATED; TA = 25°C (Note 2) 2
Derate above 25°C, both junctions heated 2 mW/°C BOTH JUNCTION HEATED (Note 1) 2
Derate above 25°C, both junctions heated 3 mW/°C BOTH JUNCTION HEATED (Note 2) 2
Thermal Resistance, Junction to Ambient, both junctions heated RJA 493 °C/W BOTH JUNCTION HEATED (Note 1) 2
Thermal Resistance, Junction to Ambient, both junctions heated RJA 325 °C/W BOTH JUNCTION HEATED (Note 2) 2
Thermal Resistance, Junction to Lead, both junctions heated RJL 188 °C/W BOTH JUNCTION HEATED (Note 1) 2
Thermal Resistance, Junction to Lead, both junctions heated RJL 208 °C/W BOTH JUNCTION HEATED (Note 2) 2
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2

CAD (KiCad official)

  • Symbol: SMUN5211DW1T1G
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: smun5211dw1t1g-etched.step / smun5211dw1t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smun5211dw1t1g.step / smun5211dw1t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 8577f826838ffa78, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF